STMicroelectronics STM32MP153AAA3

Mfr. Part

STM32MP153AAA3

Manufacturer

STMicroelectronics. Y-IC is a quality distributor for STMicroelectronics. We supply genuine parts, fast delivery, and professional technical support to help you get the best product and service experience.

Detailed Description

High-performance MPU from the STM32MP1 series integrating a dual ARM Cortex-A7 up to 650 MHz for Linux/Android applications plus an ARM Cortex-M4 up to 209 MHz for real-time control. Rich connectivity (Ethernet, USB, CAN, SPI, I2C, UART), display interfaces (LCD, HDMI-CEC), and external DDR memory support (DDR3/DDR3L/LPDDR2/LPDDR3). Packaged in a 448-ball lead-free LFBGA (18 x 18 mm). RoHS3 compliant. Designed for industrial temperature range and long-term embedded use.

Key Features

CPU complex: Dual ARM Cortex-A7 up to 650 MHz

Real-time core: ARM Cortex-M4 up to 209 MHz

Architecture: 32-bit, symmetric dual-core A7 + independent M4

Memory controllers: DDR3, DDR3L, LPDDR2, LPDDR3

Graphics/display: LCD controller, HDMI-CEC, graphics acceleration enabled

Networking: 10/100M Ethernet MAC (1x)

USB: Up to three USB 2.0 with integrated PHY, includes OTG capability

External interfaces: CAN, I2C, SPI, UART, MMC/SD/SDIO, SPDIF, USB, Ethernet

Security: ARM TrustZone (ARM TZ) support

I/O voltage: 2.5 V and 3.3 V domains

Operating temperature: -40 to +125°C (TA)

Mounting: Surface mount LFBGA

Compliance: RoHS3 compliant

Key Advantages

Heterogeneous processing: Run rich OS on Cortex-A7 while keeping deterministic control tasks on Cortex-M4

Flexible memory options: Broad DDR standards supported for cost, power, or performance targets

Strong connectivity: Multiple industrial and consumer interfaces reduce need for external glue logic

Display ready: Built-in LCD and HDMI-CEC ease HMI design

Industrial-grade temperature: Reliable operation from -40°C to +125°C

Scalable family: Pin/software compatibility across STM32MP1 variants shortens redesign time

Low BOM risk: Mature STM32 ecosystem, tools, and long-term availability from ST

Packaging

Type: 448-LFBGA (Low-Profile Fine-Pitch Ball Grid Array)

Material: Lead-free plastic BGA package with organic substrate (RoHS3 compliant solder balls)

Body size: 18 x 18 mm

Ball count and layout: 448-ball array; detailed ball map, assignments, and keep-out zones are defined in the datasheet and package application notes

Mounting: Surface mount, standard BGA reflow process

Thermal characteristics: Rated for -40°C to +125°C ambient; follow ST thermal guidelines for PCB stackup, copper area, and via arrays under the package to manage junction temperature; detailed θJA/θJC in the datasheet

Electrical properties: Multiple supply rails required (core, DDR, I/O); I/O domains at 2.5 V and 3.3 V; observe sequencing and decoupling recommendations in the datasheet

Shipment format: Tray

Lifecycle

Status: Active and in production per current market status. Not near discontinuation based on available information.

Equivalent or alternative models:

- Same family, similar footprint/features: STM32MP153 variants with different security/feature sets (STM32MP153A/C/D/F) in 448-LFBGA

- Scalable within family:

- STM32MP151 (single Cortex-A7 + Cortex-M4) for lower cost/power designs

- STM32MP157 (dual Cortex-A7 + Cortex-M4 with enhanced graphics/3D GPU options) for higher graphics needs

- Note: Exact pin compatibility and peripheral availability vary by suffix and option. Contact Y-IC sales for a verified drop-in list and cross-reference tailored to your PCB and firmware.

If you need cross-brand alternatives or cannot find a perfect match, please contact our sales team via the Y-IC website for expert guidance and the latest availability.

Key Application Areas

Industrial HMI panels, control terminals, and operator interfaces

Edge gateways, IoT concentrators, and protocol converters

PLCs, motor drives, robotics controllers with real-time control on M4

Smart home hubs and building automation controllers

Medical devices and data loggers (non-life-support)

Retail POS, kiosks, and digital signage

Audio devices with SPDIF and multi-interface connectivity

Secure embedded systems needing TrustZone partitioning

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet and technical documents for STM32MP153AAA3 on our product page. We highly recommend downloading the datasheet from this page to get pin maps, timing diagrams, electrical characteristics, PCB layout, and thermal guidelines.

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