Texas Instruments AM3352BZCEA60R

Mfr. Part

AM3352BZCEA60R

Manufacturer

Luminary Micro/Texas Instruments

Y-IC is a quality distributor for Luminary Micro/Texas Instruments. We deliver genuine parts, fast service, and professional support.

Detailed Description

Sitara AM3352 ARM Cortex-A8 microprocessor running up to 600 MHz. Single-core 32-bit MPU with NEON SIMD and multimedia co-processing. Rich connectivity: dual Gigabit Ethernet, dual USB 2.0 with integrated PHY, CAN, I2C, McASP (audio), McSPI, MMC/SD/SDIO, UART. Memory controller supports LPDDR, DDR2, DDR3, DDR3L. Graphics acceleration with LCD and touchscreen controllers. Hardware security with cryptography and random number generator. Industrial temperature capability (TJ -40°C to +105°C). 298-ball 13x13 mm NFBGA package for surface-mount designs. RoHS3 compliant. Available on Tape & Reel. Base product number AM3352. Series Sitara. In stock quantity: 2692.

Key Features

Core processor: ARM Cortex-A8, 1 core, 32-bit

Speed: up to 600 MHz

Co-processing: NEON SIMD, multimedia acceleration

Memory: LPDDR, DDR2, DDR3, DDR3L

Graphics: hardware acceleration; LCD and touchscreen controllers

Networking: 10/100/1000 Mbps Ethernet x2

USB: USB 2.0 with integrated PHY x2

Interfaces: CAN, I2C, McASP (audio), McSPI, MMC/SD/SDIO, UART

Security: cryptography engine, hardware RNG

I/O voltages: 1.8 V and 3.3 V

Operating temperature (TJ): -40°C to +105°C

Compliance: RoHS3

Mounting: surface mount

Package: 298-NFBGA (13x13 mm); supplier device package 298-NFBGA (13x13 mm)

Series: Sitara AM335x

Key Advantages

Proven Sitara platform with broad ecosystem and long-term availability

Connectivity-rich design reduces external components (dual GbE, dual USB PHY integrated)

Flexible memory options to meet cost and performance targets

Integrated display and touch control for fast HMI development

Built-in security blocks for protected data and secure boot architectures

Wide industrial temperature range for harsh environments

Compact 13x13 mm BGA footprint for space-constrained boards

RoHS3 lead-free compliance supports global regulatory requirements

Packaging

Supply type: Tape & Reel (TR) for automated assembly

Package family: 298-ball NFBGA; also referenced as 298-LFBGA in some documentation

Body size: 13 x 13 mm

Ball count and configuration: 298-ball grid array; detailed ball map and pitch in the datasheet

Materials: lead-free molded plastic package with organic substrate (RoHS3 compliant)

Mounting: surface mount BGA; reflow soldering

Thermal characteristics: junction temperature (TJ) -40°C to +105°C; thermal resistance values depend on PCB and heatsinking (see datasheet)

Electrical properties: I/O voltage rails at 1.8 V and 3.3 V; core and peripheral rails per datasheet; 600 MHz CPU; dual GbE up to 1000 Mbps; USB 2.0 up to 480 Mbps

Lifecycle

Status: Active and widely used; not nearing discontinuation as of the latest update

Family alternatives and equivalents (feature mix varies; check pinout and package compatibility):

- AM3351: baseline features, typically without 3D graphics acceleration

- AM3352: this device; balanced connectivity with graphics acceleration as specified

- AM3354: adds enhanced graphics features (e.g., 3D GPU in some variants)

- AM3356 / AM3357 / AM3358 / AM3359: include PRU-ICSS for industrial protocols; AM3359 adds EtherCAT support

- Upgrade path: AM437x family (higher performance, richer peripherals)

Compatibility note: Pin and package compatibility can vary across AM335x variants; confirm ball maps and ordering suffixes in the datasheet

If you need drop-in or feature-matched replacements, contact our sales team via the Y-IC website for tailored guidance

Key Application Areas

Industrial HMI panels and operator interfaces

Industrial gateways and protocol converters

Factory automation, PLC expansion, and motion control

Building automation controllers and smart energy devices

Medical instrumentation and patient monitors

Retail POS, kiosks, and barcode/label printers

IoT edge nodes and smart appliances

Robotics controllers and embedded vision front-ends

Datasheet

Y-IC provides the most authoritative, up-to-date datasheet for AM3352BZCEA60R on our product page. We recommend downloading the datasheet here to get full specifications, ball maps, power rails, thermal data, and design guidelines.

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