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| Part Number: | XC2VP50-6FFG1517C |
|---|---|
| Manufacturer/Brand: | AMD Xilinx |
| Part of Description: | IC FPGA 852 I/O 1517FCBGA |
| Datasheets: |
|
| RoHs Status: | Lead free / RoHS Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $2,589.6427 |
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Voltage - Breakdown | 1517-FCBGA (40x40) |
| Total RAM Bits | 53136 |
| Standard Package | 1 |
| Shell Style | 1.425 V ~ 1.575 V |
| Series | Virtex®-II Pro |
| Polarization | 1517-BBGA, FCBGA |
| Part Status | Active |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Product Attribute | Attribute Value |
|---|---|
| Number of Logic Elements/Cells | 5904 |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Manufacturer Standard Lead Time | 6 Weeks |
| Manufacturer Part Number | XC2VP50-6FFG1517C |
| Description | IC FPGA 852 I/O 1517FCBGA |
| Core Type | 4276224 |
| Clock Rate | 852 |




XC2VP50-6FFG1517C
AMD Xilinx. Y-IC is a quality distributor for AMD Xilinx and we are committed to providing you with authentic parts, fast service, and reliable supply for your project needs.
Virtex-II Pro series FPGA in a 1517-ball FCBGA package with up to 852 user I/O. Commercial-grade operating range 0°C to 85°C (TJ). Surface-mount device, RoHS lead-free. Speed grade -6. Core voltage range 1.425 V to 1.575 V. Moisture Sensitivity Level 4 (72 hours). Standard manufacturer lead time about 6 weeks. Part status listed as Active.
Virtex-II Pro architecture, optimized for embedded and high-speed logic designs
High I/O count up to 852 for wide parallel interfaces and connectivity
Package FCBGA, 1517 balls, 40 x 40 ball array class for dense routing
Commercial temperature range 0°C to 85°C (junction)
Core supply range 1.425 V to 1.575 V
RoHS compliant, lead-free solder balls
Surface mount, reflow compatible; MSL 4 for handling and baking
Manufacturer lead time target 6 weeks
On-chip resources per provided spec: logic elements/cells 5904; total RAM bits 53136 (verify exact resources in the datasheet for your specific speed/grade)
Proven platform with broad ecosystem, tools, and IP support
Very high pin count supports memory, high-speed bus, and multi-interface designs
Flip-chip BGA enhances power distribution and thermal performance for high-density designs
Stable, mature silicon with predictable behavior across generations of toolflows
Y-IC supply strength with stock support and flexible logistics
Type: FCBGA (Flip-Chip Ball Grid Array)
Ball count and grid: 1517 balls, 40 x 40 array class (verify exact ball map and pitch in the datasheet)
Material: organic substrate with lead-free solder balls (RoHS compliant)
Size: per AMD Xilinx FFG1517 outline drawing (check package drawing for body size and height)
Pin configuration: up to 852 user I/O; remaining balls are power, ground, configuration, JTAG, clocks, and dedicated pins (see ball map for details)
Thermal characteristics: operating junction temperature 0°C to 85°C; use appropriate heatsinking/airflow and follow AMD Xilinx thermal guidelines
Electrical properties: core voltage (VCCINT) 1.425 V to 1.575 V; banked I/O with multiple I/O standard support and VCCO rails (consult datasheet for supported standards and limits)
Moisture Sensitivity: MSL 4 (72 hours floor life at ≤30°C/60% RH); follow JEDEC J-STD-033 handling and J-STD-020 reflow profiles
Standard package unit: 1 piece per tray or equivalent carrier (refer to shipping label for exact packing)
Status: Active per current listing
Family maturity: Virtex-II Pro is a mature product family; plan procurement proactively
Equivalent or alternative models (verify pin compatibility, speed, and temperature before use):
- Same family, similar capacity and package
- XC2VP50-5FFG1517C (different speed grade)
- XC2VP50-6FFG1517I (industrial temperature option)
- XC2VP50-7FFG1517C (higher speed grade)
- XC2VP50-6FF1152C (different ball count/package for footprint-constrained designs)
- Possible migration paths in newer families (redesign required)
- Virtex-4 FX series
- Virtex-5 FXT series
- Kintex-7 or Virtex-7 series
If your required equivalent is not listed or you need a pin-to-pin alternative, please contact our sales team via the Y-IC website for detailed cross-references and support.
Communications and networking equipment
Embedded processing and control (with soft or hard processor integration)
High-speed DSP, protocol bridging, and data acquisition
Test and measurement instruments
Storage, RAID, and interface controllers
Video, imaging, and broadcast systems
Prototyping and hardware acceleration
Our website hosts the most authoritative datasheet and technical documentation for XC2VP50-6FFG1517C. We recommend downloading the datasheet on this page to confirm all electrical, mechanical, and configuration details before design-in.
In stock and ready for fast shipment — current available quantity: 2697 units. Get a Quote on our website now. Learn More about pricing breaks and delivery options. Limited Time Offer for preferred customers and scheduled orders. Reach out today to secure supply and lock in competitive pricing.
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