Intel EP1S10F672C6N

Mfr. Part

EP1S10F672C6N

Manufacturer

Intel. Y-IC is a quality distributor for Intel products and we will provide you with the best authentic products, professional support, and fast service

Detailed Description

Stratix family FPGA, base device EP1S10. 10,570 logic elements with 1,057 LABs/CLBs, 920,448 total RAM bits, and 345 user I/Os. Packaged in a 672-ball Fine-Pitch BGA, 27 mm x 27 mm body. Core supply 1.425 V to 1.575 V. Commercial temperature grade, junction 0 to 85 °C. Surface-mount device. Supplied in trays. Suitable for high I/O, mid-density reconfigurable logic designs

Key Features

Family and series Stratix EP1S10 base device

Logic resources 10,570 logic elements and 1,057 LABs or CLBs

Embedded memory 920,448 total RAM bits

I/O 345 user I/O pins in the package

Package 672-FBGA, 27 x 27 mm body size, also referenced as 672-BBGA

Operating temperature 0 °C to 85 °C junction for commercial grade

Core voltage 1.425 V to 1.575 V

Mounting Surface mount

Supplier device package 672-FBGA (27x27)

Shipment packaging Tray

Quantity available from provided data 1,915 units subject to prior sale and confirmation

Key Advantages

Strong logic density in a compact 27 mm square BGA footprint

High I/O count enables wide memory, bus, and interface connectivity

Mature, proven Stratix architecture for stable long-term deployed systems

Low core voltage range helps reduce core power versus older 2.5 V cores

Flexible fit for communications, industrial, and test applications where mid-range FPGA density and many I/Os are needed

Packaging

Type Tray shipment for assembly lines

Semiconductor package 672-FBGA, 27 mm x 27 mm body, fine-pitch ball grid array

Pin configuration 27 x 27 ball matrix, 672 total balls with 345 user I/O pins, remaining balls dedicated to power, ground, configuration, and clocks as per datasheet ball map

Materials Standard molded plastic over organic substrate with lead-free solder balls typical for N-suffix parts, RoHS directionally indicated by N suffix

Mounting Surface mount BGA reflow compatible

Thermal characteristics Commercial junction range 0 to 85 °C. Actual thermal resistance depends on board, airflow, and heatsinking. Follow Intel thermal guidelines for BGA FPGAs

Electrical properties Core supply VCC 1.425 V to 1.575 V. I/O bank supply levels and allowable standards depend on bank and standard selection. Consult the datasheet for supported I/O standards, bank voltages, and decoupling requirements

Lifecycle

Status The original Stratix EP1S10 family is a mature product and may be at NRND or EOL status depending on ordering code and region. Availability can be limited and lead times can vary

Drop-in equivalents Same device and footprint alternates typically differ by speed or temperature grade. Examples within the same family and 672-FBGA footprint can include EP1S10F672C5N and EP1S10F672C7N for different speed grades, and industrial-temp variants if available. Verify pin-to-pin and timing in the official datasheet before substitution

Package or density alternates Other EP1S10 ordering codes in different BGA sizes exist, such as 780-ball and 1020-ball variants, but these are not pin-compatible

Next-generation or functional alternatives For new designs, consider newer Intel families such as Cyclone 10, Arria V or 10, and Stratix IV or V depending on required transceivers, logic density, power, and cost. These are not pin-compatible and will require redesign and revalidation

If you need a precise lifecycle statement or vetted alternates Contact Y-IC sales via our website. We will check live factory notices and propose verified equivalents or cross-brand options tailored to your design constraints

Key Application Areas

Communications and networking line cards, protocol bridging, packet processing

Industrial control, motion systems, PLC expansion, custom interfaces

Test and measurement instruments, data acquisition, pattern generation

Embedded compute offload, hardware accelerators for legacy buses

High-speed memory and parallel I/O aggregation in legacy systems

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for this exact model on our product page. We strongly recommend downloading the datasheet here to get full specifications, pin maps, timing data, thermal guidelines, and design notes

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