Texas Instruments AM3352BZCE30

Mfr. Part

AM3352BZCE30

Manufacturer

Luminary Micro / Texas Instruments. Y-IC is a quality distributor of this brand and we will provide customers with the best products and services.

Detailed Description

Sitara ARM Cortex-A8 microprocessor, 300 MHz, single-core 32-bit, 298-ball NFBGA 13 x 13 mm package. Integrated 2x Ethernet (10/100/1000 Mbps), 2x USB 2.0 with PHY, LCD and touchscreen controllers, graphics acceleration, NEON SIMD, multimedia co-processor, security (crypto and random number generator), and rich industrial interfaces (CAN, I2C, McASP, SPI, SD/MMC/SDIO, UART). Supports LPDDR, DDR2, DDR3, and DDR3L memory. RoHS3 compliant. Surface-mount. Operating junction temperature 0°C to 90°C. Series: Sitara. Base product number: AM3352.

Key Features

ARM Cortex-A8 core at 300 MHz with NEON SIMD for accelerating signal and multimedia workloads

1 core, 32-bit architecture, efficient integer and floating-point support

Integrated 2x Ethernet MACs up to Gigabit for networking redundancy or dual-port designs

2x USB 2.0 ports with integrated PHY for direct peripheral connection

Display subsystem with LCD controller and touchscreen interface; graphics acceleration enabled

Hardware security including cryptography engines and hardware random number generator

Memory controller supports LPDDR, DDR2, DDR3, DDR3L for flexible BOM and cost control

Industrial I/O: CAN, I2C, McASP (audio), McSPI, MMC/SD/SDIO, UARTs

RoHS3 compliant; lead-free manufacturing

Supplier device package: 298-NFBGA (13 x 13)

Key Advantages

High integration reduces external components and lowers system cost

Mature Sitara ecosystem with broad OS support (Linux, RTOS) and long-term availability

Dual Ethernet and dual USB with PHY simplify connected gateway and HMI designs

Flexible memory options enable optimization for performance, power, and price

Built-in security features support secure boot and protected communications

Graphics and display controllers enable responsive UIs without external GPUs

Proven reliability; widely adopted in industrial and commercial products

Scalable family pin-compatibility gives upgrade paths without PCB redesign

Packaging

Type: NFBGA (Fine-Pitch Ball Grid Array); also referenced as LFBGA in some documentation

Size: 13 x 13 mm body

Ball count: 298 balls in grid array; standard TI ball-map with A1 corner reference

Material: Molded plastic over organic substrate; lead-free SAC solder balls; RoHS3 compliant

Shipment packaging: Tray

Mounting: Surface-mount; compatible with standard BGA reflow profiles

Thermal characteristics: Operating junction temperature (TJ) 0°C to 90°C; for θJA/θJC and detailed thermal data, see datasheet

Electrical properties: I/O voltages 1.8 V and 3.3 V supported; core powered per datasheet; ESD protection per TI specifications

Supplier device package: 298-NFBGA (13 x 13); Manufacturer package code: ZCE

Note: Exact ball pitch, pin configuration, and pad layout are defined in the datasheet package drawings and ball map

Lifecycle

Status: Active production; not nearing discontinuation based on TI’s long-life Sitara roadmap

Direct speed and package variants:

- AM3352BZCE60 (600 MHz, same ZCE 298-ball package)

- AM3352 in ZCZ package (324-ball NFBGA) for alternative pinouts

Pin-compatible and feature-variant Sitara AM335x family options (verify ball map and features):

- AM3351 (no 3D graphics; cost-optimized)

- AM3354 (enhanced display features)

- AM3356, AM3357 (industrial interfaces, PRU options)

- AM3358, AM3359 (higher performance, graphics acceleration, PRU-ICSS)

Performance-upgrade alternatives within TI:

- AM437x series (ARM Cortex-A9, more peripherals; check compatibility)

Cross-vendor alternatives (functional equivalents; redesign required):

- NXP i.MX 6UL/6ULL (ARM Cortex-A7, low-power industrial)

- STMicroelectronics STM32MP1 (Cortex-A7 with Cortex-M co-processor)

If you need guidance on exact drop-in replacements or lifecycle commitments, please contact our sales team via the Y-IC website for the latest availability and compatibility details.

Key Application Areas

Industrial HMI panels and operator interfaces with touch displays

Edge gateways and industrial Ethernet devices

Building automation controllers and security panels

Data acquisition, test and measurement instruments

Medical devices (non-life-critical), lab equipment, and diagnostics

Robotics, motion control, and motor drives

Smart meters, kiosks, digital signage, and point-of-sale terminals

Networked printers and multifunction peripherals

Audio processing and intercom systems via McASP

Embedded Linux systems requiring secure connectivity and UI

Datasheet

Y-IC provides the most authoritative datasheet and technical documentation for AM3352BZCE30 on our website. We recommend downloading the datasheet and related application notes directly from this page to ensure you have the latest specifications, ball maps, thermal data, and design guidelines.

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