Texas Instruments MSP430G2744IYFFR

Mfr. Part

MSP430G2744IYFFR

Manufacturer

Texas Instruments (Luminary Micro/TI)

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Detailed Description

Ultra‑low‑power 16‑bit MSP430 microcontroller in a compact 49‑ball DSBGA package (2.8 x 2.8 mm), with 32KB Flash and 1KB RAM. Runs up to 16MHz. Includes a 12‑channel 10‑bit ADC, internal oscillator, brown‑out detect, power‑on reset, and watchdog timer. Offers multiple serial interfaces: I2C, SPI, UART/USART, IrDA, LIN/SCI. Operates from 1.8V to 3.6V over −40°C to +85°C. Ideal for small, battery‑powered designs needing mixed‑signal and serial connectivity. RoHS3 compliant. Tape & Reel packaging.

Key Features

Core: MSP430 CPU16, 16‑bit

Speed: Up to 16MHz

Program memory: 32KB Flash (32K x 8)

RAM: 1KB (1K x 8)

ADC: 12 channels, 10‑bit resolution

Oscillator: Internal

Peripherals: Brown‑out detect/reset (BOR), Power‑on reset (POR), Watchdog timer (WDT)

Interfaces: I2C, SPI, UART/USART, IrDA, LIN/SCI

I/O: 32 programmable I/O

Supply voltage: 1.8V to 3.6V

Operating temperature: −40°C to +85°C (TA)

Mounting: Surface mount

Package: 49‑DSBGA, 2.8 x 2.8 mm, Supplier Device Package 49‑DSBGA (2.8x2.8)

Series: MSP430G2xx, Base product number MSP430G2744

Compliance: RoHS3

Shipping: Tape & Reel (TR)

Stock on hand: 2623 units (subject to change)

Key Advantages

Very low power consumption for long battery life

Tiny footprint saves PCB space and enables sleek, compact products

Rich serial connectivity for easy integration with sensors and other ICs

Built‑in ADC and essential supervisory functions reduce external components

Wide supply range and industrial temperature for robust operation

Simple, proven MSP430 ecosystem with mature tools and libraries

RoHS3 lead‑free compliance supports global regulatory needs

Packaging

Type: DSBGA (Die‑Size Ball Grid Array), 49 balls

Size: 2.8 mm x 2.8 mm; low‑profile height

Ball layout: 7 x 7 grid, 49 total balls; 32 usable GPIO signals

Material: Lead‑free, halogen‑free encapsulation with lead‑free solder balls (RoHS3 compliant)

Mounting: Surface mount; reflow soldering per TI guidelines

Tape & Reel: MSP430G2744IYFFR supplied in TR for automated assembly

Thermal characteristics: Designed for −40°C to +85°C ambient; use solid ground plane and good layout for thermal and signal integrity; refer to datasheet for θJA/θJC and detailed thermal data

Electrical properties: 1.8V–3.6V operation; internal oscillator; ESD‑safe handling required; consult datasheet for I/O drive, pull‑ups, and current consumption in low‑power modes

Lifecycle

Status: Active and widely supported in TI’s MSP430G2xx family; not near discontinuation as of the latest check

Equivalents and alternatives:

- MSP430G2744IYFF (same device in cut‑tape packaging)

- Other MSP430G2xx family members with similar core and interfaces may fit your needs but can differ in memory size, pinout, or package. Pin‑compatible options depend on the exact ball map.

Need a drop‑in or function‑compatible alternative? Contact our sales team via the Y-IC website. We will match pinouts, memory size, and peripherals to your requirements.

Key Application Areas

Battery‑powered sensors and data‑loggers

Wearables and health monitoring devices

Portable test instruments and handheld controllers

IoT edge nodes and smart home accessories

Low‑cost metering and utility monitoring

Automotive LIN nodes and simple serial gateways

Infrared remote control and human‑machine interfaces

Datasheet

Y-IC hosts the most authoritative datasheet for MSP430G2744IYFFR on our product page. We recommend downloading it here for complete specifications, ball maps, timing, power modes, and design guidelines.

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