English
| Part Number: | XC2VP7-5FFG672C |
|---|---|
| Manufacturer/Brand: | AMD Xilinx |
| Part of Description: | IC FPGA 396 I/O 672FCBGA |
| Datasheets: |
|
| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $23.8589 |
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 1.425V ~ 1.575V |
| Total RAM Bits | 811008 |
| Supplier Device Package | 672-FCBGA (27x27) |
| Series | Virtex®-II Pro |
| Package / Case | 672-BBGA, FCBGA |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Number of Logic Elements/Cells | 11088 |
| Number of LABs/CLBs | 1232 |
| Number of I/O | 396 |
| Mounting Type | Surface Mount |
| Base Product Number | XC2VP7 |




XC2VP7-5FFG672C
AMD Xilinx
Y-IC is a trusted distributor of AMD Xilinx products and is committed to delivering top-quality components and excellent service to our customers.
The XC2VP7-5FFG672C is a high-performance FPGA with 396 input/output pins in a 672-ball Fine-Pitch Ball Grid Array (FCBGA) package, designed for advanced logic and digital applications. This device belongs to the Virtex-II Pro series, offering enhanced capability and efficient programmable logic resources for custom electronic design.
FPGA with 11088 logic elements/cells
1,232 configurable logic blocks (LABs/CLBs)
811,008 total RAM bits for data storage
Operates at 1.425V to 1.575V supply voltage
396 I/O pins for flexible connectivity
Suitable for surface mount assembly
Works reliably within 0°C to 85°C junction temperature
Uses advanced FCBGA packaging technology (672-ball, 27x27 mm size)
RoHS3 compliant for environmental safety
High integration: Supports demanding, high-density digital applications
Versatile I/O: 396 pins, optimized for broad interface compatibility
Energy Efficient: Operates at a low supply voltage range
Flexible logic: Can be used for rapid prototyping or production systems
Reliable thermal and electrical performance
Package type: Tray (best for handling and automated assembly)
Package material: FCBGA (Fine-pitch Ball Grid Array), ceramic construction
Package size: 27mm x 27mm
Pin configuration: 672-BBGA (Ball-Grid Array for robust board connection)
SIP4 encapsulation for durability
Excellent thermal characteristics, supporting industrial operating temperatures
Strong electrical characteristics, suitable for high-speed designs
Currently, the XC2VP7-5FFG672C is a mainstream product and is not approaching discontinuation. If you are interested in equivalent or alternative models to suit your unique requirements, options are available, including other devices from the Virtex-II Pro and newer Xilinx families. For full alternative lists and detailed cross-references, please reach out directly to our sales team via our website for professional support and up-to-date suggestions.
Digital signal processing
Embedded system development
Communications equipment (routers, switches)
Aerospace and defense electronics
Test and measurement instruments
High-speed data acquisition systems
Industrial automation and control
Scientific computing hardware
The most comprehensive and authoritative datasheet for the XC2VP7-5FFG672C is available on our website. For in-depth technical details on usage, features, and integration, please download the official datasheet from this product’s page.
Get a Quote instantly on our website for the XC2VP7-5FFG672C! Don’t miss out—take advantage of our Limited Time Offer to secure your stock. Click 'Learn More' or 'Get a Quote' right now for the best pricing, expert support, and fast delivery, all backed by Y-IC’s industry-leading supply chain and service.
IC FPGA 852 I/O 1517FCBGA
IC FPGA 692 I/O 1152FCBGA
IC FPGA 692 I/O 1152FCBGA
IC FPGA 396 I/O 672FCBGA
XC2VP50-FF1517C XILINX
IC FPGA 396 I/O 896FCBGA
IC FPGA 396 I/O 672FCBGA
IC FPGA 396 I/O 672FCBGA
IC FPGA 396 I/O 896FCBGA
IC FPGA 248 I/O 456FBGA
IC FPGA 396 I/O 896FCBGA
IC FPGA 248 I/O 456FBGA
IC FPGA 852 I/O 1517FCBGA
IC FPGA 396 I/O 896FCBGA
IC FPGA 248 I/O 456FBGA
IC FPGA 396 I/O 672FCBGA
IC FPGA 812 I/O 1148FBGA
IC FPGA 396 I/O 672FCBGA
IC FPGA 396 I/O 896FCBGA
IC FPGA 248 I/O 456FBGA
May 12th, 2026
May 8th, 2026
April 28th, 2026
April 20th, 2026
April 17th, 2026
April 8th, 2026
March 31th, 2026
March 23th, 2026
March 20th, 2026
March 9th, 2026
March 4th, 2026
February 28th, 2026
February 3th, 2026
January 28th, 2026
January 19th, 2026
January 16th, 2026
January 9th, 2026
December 29th, 2025
December 25th, 2025
December 17th, 2025
December 10th, 2025
December 4th, 2025
November 25th, 2025
November 20th, 2025
November 11th, 2025
November 3th, 2025
October 30th, 2025
October 22th, 2025
October 16th, 2025
October 9th, 2025
September 28th, 2025
September 17th, 2025
September 9th, 2025
September 1th, 2025
August 25th, 2025
August 20th, 2025
July 3th, 2025
December 18th, 2024
June 21th, 2023
April 27th, 2023
July 1th, 2022
March 4th, 2021
September 10th, 2020
January 23th, 2020
0 Articles





June 4th, 2026
June 4th, 2026
June 4th, 2026
June 3th, 2026
XC2VP7-5FFG672CAMD |
Quantity*
|
Target Price(USD)
|