Texas Instruments OMAPL137BZKBT3

Mfr. Part

OMAPL137BZKBT3

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

OMAP-L1x family MPU with ARM926EJ-S core and C674x DSP co-processor

375 MHz performance, 32-bit architecture, industrial-grade

Integrated peripherals: 10/100 Ethernet MAC, USB 1.1 + PHY (1), USB 2.0 + PHY (1), LCD controller, SDRAM controller, HPI, I2C (listed as IC), McASP, MMC/SD, SPI, UART

Package: 256-BGA (17x17), Surface Mount, Tray

RoHS: ROHS3 Compliant (lead-free)

Operating temperature: -40°C to 125°C (TJ)

I/O voltages: 1.8V and 3.3V

Base product number: OMAPL137

Series: OMAP-L1x

Graphics acceleration: No

Key Features

ARM926EJ-S CPU at 375 MHz for control tasks

C674x DSP for real-time signal processing

1 core, 32-bit bus width (plus DSP co-processor)

Ethernet 10/100 MAC integrated

Dual USB with integrated PHYs (USB 1.1 and USB 2.0)

LCD controller for display/HMI panels

SDRAM memory controller

Rich interfaces: HPI, I2C, McASP (audio), MMC/SD, SPI, UART

CP15 system control features

Industrial temperature (TJ -40°C to 125°C)

ROHS3 compliance for eco-friendly, lead-free manufacturing

Supplier Device Package: 256-BGA (17x17)

Key Advantages

Strong combo of ARM + DSP: simplifies mixed control + signal-processing workloads on one chip

High integration reduces BOM, board size, and design complexity

Wide interface set enables flexible connectivity to displays, storage, audio, and networking

Industrial temperature range supports harsh environments

Mature TI ecosystem: tools, libraries, and community support

Long product lifecycle typical for TI embedded parts

RoHS3 lead-free device supports modern compliance needs

Packaging

Type: Ball Grid Array (BGA), 256-ball

Size: 17 mm x 17 mm body (Supplier Device Package: 256-BGA 17x17)

Pin configuration: 256-ball grid array; verify exact ball map in the datasheet

Material: Lead-free balls (RoHS3), organic substrate, plastic overmold (typical for BGA)

Mounting: Surface Mount; packaged in trays for automated pick-and-place

Thermal characteristics: Junction temperature (TJ) -40°C to 125°C; use solid ground planes and appropriate heat-spreading for reliability

Electrical properties: I/O at 1.8V and 3.3V; core and PLL rails per TI guidelines (see datasheet); high-speed interfaces require controlled impedance routing

Handling: ESD-safe trays; follow J-STD-020 reflow profiles and MSL guidelines (check datasheet for exact MSL rating)

Lifecycle

Status: Mature TI platform; widely deployed in industrial systems. No public indication of near-term discontinuation as of the latest available information. Always confirm on our website or with Y-IC sales for current status.

Pin-/function-compatible or close alternatives (verify details in datasheets):

- OMAP-L138 series (ARM926EJ-S + C674x DSP; similar feature set, often pin-compatible in 256-BGA options)

- OMAP-L132 series (ARM-only, no DSP) for simpler control applications

- Sitara AM1808/AM1707 (ARM9-based; good if DSP is not required)

- DaVinci DA830/DA850 family (ARM9 + C674x DSP; similar concept, check package/pinout)

- DSP-only options (if ARM not needed): TMS320C6747/C6748 (different architecture and pinout)

If you need drop-in or functionally equivalent replacements tailored to your design, contact our sales team via the Y-IC website for detailed guidance.

Key Application Areas

Industrial automation and control (PLCs, motion control, robotics)

HMI panels and operator interfaces (LCD-driven systems)

Audio and voice processing (McASP-based designs, telephony, intercoms)

Networked embedded systems (Ethernet-enabled controllers, gateways)

Medical and laboratory devices (signal acquisition and processing)

Printers, copiers, and office equipment

Building automation and smart energy systems

Test and measurement equipment

Consumer and prosumer electronics needing ARM + DSP performance

Datasheet

Y-IC hosts the most authoritative datasheet for OMAPL137BZKBT3 on our product page. Download it now for exact electrical specs, pin maps, timing, MSL, reflow profiles, and mechanical drawings. For the latest revisions, always use the datasheet available on the current page.

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