Texas Instruments AM3351BZCEA30R

Mfr. Part

AM3351BZCEA30R

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

Sitara AM3351 embedded microprocessor, single-core ARM Cortex-A8 running at 300 MHz. Designed for industrial and embedded applications that need rich peripherals, secure connectivity, and low power. Supports DDR2/DDR3/DDR3L/LPDDR memory, Gigabit Ethernet, USB 2.0 with integrated PHY, LCD/touchscreen display, and hardware security (crypto and RNG). RoHS3 compliant, surface-mount BGA package for compact, high-density layouts.

Key Features

CPU: ARM Cortex-A8, 32-bit, 1 core, NEON SIMD for multimedia acceleration

Frequency: 300 MHz

Memory subsystem: Controllers for LPDDR, DDR2, DDR3, DDR3L

Networking: 10/100/1000 Ethernet (1 port)

USB: USB 2.0 with integrated PHY (1 port)

Display: LCD controller with touchscreen interface, graphics acceleration enabled

Additional interfaces: I2C, McASP (audio), McSPI (SPI), MMC/SD/SDIO, UART

Security: Hardware cryptography engine and random number generator

Package and mounting: 298-ball NFBGA/LFBGA, 13 x 13 mm, surface mount

Operating temperature: -40°C to 105°C (TJ)

I/O voltages: 1.8 V and 3.3 V

Series: Sitara AM335x

Compliance: RoHS3 compliant

Availability: In stock quantity 2674 (subject to change)

Key Advantages

Rich built-in peripherals reduce external components and BOM cost

Low power ARM Cortex-A8 with NEON SIMD for efficient multimedia and UI tasks

Industrial-grade temperature range for harsh environments

Integrated security features for secure boot and data protection

Proven Sitara platform with broad ecosystem, tools, and community support

Scalable within AM335x family to match performance and interface needs

Long-term supply commitment typical of TI’s industrial lines

Packaging

Supply format: Tape and Reel (TR) for automated assembly

Package type: 298-ball NFBGA (also listed as LFBGA variant in family)

Package size: 13 mm x 13 mm body

Mounting: Surface mount, BGA reflow

Ball material and compliance: Lead-free balls (SnAgCu), RoHS3 compliant

Pin configuration: 298-ball grid; ball map includes power/ground, DDR memory, Ethernet, USB, LCD, audio (McASP), SPI (McSPI), I2C, MMC/SD/SDIO, UART, and control signals; refer to datasheet ball map for exact assignments

Thermal characteristics: Junction temperature up to 105°C; thermal performance depends on PCB design, copper area, vias, and airflow; use TI thermal guidelines for layout and consider heatsinking or airflow for higher loads

Electrical properties: I/O levels supported at 1.8 V and 3.3 V; core and peripheral rails as specified in TI power domains; observe power sequencing and decoupling per datasheet recommendations

Lifecycle

Status: Active production and widely deployed in industrial and embedded systems

Not near discontinuation based on current industry use; always check latest TI product notifications

Equivalent or alternative models:

- AM3351 family variants: Same core with different package/speed grades; check suffix options for temperature and package

- AM3352: Similar core; interface set varies (review USB/Ethernet/display features)

- AM3354: Adds enhanced graphics options in the family

- AM3357: Adds PRU-ICSS for real-time industrial protocols in some variants

- AM3358: Higher clock options and broader peripheral set; popular for industrial/HMI

- AM3359: Includes dual real-time units (PRU) suited for fieldbus/industrial Ethernet

- AM437x (Cortex-A9): Higher performance successor with broader connectivity

- AM62x (Cortex-A53): Modern, low-power 64-bit alternative for new designs

Features vary across alternatives (GPU, PRU, number of Ethernet, max CPU speed, display). Review datasheets or contact Y-IC for guidance.

If you need a drop-in or pin-compatible alternative and do not see one listed, please contact our sales team via the Y-IC website for tailored recommendations.

Key Application Areas

Industrial HMIs, operator panels, and touch displays

IoT gateways and edge computing nodes with Ethernet and USB

Building automation and smart energy controllers

Medical and laboratory instruments with secure data handling

Motor control and factory automation with real-time interfaces

Networked printers, scanners, and POS terminals

Consumer and prosumer devices requiring LCD and rich peripherals

Datasheet

Y-IC provides the most authoritative, up-to-date datasheet and technical documentation for AM3351BZCEA30R. For complete pin maps, power domains, timing, and thermal guidelines, download the datasheet directly from this page on our website.

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