Renesas Electronics America Inc R7F7010564AFP-C#AA4

Mfr. Part

R7F7010564AFP-C#AA4

Manufacturer

Renesas Electronics Corporation

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Detailed Description

Automotive-grade 32-bit microcontroller with 1.5 MB on-chip flash, 160 KB RAM, and 64 KB EEPROM in a 176-LFQFP package (24 x 24 mm). Runs at 96 MHz on the RH850G3K core. Rich analog and communication peripherals for robust vehicle and industrial control. RoHS3 compliant. Mounting type is surface mount. Series is RH850/F1L. Base product number is R7F7010564.

Key Features

32-bit RH850G3K single-core CPU at up to 96 MHz

Program flash 1.5 MB

RAM 160 KB

EEPROM 64 KB

150 I/O pins for complex designs

Operating temperature range -40°C to +125°C (TA)

Supply voltage 3.0 V to 5.5 V

Peripherals: DMA, Low-Voltage Detect (LVD), Power-On Reset (POR), Pulse Width Modulation (PWM), Watchdog Timer (WDT)

Connectivity: CANbus, CSI, IC, LINbus, SPI, UART/USART

Data converters: 28-channel 12-bit ADC and 32-channel 10-bit ADC

Internal oscillator for simpler clocking

Package options: 176-LFQFP (24 x 24 mm) supplier device package

RoHS3 compliant

Key Advantages

Designed for automotive and high-reliability control systems

Wide supply range supports 3.3 V and 5 V environments

High pin count and many peripherals reduce the need for external ICs

Strong analog capability with dual ADC resolutions and many channels

Robust communication with multiple CAN and LIN, plus SPI, UART/USART, CSI

Built-in safety and supervision functions (POR, LVD, WDT)

Internal oscillator cuts BOM cost and simplifies design

Mature RH850 family ecosystem and tools

Packaging

Type: 176-LFQFP (Lead-Frame Quad Flat Package), surface-mount

Material: Molded plastic epoxy body with copper lead-frame and tin-finished gull-wing leads

Body size: 24 mm x 24 mm nominal

Pin configuration: 176 gull-wing leads; high-density I/O. Refer to the datasheet for exact pinout and pitch

Mounting: Standard SMT reflow. Supplied in tray packaging for production handling

Thermal characteristics: Ambient operation -40°C to +125°C. LQFP has no exposed thermal pad; use PCB copper, ground planes, and airflow for heat spread. Check datasheet for thermal resistance values and derating

Electrical properties: Vcc 3.0 V to 5.5 V, internal oscillator available, ADC configuration 28 x 12-bit and 32 x 10-bit. For exact current consumption, ESD ratings, and timing, see the datasheet

Lifecycle

Status: RH850/F1L family devices are active and widely used. Not near discontinuation based on current information. For latest lifecycle updates, confirm with Y-IC

Equivalents and alternatives:

- Renesas RH850/F1L family variants with the same RH850G3K core and similar feature sets. Variants under the base product number R7F7010564 may differ by temperature grade, package, and peripheral options

- Other close options in the RH850 family such as RH850/F1KM-S or RH850/F1x lines that offer similar CAN/LIN, ADC, and clock capabilities

- Compatibility depends on pinout, memory sizes, and peripheral mix. Always verify details in the datasheets

If you need pin-compatible or functionally equivalent replacements, contact our sales team via Y-IC.com for a precise cross-reference and availability

Key Application Areas

Automotive ECUs: body control, gateways, door modules, HVAC, lighting

Powertrain and engine-related subsystems

Instrument clusters and dashboards

Motor and actuator control

Industrial controllers and communication nodes on CAN/LIN networks

Safety and supervision functions using WDT, POR, and LVD

Datasheet

Y-IC provides the most authoritative, up-to-date datasheet and technical resources for R7F7010564AFP-C#AA4. Download the datasheet on this page for full pinouts, timing, electrical limits, thermal data, and application guidance.

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