Infineon Technologies S29GL512P10FAIR22

Mfr. Part

S29GL512P10FAIR22

Manufacturer

Cypress Semiconductor (Infineon Technologies)

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Detailed Description

512 Mbit NOR Flash memory for code storage and execute-in-place

Parallel x16 interface, 3.0 to 3.6 V supply

100 ns read access, 100 ns program timing

Industrial temperature range minus 40 to plus 85 degrees Celsius

64-ball FBGA package 11 x 13 mm, surface mount

GL-P series, RoHS3 compliant

Available on tape and reel

Current available quantity 2573 units (subject to change)

Key Features

Capacity 512 Mbit (64 MB)

Organization 32M x 16

Interface parallel x16 bus for fast, direct memory access

Read access 100 ns for quick code execution

Supply voltage 3.0 to 3.6 V

Operating temperature minus 40 to plus 85 degrees Celsius (TA)

Technology Flash NOR, non-volatile memory

Package 64-FBGA 11 x 13 mm, also referenced as 64-LBGA

Mounting type surface mount

RoHS3 compliant, lead-free

Series GL-P, base product number S29GL512

Shipment packaging tape and reel

Key Advantages

Fast random read for execute-in-place applications

Proven reliability of NOR Flash for code storage

Simple parallel interface for easy MCU and ASIC integration

Industrial-grade temperature for harsh environments

Stable 3 V operation with wide supply margin

Long data retention and robust endurance typical of NOR technology

Mature GL-P family with broad ecosystem and documentation

Packaging

Type 64-ball FBGA, low-profile molded plastic package

Size 11 mm x 13 mm footprint

Material lead-free BGA balls and RoHS3 compliant molding compound

Pin configuration 64-ball grid with x16 data bus (D0–D15), address bus, and standard control pins such as CE#, OE#, WE#, RESET#, WP# typical of parallel NOR

Thermal characteristics industrial ambient rating minus 40 to plus 85 degrees Celsius; BGA design aids heat spreading

Electrical properties VCC 3.0 to 3.6 V, 100 ns read access, parallel interface, non-volatile NOR Flash technology

Supplier device package 64-FBGA 11 x 13 mm

Shipment packaging tape and reel for automated assembly

Lifecycle

Current status active in widespread industrial use based on market availability

Not flagged as nearing discontinuation in commonly available sources at time of writing

Equivalent or alternative models to consider

- Same family S29GL512P variants with different speed grades, temperature grades, and packages within GL-P series (for example TSOP56 or alternate FBGA codes)

- Cross-vendor parallels often used in similar designs such as Macronix MX29GL512F and Micron M29W512GL families

Important check pinout, timing, voltage, and sector architecture before substitution

If you need a curated, verified list of drop-in or near-drop-in alternatives, contact Y-IC sales via our website for the latest lifecycle status and cross-reference support

Key Application Areas

Boot code and firmware storage for embedded systems

Industrial control, HMI, PLCs, and automation

Automotive infotainment, instrument clusters, and telematics (industrial temp range)

Networking equipment such as routers and base stations

Medical and instrumentation devices

Office equipment and printers

Smart meters and utility devices

General-purpose execute-in-place code memory

Datasheet

Y-IC provides the most authoritative and up-to-date datasheet for this product on our website. Download the datasheet directly from this page to get detailed specifications and design guidance.

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