Infineon Technologies S29GL512P10FAIR10

Mfr. Part

S29GL512P10FAIR10

Manufacturer

Cypress Semiconductor (Infineon Technologies)

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Detailed Description

512Mbit 3V NOR Flash memory, parallel x16 interface, 100 ns access time, industrial temperature -40°C to 85°C, surface-mount 64-ball FBGA (11 mm x 13 mm), RoHS3 compliant. Organization 32M x 16. GL-P series. Base product number S29GL512. Supplied in bulk packaging. Typical operating voltage 3.0 V to 3.6 V. Quantity available: 2530 units.

Key Features

512Mbit density for large code and data storage

Parallel x16 interface for simple bus connection and fast random reads

100 ns access time for quick code execution-in-place (XIP)

3.0 V to 3.6 V single-supply operation

NOR technology for reliable, byte-addressable reads

Industrial temperature range (-40°C to 85°C)

64-FBGA (11x13) compact package; also referenced as 64-LBGA in documentation

RoHS3 compliant; lead-free

GL-P series consistency across densities and packages

Standard control signals (CE#, OE#, WE#, RESET#, WP#) for robust system integration

Key Advantages

Fast random read and XIP support reduce system RAM needs and boot times

Stable 3V operation simplifies power design

Proven NOR reliability for code storage and frequent reads

Industrial temperature rating supports harsh environments

Parallel interface is straightforward to design in and debug

Compact BGA footprint saves PCB space

Broad ecosystem and long-running GL-P family improve lifecycle confidence

Packaging

Type: 64-ball FBGA (also referred to as LBGA in some lists)

Material: Molded plastic package, lead-free plating, RoHS3 compliant

Size: 11 mm x 13 mm body outline; low-profile BGA

Pin/ball configuration: 64 balls including x16 data bus (DQ0–DQ15), address lines, and control pins (CE#, OE#, WE#, RESET#, WP#, BYTE# as applicable)

Thermal characteristics: Qualified for -40°C to 85°C ambient (TA). Use standard lead-free reflow profiles; ensure adequate PCB copper for heat spreading. For precise thermal resistance values, see the datasheet.

Electrical properties: 3.0 V to 3.6 V supply, 100 ns access time, 32M x 16 organization, parallel NOR interface; write cycle time (word/page) 100 ns per provided parameters

Lifecycle

Current status: Active in many designs; lifecycle status may vary by region and package. Not flagged as near discontinuation in general market listings.

Equivalent/alternative models:

- Same-family, same density: Other S29GL512P variants with different packages or speed grades are available. Exact ordering codes vary by speed, temperature grade, and package (FBGA vs TSOP). Contact us for a vetted, pin-compatible code.

- Same-family, related densities: S29GL256P (256Mbit) and S29GL128P (128Mbit) for drop-in family behavior when lower density is acceptable.

- Cross-vendor parallels (3V parallel NOR, x16, similar density): Options exist from manufacturers such as Micron and Macronix in 512Mbit parallel NOR families. Pinouts, command sets, and sector architecture can differ.

Important: For a guaranteed compatible replacement (pinout, timing, sectoring, and command set), please contact our sales team via the Y-IC website. We will provide a verified cross-reference and availability.

Key Application Areas

Code storage and boot memory for MCUs and SoCs (XIP)

Industrial controllers, PLCs, HMIs

Networking gear, routers, telecom systems

Automotive infotainment and telematics (non-safety critical, -40°C to 85°C)

Consumer electronics, set-top boxes, printers, scanners

Medical and test instruments requiring fast random read access

IoT gateways and embedded systems needing robust non-volatile code memory

Datasheet

Y-IC hosts the most authoritative datasheet for S29GL512P10FAIR10 on our product page. We recommend downloading the datasheet here to get exact pinouts, timings, command set, sector architecture, and thermal guidelines.

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