Texas Instruments AM3351BZCE30

Mfr. Part

Series: Sitara

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

Sitara microprocessor built on ARM Cortex-A8 at 300 MHz, single-core 32-bit

NEON SIMD multimedia co-processor for faster audio, video, and math workloads

Integrated security with hardware cryptography and true random number generator

Memory controller supports LPDDR, DDR2, DDR3, and DDR3L

Networking and connectivity: Ethernet 10/100/1000 Mbps (1 port), USB 2.0 with integrated PHY (1 port)

Graphics acceleration with LCD and touchscreen controllers for rich user interfaces

Interfaces: I2C, McASP (audio), McSPI, MMC/SD/SDIO, UART

Package: 298-ball NFBGA/LFBGA, 13 mm x 13 mm, surface-mount, lead-free, RoHS3 compliant

Ideal for embedded Linux/RTOS products needing compute, graphics, security, and connectivity in a compact BGA

Key Features

ARM Cortex-A8 core at 300 MHz

Single core, 32-bit architecture

NEON SIMD engine for multimedia and signal processing

Hardware crypto engine and true RNG

Ethernet 10/100/1000 Mbps (1)

USB 2.0 + integrated PHY (1)

LCD controller and touchscreen support

Graphics acceleration

LPDDR/DDR2/DDR3/DDR3L memory support

Interfaces: I2C, McASP, McSPI, MMC/SD/SDIO, UART

I/O voltages: 1.8 V and 3.3 V

Operating junction temperature: 0°C to 90°C

Surface-mount BGA; RoHS3 compliant

Supplier device package: 298-NFBGA (13x13)

Key Advantages

Strong balance of compute, graphics, and connectivity for cost-sensitive embedded designs

Mature Sitara ecosystem with broad OS support (Linux, RTOS) and community resources

Built-in security features lower BOM and simplify secure product design

Flexible memory options simplify sourcing and cost optimization

Compact 13x13 mm BGA with many I/O saves PCB space while enabling rich peripherals

Efficient power for fanless designs and extended operating life

Proven TI platform with stable long-term availability

Ready-to-ship stock: 2590 units for fast fulfillment

Packaging

Type: NFBGA/LFBGA, 298-ball grid array

Size: 13 mm x 13 mm body; fine-pitch ball grid suitable for high-density boards

Material: Plastic BGA with epoxy mold and lead-free solder balls; RoHS3 compliant

Mounting: Surface-mount; supplied in trays

Pin configuration: 298 balls covering DDR memory, Ethernet, USB, LCD, touchscreen, I2C, McASP, McSPI, MMC/SD/SDIO, UART, power, clock, and test pins

Thermal characteristics: Operating junction 0°C to 90°C; design with solid ground planes, thermal vias, and adequate copper for heat spreading; follow TI layout and thermal guidance

Electrical properties: 300 MHz ARM Cortex-A8 core; I/O levels 1.8 V and 3.3 V; integrated USB 2.0 PHY; Ethernet MAC; hardware cryptography and RNG; memory support for LPDDR/DDR2/DDR3/DDR3L

Lifecycle

Status: Active; widely used in long-life TI Sitara platforms and not nearing discontinuation

Family alternatives: Pin-compatible AM3352, AM3354, AM3356, AM3357, AM3358, AM3359. These variants offer different feature sets such as higher clock options, PRU-ICSS for industrial protocols, 3D graphics acceleration, and EtherCAT support. Review exact pinout and features in the datasheet before substitution

If you need an exact equivalent or drop-in replacement, contact our sales team via the Y-IC website for current cross-references and availability

Key Application Areas

HMI and operator panels with LCD and touch

Industrial control, PLCs, motion control, and gateways

Smart building and home automation controllers

Medical devices and patient monitoring systems

POS terminals, kiosks, and digital signage

IoT edge nodes and networked sensors

Audio and multimedia endpoints using McASP and NEON

Portable test gear and data logging instruments

Datasheet

Y-IC provides the most authoritative datasheet and technical resources for AM3351BZCE30 on our product page. Download the datasheet here to get full electrical specs, pin maps, mechanical drawings, layout and thermal guidelines, and design notes

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