Xilinx Inc. XC2VP50-6FFG1148I

Mfr. Part

XC2VP50-6FFG1148I

Manufacturer

AMD Xilinx

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Detailed Description

Virtex-II Pro family FPGA for high-performance embedded and programmable logic designs

Industrial temperature grade I rated for -40 C to 100 C junction

Speed grade -6 for performance balance

Package FFG1148 flip chip fine pitch BGA 35 x 35 mm with 1148 balls

812 user I O as specified enabling wide interface coverage

Core voltage 1.425 V to 1.575 V

RoHS lead free compliant

Surface mount device

Part status Active

Manufacturer standard lead time 6 weeks

Moisture sensitivity level MSL 4 floor life 72 hours at 30 C and 60 percent RH

Standard pack size 1 unit per pack

Current available quantity 2616 units

Key Features

Series Virtex-II Pro

Speed grade -6

Industrial temperature range -40 C to 100 C TJ

812 I O pins for external interfaces

Package FFG1148 FCBGA 35 x 35 mm flip chip construction

Logic elements or cells 5904 as specified

Total RAM bits 53136 as specified

Clock rate 812 as specified

Core voltage range 1.425 V to 1.575 V

Mounting type surface mount

RoHS lead free compliance

MSL 4 72 hours floor life

Standard pack 1

Polarization 1148 BBGA FCBGA

Active part status for ongoing supply

Key Advantages

High I O count for complex board-level connectivity and parallel interfaces

Wide industrial temperature range for harsh environments

Stable supply with Active lifecycle and 6 week lead time

Flip chip BGA for low inductance power delivery and improved thermal path

RoHS compliance for regulatory acceptance worldwide

Mature AMD Xilinx tool ecosystem and IP library enabling faster time to market

Strong support and sourcing from Y-IC for risk-free procurement

Packaging

Type flip chip fine pitch ball grid array FFG1148 suitable for high-density designs

Material flip chip die onto organic BT substrate lead free SAC solder balls and epoxy molding compound

Size 35 mm x 35 mm body with 1148-ball array refer to datasheet for exact ball pitch and keep-out dimensions

Pin configuration 812 user I O pins plus dedicated balls for power ground configuration JTAG and clock distribution carefully mapped across the array

Thermal characteristics junction temperature -40 C to 100 C TJ MSL 4 requires controlled humidity and time out management bake procedures recommended if floor life is exceeded thermal design should consider heatsink or airflow for high-power workloads refer to datasheet for Theta values

Electrical properties core voltage 1.425 V to 1.575 V multiple I O standards supported in banks such as LVTTL LVCMOS LVDS and others bank-dependent ESD protection integrated per AMD Xilinx device standards refer to datasheet for bank voltages and I O standard lists

Lifecycle

Current status Active not nearing discontinuation based on provided data

Same family options and close replacements

- XC2VP50-7FFG1148I faster speed grade in same package and industrial temp range

- XC2VP50-6FFG1148C same speed grade with commercial temp range

- XC2VP50-5FFG1148I slower speed grade industrial temp for lower power targets

- XC2VP40 family devices for lower density while retaining Virtex-II Pro architecture selection depends on pinout and performance needs

- XC2VP70 family devices for higher density targets and expanded resources

Newer generation alternatives design migration required

- Virtex-4 FX series for enhanced embedded processing and improved performance per watt

- Virtex-5 FXT series for higher performance logic and transceivers

- Kintex-7 series for modern performance and lower power with broad availability

Form fit function compatibility and exact pin-for-pin alternatives depend on package and board constraints please contact Y-IC via our website for a tailored cross reference and migration plan

Key Application Areas

Communications infrastructure baseband and packet processing bridging and switching

Embedded computing and control systems real-time processing and hardware acceleration

Industrial automation motor control PLCs data acquisition and deterministic I O

Test and measurement instrumentation pattern generation logic analysis and data capture

Aerospace and defense signal processing radar prototyping and secure communications

Video and image processing filtering scaling codec offload and pipeline acceleration

High performance prototyping custom accelerators and co-processors

Note Virtex-II Pro devices integrate embedded PowerPC 405 cores in many variants confirm exact core presence and count in the datasheet for XC2VP50-6FFG1148I

Datasheet

Our website hosts the most authoritative datasheet for XC2VP50-6FFG1148I

Download the datasheet on this page for complete specifications pin maps timing electrical limits thermal guidance and design best practices

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