Intel EP1S10F672C7AA

Mfr. Part

EP1S10F672C7AA

Manufacturer

Intel (Altera). Y-IC is a quality distributor for this brand and we will provide you with the best products and services

Detailed Description

Stratix EP1S10 FPGA in a 672-ball fine-pitch BGA package (27 x 27 mm). 345 user I/O, 10,570 logic elements/cells, 1,057 LABs/CLBs, and 920,448 total RAM bits. Core supply 1.425 V to 1.575 V. Commercial temp range with junction temperature 0°C to 85°C. Surface-mount. Supplied in tray packaging. Main Category: Integrated Circuits (ICs). Small Classification: Embedded – FPGAs (Field Programmable Gate Array). In-stock quantity: 2601 units

Key Features

Stratix family EP1S10 device for mid-density FPGA designs

10,570 logic elements and 1,057 LABs/CLBs for flexible logic implementation

920,448 bits of embedded RAM for buffering, FIFOs, and on-chip storage

345 I/O for high connectivity and parallel interfaces

672-ball FBGA package for compact, high-pin-count designs

Core voltage range 1.425 V to 1.575 V (nominal 1.5 V)

Commercial operating junction temperature 0°C to 85°C

Surface-mount for automated assembly

Key Advantages

Balanced logic density and I/O count for networking, industrial, and embedded use

Large on-chip RAM reduces external memory needs and lowers latency

Mature Stratix architecture with proven reliability in production systems

Fine-pitch BGA enables high interconnect density in space-constrained boards

Backed by Y-IC’s quality sourcing, inspection, and support

Packaging

Type: 672-ball FBGA; also referenced as 672-BBGA in some sources

Material: Molded plastic BGA with organic substrate

Size: 27 mm x 27 mm body footprint (fine-pitch ball grid array)

Pin configuration: 672 balls total with 345 user I/O; remaining balls for power, ground, configuration, and dedicated pins

Mounting: Surface-mount (SMT), compatible with standard reflow profiles

Thermal characteristics: Junction temperature 0°C to 85°C; use proper heatsinking/airflow if power density is high

Electrical properties: Core supply 1.425 V to 1.575 V; I/O supplies and supported standards depend on bank configuration (see datasheet for exact I/O standards)

Shipment form: Tray

Lifecycle

Status: Mature legacy product; availability can vary by region and date. It may be NRND or approaching end-of-life in some channels. Check with Y-IC for current status

Equivalent or alternative models (same EP1S10 family, different packages/speed grades; verify pinout and timing):

- EP1S10F780C7

- EP1S10F484C7

- EP1S10F672C6

- EP1S10F780C6

Note: These are not guaranteed drop-in replacements. Package, speed grade, and pinout differences may require PCB and timing changes. Always confirm compatibility with the datasheet and our engineering support

Modern alternatives for new designs (not pin-compatible; performance and power differ):

- Stratix II family (e.g., EP2S15 devices)

- Stratix IV low-density options

- Cyclone III/IV/V families for lower power and cost

For a precise cross-reference tailored to your design, please contact our sales team via the Y-IC website

Key Application Areas

Wired and wireless communications infrastructure

Networking and packet processing

Industrial control and automation

Test and measurement equipment

Medical imaging and instrumentation

Embedded computing and hardware prototyping

High-speed data acquisition and interface bridging

Datasheet

Y-IC provides the most authoritative datasheet for EP1S10F672C7AA on our product page. We recommend downloading it from our website now for complete specifications, pinouts, I/O standards, configuration details, and design guidelines

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