Texas Instruments MSP430G2744IYFFT

Mfr. Part

MSP430G2744IYFFT

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

Ultra‑low‑power 16‑bit microcontroller in a compact 49‑ball DSBGA package (2.8 mm x 2.8 mm). Runs up to 16 MHz with the MSP430 CPU16 core. Includes 32 KB Flash, 1 KB RAM, 12‑channel 10‑bit ADC, 32 GPIO, and integrated brown‑out detect/reset, power‑on reset, and watchdog. Built‑in serial interfaces cover I2C, SPI, UART/USART, IrDA, and LINbus. Operates from 1.8 V to 3.6 V. Internal oscillator. Industrial temperature range −40°C to +85°C. RoHS3 compliant. Surface‑mount. Series MSP430G2xx. Supplier device package 49‑DSBGA (2.8 x 2.8). Stock available: 2642 units. Tape & Reel for automated assembly.

Key Features

16‑bit MSP430 CPU16 core, up to 16 MHz

32 KB Flash program memory (32K x 8)

1 KB RAM (1K x 8)

12‑channel 10‑bit ADC for mixed‑signal sensing

32 programmable I/O pins

Interfaces: I2C, SPI, UART/USART, IrDA, LINbus, SCI

Internal oscillator for simple clocking

Voltage range 1.8 V to 3.6 V

Peripherals: brown‑out detect/reset (BOR), power‑on reset (POR), watchdog timer (WDT)

Operating temperature −40°C to +85°C (TA)

RoHS3 compliant, lead‑free

Package: 49‑DSBGA (2.8 mm x 2.8 mm), Surface Mount, Tape & Reel

Key Advantages

Very low power consumption extends battery life

Small 2.8 mm x 2.8 mm DSBGA saves PCB space

Rich serial connectivity simplifies system integration

Integrated ADC and safety features reduce external components and BOM cost

Wide supply voltage range supports many power sources

Industrial temperature range for reliable operation in harsh environments

Proven MSP430 ecosystem with tools, libraries, and broad community support

Packaging

Type: DSBGA (49‑ball BGA), wafer‑level chip‑scale style

Material: Lead‑free, RoHS3 compliant ball array; suitable for standard Pb‑free reflow

Size: 2.8 mm x 2.8 mm body; ultra‑compact footprint

Pin/ball configuration: 49 balls total; up to 32 GPIO available; fine‑pitch ball grid (see datasheet for exact ball map and pitch)

Mounting: Surface Mount (SMT); optimized for automated placement

Tape & Reel: Supplied in TR for high‑volume manufacturing

Thermal characteristics: Ambient −40°C to +85°C; low‑power operation minimizes heat generation; use standard PCB thermal design practices

Electrical properties: 1.8–3.6 V supply, up to 16 MHz clock, 32 KB Flash, 1 KB RAM, 12x10‑bit ADC, internal oscillator, multiple serial interfaces

Lifecycle

Current status: No public end‑of‑life notice found as of the latest update; availability can vary. Check with Y‑IC sales for up‑to‑date lifecycle confirmation.

Drop‑in equivalents: Pin‑for‑pin alternatives in the same 49‑DSBGA ballout are limited. Board‑level compatibility should be verified per ball map.

Alternatives and near‑equivalents: Other MSP430G2xx family devices with similar features may fit many designs but may differ in memory size, peripherals, or package (for example MSP430G2553, MSP430G2452, MSP430G2755, or select MSP430F2xx variants). Suitability depends on your required pinout, package, and feature set—please confirm via datasheets and with our team.

Need help choosing: For a tailored cross or second source, contact our sales team via the Y‑IC website. We will recommend the best equivalent based on your design constraints.

Key Application Areas

Battery‑powered sensors and data loggers

Portable medical and wearable devices

Utility metering and smart home nodes

Handheld instruments and remote controllers

Motor/actuator control with LINbus

Infrared communication (IrDA) user interfaces

Low‑power mixed‑signal embedded systems

Datasheet

Y‑IC hosts the most authoritative datasheet for MSP430G2744IYFFT on our product page. For accurate pin maps, timing, electrical specs, and application notes, download the datasheet here to speed up your design.

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