Renesas Electronics America Inc R7F7010573AFP-C#AA4

Mfr. Part

R7F7010573AFP-C#AA4

Manufacturer

Renesas Electronics Corporation

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Detailed Description

32-bit single-core RH850G3K microcontroller, 96 MHz, 2 MB on-chip Flash, 64 KB EEPROM, 192 KB RAM, 176-LFQFP (24 x 24 mm) package, 150 I/O pins. Wide 3.0 V to 5.5 V supply, -40°C to +105°C operating temperature. Rich automotive and industrial interfaces: CAN, LIN, SPI, UART/USART, CSI, IC. Integrated A/D converters (28 channels at 12-bit, 32 channels at 10-bit). Peripherals include DMA, LVD, POR, PWM, WDT. Part of the RH850/F1L series.

Key Features

RH850G3K 32-bit single-core CPU at up to 96 MHz

2 MB embedded Flash for code and data

64 KB EEPROM for non-volatile data storage

192 KB RAM for fast runtime operations

150 general-purpose I/O pins for broad interfacing

Connectivity: CANbus, LINbus, SPI, UART/USART, CSI, Input Capture

A/D conversion: up to 28 channels at 12-bit and 32 channels at 10-bit

Peripherals: DMA engine, Low-Voltage Detect, Power-On Reset, PWM, Watchdog Timer

Internal oscillator reduces external component count

Wide supply range: 3.0 V to 5.5 V (supports 5 V systems)

Temperature range: -40°C to +105°C (TA)

RoHS3 compliant, Pb-free lead finish

Surface-mount 176-LFQFP package, 24 x 24 mm body size

RH850/F1L series ecosystem and tooling

Key Advantages

Strong performance with low BOM: 96 MHz core and internal oscillator mean fewer external parts

Large embedded memory: 2 MB Flash + 64 KB EEPROM + 192 KB RAM supports complex applications and data logging

Broad I/O and buses: 150 I/O and multiple interfaces streamline connection to sensors, actuators, and networks

5 V-capable supply: easy integration with legacy automotive and industrial 5 V peripherals

Robust operation: LVD, POR, WDT improve reliability and safety

Flexible analog: dual-resolution ADC channels enable precise sensing across many inputs

Automotive-oriented RH850 platform: long-term availability, mature toolchains, and proven quality

Packaging

Type: 176-LFQFP (Low-profile Fine-pitch Quad Flat Package)

Shipment packaging: Tray (optimized for assembly lines and ESD-safe handling)

Material: Epoxy-molded plastic body, copper leadframe, Pb-free matte tin plating (RoHS3)

Size: 24 x 24 mm body, low-profile height

Pin configuration: 176 gull-wing leads; 150 user I/O pins; remaining pins for power, ground, analog, oscillator and system functions; fine-pitch leads typically around 0.5 mm (check datasheet for exact pitch)

Mounting: Surface mount; reflow soldering compatible

Thermal characteristics: No exposed thermal pad; heat spread via leads and PCB copper. Use solid ground planes, thermal vias, and adequate copper area to improve thermal dissipation. Follow Renesas recommendations for decoupling and layout.

Electrical properties: 3.0 V to 5.5 V supply, internal oscillator, multiple ADC blocks, integrated regulators and supervision (LVD/POR). Observe absolute maximum ratings and ESD handling as specified in the datasheet.

Lifecycle

Current status: Renesas RH850/F1L devices are generally active for long automotive lifecycles. Availability can vary by region and date. Verify current status with Y-IC.

Alternatives and equivalents: Close variants usually exist within the RH850/F1L family with different memory sizes, package options, and pinouts. Selection depends on exact pin compatibility, memory requirements, and interface needs.

- Family-level alternatives: RH850/F1L series parts in 176-LFQFP with similar Flash/RAM and the RH850G3K core

- Consider other RH850 families (for example F1x derivatives) if you need different I/O mixes or safety features

Because cross-compatibility depends on pinout, peripherals, and tooling, contact Y-IC for a precise cross-reference list and guidance. If a direct pin-to-pin equivalent is required, our sales and engineering teams will help select the right part.

Key Application Areas

Automotive body electronics: door modules, seat control, lighting, window lifters

Motor control and actuators: HVAC flaps, pumps, small DC/BLDC motors

Vehicle networks and gateways: CAN/LIN nodes, domain controllers in body systems

Industrial control: PLC I/O expansion, sensor hubs, human-interface controllers

Appliances and building automation: smart controllers with multiple analog inputs

Robotics and mechatronics: actuator control, sensor fusion nodes

General embedded systems needing many I/O, mixed-signal inputs, and 5 V compatibility

Datasheet

Y-IC provides the most authoritative datasheet and technical documents for this model. Visit our website and download the datasheet from the current product page for exact specifications, pin assignments, timing, electrical limits, and layout guidelines. Always design to the latest datasheet.

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