Renesas Electronics America Inc R7F7010574AFE#KA4

Mfr. Part

R7F7010574AFE#KA4

Manufacturer

Renesas Electronics Corporation

Y-IC is a quality distributor of Renesas. We provide genuine parts, fast service, and reliable support to deliver the best products and experience.

Detailed Description

Automotive-grade 32-bit single-core microcontroller with 2 MB on-chip Flash, 64 KB EEPROM, 192 KB RAM, rich analog and communication interfaces, and wide supply range. Packaged in a 176-pin Low-Profile Quad Flat Package (24 x 24 mm) for surface-mount assembly. Designed for robust operation from -40°C to 105°C.

Key Features

Core processor RH850G3K, 32-bit single-core, up to 80 MHz

Program memory 2 MB Flash

EEPROM 64 KB

RAM 192 KB

I/O lines 150

Interfaces CAN, LIN, SPI, UART/USART, I2C, CSI

Peripherals DMA, PWM, Watchdog Timer

Data converters up to 28-channel 10-bit ADC and up to 32-channel 12-bit ADC

Internal oscillator, external clock options supported

Supply voltage 3.0 V to 5.5 V

Operating temperature -40°C to +105°C

RH850/F1L series, automotive-focused

RoHS3 compliant

Key Advantages

Automotive reliability and long-term availability from Renesas

High integration reduces external components and BOM cost

Broad voltage range (3.0–5.5 V) simplifies power design across vehicle systems

Rich CAN/LIN and serial connectivity for modern automotive networks

Strong analog capability with dual-resolution ADC channels for precise sensing

Proven RH850 ecosystem with tools and software support

Compact 176-pin LFQFP enables dense designs while providing 150 GPIOs

Internal oscillator for simple clocking, with option for external precision

Packaging

Device package type 176-LFQFP (Low-Profile Quad Flat Package)

Body size 24 mm x 24 mm, thin profile for space-constrained designs

Lead count 176, fine-pitch gull-wing leads on four sides

Pin configuration 44 pins per side, ample 150 GPIO available for application mapping

Material epoxy mold compound with lead-frame; matte tin plated leads for solderability

Mounting type surface mount, compatible with standard reflow profiles

Thermal characteristics no exposed thermal pad; heat dissipation via PCB copper and leads; design with adequate copper pour and vias for best results

Electrical properties supply 3.0–5.5 V, internal oscillator; integrated ADCs and peripherals as listed above

Shipping packaging tray for safe handling and assembly

Supplier device package 176-LFQFP (24 x 24)

Manufacturer package case 176-LQFP family

Lifecycle

Status actively supported within the RH850/F1L series based on publicly available information

Not flagged as nearing discontinuation at this time

Equivalent or alternative models highly application-dependent (memory size, package, pinout, peripheral mix). To find a precise pin-compatible or feature-equivalent option within the RH850/F1L or related RH850 families, please contact our sales team via the Y-IC website for a tailored cross-reference and availability

For second-source or cross-family comparisons (e.g., different Renesas MCU families), our team can recommend options after reviewing your requirements

Key Application Areas

Automotive body control modules and gateways

Door, window, mirror, seat, and HVAC control units

Instrument clusters and driver information systems

Lighting control, wiper control, and motor control

LIN and CAN node controllers across the vehicle

Industrial controllers requiring robust temperature and voltage ranges

Datasheet

Y-IC hosts the most authoritative datasheet for this product model. We recommend downloading the datasheet directly from this page on our website for complete specifications, pinouts, and design guidelines.

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