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| Part Number: | EP1S10F672I7N |
|---|---|
| Manufacturer/Brand: | Intel |
| Part of Description: | IC FPGA 345 I/O 672FBGA |
| Datasheets: |
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| RoHs Status: | Lead free / RoHs compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 1.425V ~ 1.575V |
| Total RAM Bits | 920448 |
| Supplier Device Package | 672-FBGA (27x27) |
| Series | Stratix® |
| Package / Case | 672-BBGA |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Number of Logic Elements/Cells | 10570 |
| Number of LABs/CLBs | 1057 |
| Number of I/O | 345 |
| Mounting Type | Surface Mount |
| Base Product Number | EP1S10 |




EP1S10F672I7N
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Stratix family FPGA in a 672-ball FBGA package (27x27). 10,570 logic elements, 1,057 LABs/CLBs, 920,448 total RAM bits, and 345 user I/O. Core supply 1.425 V to 1.575 V. Surface-mount device, tray packaging. Operating junction temperature −40°C to +100°C. Base product number EP1S10. Supplier device package 672-FBGA (27x27). Available stock: 1336 units.
Stratix architecture for high-density, high-performance FPGA designs
10,570 logic elements for complex logic
1,057 LABs/CLBs for scalable design partitioning
920,448 embedded RAM bits for buffering and FIFOs
345 programmable I/O for broad interface coverage
672-ball FBGA, 27x27 footprint for compact, high-pin-count layouts
Core voltage range: 1.425 V to 1.575 V for performance and power balance
−40°C to +100°C operating junction temperature for industrial environments
Surface-mount for automated assembly
Stratix series ecosystem and toolchain support
High logic density enables consolidation of functions into a single device
Large RAM and I/O counts support data-heavy and interface-rich applications
Proven Stratix platform reduces design risk and speeds time to market
Fine-pitch BGA provides reliable high-speed interconnect and compact board area
Flexible reprogrammability for iterative development and in-field updates
Type: FBGA (Fine-Pitch Ball Grid Array), 672 balls
Body size: 27 x 27 (per supplier device package notation)
Mounting: Surface-mount
Delivery: Tray
Pin configuration: 672-ball grid; 345 user I/O available
Thermal characteristics: Operating junction temperature −40°C to +100°C; use standard thermal design practices (adequate copper area, airflow/heatsinking as needed)
Electrical properties: Core supply 1.425 V to 1.575 V; Stratix FPGA fabric with embedded RAM totaling 920,448 bits and 10,570 logic elements
Status: This is a mature Stratix (first-generation) device. Availability may be limited. Lifecycle can vary by lot and region; check current status before committing to new designs.
Potential form-factor alternatives within the same EP1S10 family (verify pinout and compatibility): EP1S10F484…, EP1S10F780…, EP1S10F1020… (different packages and I/O counts)
Potential upgrade paths (not drop-in equivalents; verify design changes): Stratix II (EP2S…), Stratix III/IV, or Cyclone series for cost/power trade-offs
If you need exact equivalents or vetted alternatives, please contact our sales team via the Y-IC website for up-to-date recommendations and compatibility guidance
Communications and networking equipment (MAC, packet processing, bridging)
High-speed data acquisition and signal processing
Industrial control, automation, and machine vision
Test and measurement instrumentation
Medical imaging and embedded systems prototyping
Memory controllers, interface bridging, and custom accelerators
Y-IC hosts the most authoritative datasheet for EP1S10F672I7N on our product page. We recommend downloading the datasheet here to get full specifications, pinouts, timing, and design guidelines.
Get a Quote on Y-IC today. Learn More and secure your pricing and lead time. Limited Time Offer for available stock—act now to lock in inventory and support.
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