Texas Instruments OMAPL138EZCEA3E

Mfr. Part

OMAPL138EZCEA3E

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

High-integration embedded microprocessor from the OMAP-L1x family combining an ARM926EJ-S core running up to 375 MHz with a C674x DSP co-processor for signal processing. Designed for balanced control and DSP workloads with rich connectivity and industrial temperature capability. Packaged in a compact 361-ball BGA for space-sensitive designs. Features include 10/100 Ethernet, USB 1.1 and USB 2.0 with integrated PHYs, LCD controller, SDRAM controller, SATA 3 Gbps, and secure boot with cryptography. RoHS3 compliant and surface-mount ready.

Key Features

Core processor ARM926EJ-S up to 375 MHz

Co-processor C674x DSP for signal processing

Architecture 1 core ARM, 32-bit with CP15 system control

Ethernet 10/100 Mbps MAC x1

USB ports USB 1.1 + PHY x1 and USB 2.0 + PHY x1

Display LCD controller

Storage and memory SDRAM controller

High-speed interface SATA 3 Gbps x1

Additional interfaces HPI, I2C, McASP, McBSP, MMC/SD, SPI, UART

Security Boot security and cryptography

Series OMAP-L1x family

Base product number OMAPL138

I/O voltages 1.8 V and 3.3 V

Operating junction temperature range -40°C to 105°C

RoHS ROHS3 compliant

Mounting type Surface mount

Key Advantages

Dual-compute approach ARM + C674x DSP boosts real-time signal processing while keeping control tasks responsive

Strong peripheral mix reduces the need for external chips, cutting BOM cost and board space

Industrial temperature support allows deployment in harsh environments

Integrated PHYs for USB simplify design and speed time to market

Secure boot and crypto help protect firmware and data

Mature TI ecosystem with tools, libraries, and software support lowers development risk

Packaging

Package type 361-ball BGA available as NFBGA and LFBGA references in documentation

Body size 13 mm x 13 mm

Ball count and layout 361 balls in a matrix grid for dense interconnect

Materials Molded plastic over organic laminate substrate with lead-free solder balls per RoHS3

Mounting Surface mount reflow compatible

Thermal characteristics Junction temperature -40°C to 105°C typical operation range. Use solid ground planes, ample copper, and good airflow for thermal management

Electrical properties I/O at 1.8 V and 3.3 V, core ARM926EJ-S at up to 375 MHz, integrated PHYs for USB, 10/100 Ethernet MAC, SDRAM controller, SATA 3 Gbps

Supplier device package 361-NFBGA 13x13

Shipping format Tray for production handling

Lifecycle

Current status Generally active in the TI OMAP-L1x line based on latest market data

Not near discontinuation to the best of our knowledge. Availability can vary by region and time

Closely related alternatives within TI families for comparison and design flexibility

- OMAP-L137 ARM9 + C674x DSP with similar peripheral set depending on variant

- OMAP-L132 cost-optimized variant with reduced features in the same family

- Sitara AM1808 ARM926EJ-S based device with comparable peripherals in many applications

- Sitara AM1810 ARM9 variant with LCD and industrial interfaces depending on configuration

Pin compatibility and feature parity differ by device. Always check datasheets for exact match

If you need exact drop-in equivalents or lifecycle confirmation, contact our sales team via the Y-IC website for the latest and region-specific information

Key Application Areas

Industrial control and PLCs

Human–machine interfaces and operator panels with LCD

Motor control and drives with real-time DSP

Audio processing and voice gateways

Networked devices and IoT edge nodes with 10/100 Ethernet

Data acquisition, test and measurement instruments

Medical and imaging subsystems requiring mixed control and DSP

Printers, scanners, and multifunction peripherals

Point-of-sale terminals and kiosks

Embedded gateways and protocol converters

Datasheet

Y-IC hosts the most authoritative datasheet for this product on our website. For complete electrical characteristics, pin maps, and design guidelines, download the datasheet directly from this page to ensure you have the latest and verified information.

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