Xilinx Inc. XC2VP50-6FFG1517I

Mfr. Part

XC2VP50-6FFG1517I

Manufacturer

AMD Xilinx. Y-IC is a quality distributor for AMD Xilinx and we will provide you with the best products and services

Detailed Description

Virtex-II Pro family FPGA for embedded and high-performance logic. Industrial temperature grade. Speed grade -6. Package FFG1517 (fine-pitch, 1517-ball FCBGA). 852 user I/O. Surface-mount. Lead-free and RoHS compliant. Active status with a manufacturer standard lead time of 6 weeks. Designed for robust operation from -40°C to 100°C junction temperature and suitable for complex digital designs that demand high I/O bandwidth and dependable reliability

Key Features

Family and series: Virtex-II Pro

Density class: XC2VP50

Speed grade: -6

Package: FFG1517 (fine-pitch, 1517-ball FCBGA)

User I/O: 852

Mounting: Surface mount

RoHS: Lead-free and RoHS compliant

Operating junction temperature: -40°C to 100°C

Moisture Sensitivity Level: MSL 4 (72 hours floor life)

Part status: Active

Manufacturer standard lead time: 6 weeks

Standard unit packaging: 1 piece per unit pack

Core supply voltage range: 1.425 V to 1.575 V

Number of logic elements/cells: 5904 (as provided; verify final values in datasheet)

Total RAM bits: 53136 (as provided; verify final values in datasheet)

Key Advantages

Industrial temperature support for reliable operation in harsh environments

Very high I/O count for broad interfacing flexibility across multiple standards

Proven Virtex-II Pro platform favored in long-life industrial and infrastructure designs

Fine-pitch FCBGA package for high-density PCB layouts and strong electrical performance

Lead-free and RoHS compliant for modern compliance requirements

Active lifecycle with predictable lead times for production planning

Packaging

Type: Fine-pitch FCBGA

Ball count and array: 1517 balls, approximate 40 x 40 ball array layout

Material: Organic BGA substrate with copper routing and solder ball interconnects

Size: Large high-pin-count BGA footprint designed for complex, high-speed boards; refer to the mechanical outline in the datasheet for exact body size and ball pitch

Pin configuration: 1517 balls total with approximately 852 user I/O; remaining balls are assigned to power, ground, configuration, and dedicated functions across multiple I/O banks

Thermal characteristics: Junction temperature rated -40°C to 100°C; package supports good heat spreading. Use solid ground planes, adequate airflow or heatsinking, and follow AMD Xilinx thermal guidelines for power dissipation and θJA/θJC characterization

Electrical properties: Core voltage range 1.425 V to 1.575 V; I/O banks support multiple standards (LVTTL, LVCMOS, SSTL, etc., per bank design rules). Lead-free solder balls. Observe MSL 4 handling (72 hours floor life) and reflow profiles per JEDEC recommendations

Lifecycle

Current status: Active and in regular production

Nearing discontinuation: Not indicated by the provided data

Equivalent or alternative models:

- Same family and package options typically available in different speed grades and temperature ranges, for example XC2VP50-5FFG1517I or XC2VP50-6FFG1517 (commercial temperature C). Verify exact availability and compatibility

- Other densities in the Virtex-II Pro family that may fit similar boards or designs: XC2VP30, XC2VP40, XC2VP70, XC2VP100 (package and pin compatibility varies; check mechanical and electrical differences)

- If pin-for-pin or functional equivalence is required, contact us. Many alternatives differ in speed, logic density, or package and must be validated against your design constraints

If you need a drop-in replacement or field-proven alternatives, please reach out through our website. Our sales and technical teams will help you select the best compatible part for your application and lifecycle plan

Key Application Areas

Industrial automation and motion control

Networking and telecommunications infrastructure

Embedded processing and signal processing systems

Test and measurement equipment

Aerospace and defense electronics

Medical imaging and instrumentation

High-speed data acquisition and interface bridging

Prototyping and custom hardware accelerators

Datasheet

Our website hosts the most authoritative and up-to-date datasheet for XC2VP50-6FFG1517I. We strongly recommend downloading the datasheet from this page to confirm final electrical, mechanical, and thermal specifications, pinouts, and design guidelines

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