AMD XC2VP50-6FFG1148C

Mfr. Part

XC2VP50-6FFG1148C

Manufacturer

AMD Xilinx. Y-IC is a quality distributor for AMD Xilinx and we will provide you with the best products and services.

Detailed Description

Virtex-II Pro family FPGA, fine-pitch flip‑chip BGA, 1148 balls (35 x 35 mm), 812 user I/Os. 53,136 logic cells, 5,904 CLBs, about 4.28 Mbits of Block RAM. Commercial temperature grade (0°C to 85°C Tj). Core supply 1.425 V to 1.575 V. Surface‑mount device in tray packaging. Part of the XC2VP50 base device line.

Key Features

Virtex-II Pro architecture with rich logic, memory, and DSP resources

Approx. 53k logic cells and 5,904 configurable logic blocks for large designs

4,276,224 total RAM bits using distributed and Block RAM (18-kb blocks)

812 user I/O pins with flexible SelectIO banks

Wide I/O standard support: LVDS, LVCMOS (1.5/1.8/2.5/3.3 V), LVTTL, HSTL, SSTL (family typical; confirm per bank in datasheet)

Embedded hardware multipliers for DSP acceleration (device family feature)

Digital Clock Managers (DCMs) for clock synthesis, deskew, and conditioning

Configuration options: JTAG, Master/Slave Serial, SelectMAP (parallel), with configuration CRC

On-chip JTAG (IEEE 1149.1) boundary scan for test and programming

RocketIO multi‑gigabit transceivers available on select Virtex‑II Pro devices (check exact availability and count for this specific speed grade/package in the datasheet)

Embedded PowerPC 405 processor core(s) are part of the Virtex‑II Pro family feature set (core count and enablement are device‑specific; verify for XC2VP50-6FFG1148C in the datasheet)

RoHS3 compliant, lead‑free package

Key Advantages

High I/O count (812) enables wide memory and interface connectivity

Balanced mix of logic, memory, and DSP for versatile system designs

Mature, well‑documented platform with stable tool support history

Flip‑chip BGA offers good electrical performance and thermal path

Fine‑pitch package packs high performance in a manageable footprint

Backed by Y-IC’s quality supply chain, inspection, and support services

Packaging

Type: 1148‑FCPBGA (Fine‑Pitch Flip‑Chip Ball Grid Array)

Material: Organic BGA substrate with lead‑free solder balls (RoHS3)

Body size: 35 mm x 35 mm (FFG1148 outline)

Ball count and layout: 1148 balls in a fine‑pitch grid; multiple I/O banks plus dedicated power/ground and configuration/JTAG pins; detailed ball map in the datasheet

Pin pitch: Fine‑pitch BGA (refer to the package drawing in the datasheet for exact pitch and keep‑out)

Mounting: Surface mount (reflow soldering per JEDEC guidance)

Thermal characteristics: Commercial junction temperature 0°C to 85°C; flip‑chip construction improves heat spreading; actual ΘJA/ΘJC depend on board, airflow, and heat sink; follow Xilinx thermal guidelines

Electrical properties (power rails): VCCINT 1.425 V to 1.575 V (core); VCCAUX typically 2.5 V; VCCO per bank depends on selected I/O standard (commonly 1.5/1.8/2.5/3.3 V); decoupling and power sequencing per datasheet

Shipping form: Tray

Lifecycle

Status: This Virtex‑II Pro device is legacy/near end‑of‑life in many supply channels, and may be discontinued by the manufacturer. Availability can be limited.

Direct pin‑to‑pin replacements: None (next‑gen families use different architectures and packages).

Functional and performance alternatives (not pin‑compatible; redesign required):

- Virtex‑4 FX series (e.g., XC4VFX60-FFG1152, XC4VFX100-FFG1517) for embedded PPC and enhanced logic/DSP

- Virtex‑5 FXT series (e.g., XC5VFX70T-FFG1136, XC5VFX130T-FFG1738) with PPC440 and improved transceivers

- Virtex‑5/6 LX/LXT families for logic- and serial‑focused upgrades (choose size to match resource needs)

- Kintex‑7 (e.g., XC7K160T-FFG676, XC7K325T-FFG900) for modern cost/performance with GTX transceivers

- Zynq‑7000 SoC (e.g., XC7Z045-FFG900) if integrating processors and FPGA fabric on one device

- Artix‑7 (e.g., XC7A200T) for lower‑power/lower‑cost designs with moderate resources

If you need exact migration guidance or other equivalent options, please contact our Y-IC sales team via our website for the latest recommendations and availability.

Key Application Areas

Communications infrastructure: line cards, packet processing, bridging, SERDES‑based links

Industrial and medical: motion control, data acquisition, instrumentation

Broadcast and video: image processing, scaling, encoding/decoding pipelines

Storage and networking: protocol bridging, RAID controllers, test/measurement

Aerospace/defense (non‑rad‑hard): prototyping, signal processing, embedded compute

Embedded systems: hardware acceleration around embedded processors (PPC), legacy system sustainment

Datasheet

Our website hosts the most authoritative datasheet for this exact model. We recommend downloading the XC2VP50-6FFG1148C datasheet directly from this page to get the official package drawings, ball map, electrical limits, configuration details, and thermal guidance.

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