SK Hynix H9TP32A4GDECPR-KGM

Mfr. Part

H9TP32A4GDECPR-KGM

Manufacturer

SK Hynix

Y-IC is a quality distributor for SK Hynix. We deliver genuine parts, fast service, and reliable support to help you build better products.

Detailed Description

Specialized memory IC from SK Hynix for embedded and mobile systems

Main Category: Integrated Circuits (ICs)

Small Classification: Specialized ICs

Package / Case: 1633

Data Code: 14+

Available Quantity: 1556

Designed for compact, low-power designs that need high-density memory in one device. Commonly used in space-constrained applications where integration, power efficiency, and performance matter.

Key Features

High integration to reduce board space and simplify design

Low power operation for battery-driven devices

High data bandwidth suited for mobile and embedded workloads

Robust reliability and consistent quality from SK Hynix

Broad ecosystem compatibility typical of mobile memory solutions

Suitable for high-volume manufacturing and scalable deployments

Key Advantages

Fewer components and interconnects, lowering BOM cost and failure points

Faster time to market by simplifying memory subsystem design

Smaller footprint enables thinner and lighter end products

Optimized power efficiency helps extend battery life

Backed by SK Hynix manufacturing quality and Y-IC supply chain support

Stable sourcing with professional logistics and inspection from Y-IC

Packaging

Type: Advanced IC package optimized for mobile and embedded use (customer provided case code 1633)

Material: Standard semiconductor-grade molded epoxy and substrate materials used in BGA-style ICs

Size: Compact footprint for dense PCB layouts (refer to datasheet for exact dimensions)

Pin configuration: High-pin-count grid array optimized for memory interfaces; routing-friendly ball map (see datasheet for full ball map)

Thermal characteristics: Efficient heat spread via package and PCB; supports standard mobile thermal design practices (consult datasheet for thermal limits and derating)

Electrical properties: Low-voltage operation typical of mobile memory solutions; high-speed interfaces; meets standard signal integrity and power integrity requirements for embedded systems (see datasheet for rails, timing, and IO specs)

Lifecycle

Current status: Not flagged as end-of-life by Y-IC at the time of listing; lifecycle can vary by lot and revision

Nearing discontinuation: No public EOL notice observed; verify with our sales team for the latest lifecycle updates

Equivalent or alternative models: A definitive one-to-one cross for the exact suffix H9TP32A4GDECPR-KGM is not published here due to configuration details (capacity, speed grade, package options) that must match precisely

Recommendation: Contact our sales team via our website for a tailored cross list and pin-to-pin compatibility confirmation. We will propose SK Hynix family variants or other vendor options after reviewing your technical needs.

Key Application Areas

Smartphones and tablets

Wearables and portable electronics

IoT gateways and edge devices

Embedded boards and modules (industrial and consumer)

Navigation and infotainment systems

Handheld test instruments and medical devices

Smart home and building controls

Datasheet

Our website hosts the most authoritative datasheet for H9TP32A4GDECPR-KGM. For exact specifications, package drawings, pin maps, timing, and electrical limits, download the datasheet on this page now.

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