Renesas Electronics America Inc R7F7010554AFP-C#AA4

Mfr. Part

R7F7010554AFP-C#AA4

Manufacturer

Renesas Electronics Corporation

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Detailed Description

32-bit single-core automotive-grade microcontroller from the RH850 F1L series

2 MB embedded flash program memory

192 KB RAM and 64 KB EEPROM for fast data and nonvolatile storage

RH850G3K CPU core running up to 96 MHz for responsive control tasks

Rich peripherals and automotive communication interfaces

Wide supply range 3.0 V to 5.5 V and extended temperature range for harsh environments

144-pin LQFP package with 120 user I or O lines for flexible system design

RoHS3 compliant and lead-free manufacturing

Key Features

RH850G3K 32-bit single core up to 96 MHz

Program flash 2 MB

RAM 192 KB

EEPROM 64 KB

A or D converters dual resolution blocks 24 channels at 12-bit plus 24 channels at 10-bit for precise sensing

Peripherals DMA LVD POR PWM WDT for robust system control

Connectivity CAN bus LIN bus SPI UART or USART CSI and IC for automotive and industrial networks

Internal oscillator available for simplified clocking

120 I or O pins for broad interface coverage

Operating temperature minus 40 C to plus 125 C TA for wide ambient conditions

Supply voltage 3.0 V to 5.5 V for flexible power options

Surface mount package for high reliability manufacturing

Series RH850 or F1L targeted at automotive body and gateway applications

RoHS3 compliant materials and finishes

Key Advantages

Designed for automotive and mission critical control with wide temperature and voltage ranges

Large on-chip flash and EEPROM reduce external memory needs and simplify BOM

High I or O count in a compact 144-pin footprint supports complex designs without extra expanders

Built-in CAN and LIN interfaces ease vehicle network integration

Strong timer PWM and watchdog features improve real-time control and safety

Internal oscillator plus external clock options allow quick bring-up and design flexibility

Mature RH850 ecosystem tools libraries and application notes reduce development time

Packaging

Type 144-pin LQFP or LFQFP plastic quad flat package

Body size approximately 20 mm by 20 mm

Typical lead pitch 0.5 mm for fine pitch routing

Lead finish matte tin or equivalent RoHS3 compliant plating

Mounting surface mount suitable for automated reflow

Pin configuration 144 pins with 120 user GPIO multiple VDD or VSS supply pins CAN or LIN transceiver pins SPI UART or USART pins ADC inputs oscillator pins reset and debug pins

Thermal characteristics ambient operation minus 40 C to plus 125 C thermal performance depends on PCB copper area airflow and decoupling LQFP has no exposed thermal pad use solid ground planes and thermal vias to improve heat spreading

Electrical properties supply 3.0 V to 5.5 V internal oscillator available flash program memory 2 MB RAM 192 KB EEPROM 64 KB ADC 12-bit and 10-bit blocks I or O tolerant levels depend on pad type refer to datasheet for exact limits

Lifecycle

Status generally active in production for automotive use availability may vary by region and date

Not near discontinuation based on typical RH850 F1L family lifecycle planning

Equivalent or alternative models to evaluate

- Same family or pin compatible or grade variants RH850 or F1L series with the same base product number R7F7010554 but different suffixes for package temperature or option sets contact us to match exact pinout and features

- Other RH850 family options with similar core and peripherals for different memory sizes or packages examples include RH850 or F1K and RH850 or F1M series dependent on I or O count and memory configuration

- Cross-vendor functional alternatives not pin-compatible NXP S32K1xx family for CAN or LIN automotive MCUs Infineon AURIX TC2xx entry variants for automotive control Microchip dsPIC33 or PIC32 with CAN or LIN for value oriented designs

For exact drop-in equivalents and confirmed compatibility please contact our sales team via the Y-IC website and we will provide a tailored cross reference and availability update

Key Application Areas

Automotive body control modules BCMs door locks power windows sunroof and mirror control

LIN or CAN network nodes actuators and sensors

Instrument cluster and gateway controllers

HVAC blower and flap control

Lighting control LED drivers and dimmers

Small motor control pumps fans seat adjusters

Industrial controllers and smart modules needing high I or O count and robust communication

Datasheet

Our website hosts the most authoritative datasheet and technical resources for this product model

We recommend downloading the datasheet directly from this page to get the latest specifications pinout timing and design guidelines

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