BGA S29GL512P10FFCR2

Mfr. Part

S29GL512P10FFCR2

Manufacturer

BGA

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Detailed Description

High‑density parallel NOR Flash memory part from the S29GL512P family. Designed for 3 V systems with fast read access and x8/x16 data bus support. Packaged in BGA for compact footprint and reliable board connection.

Main Category: Integrated Circuits (ICs)

Small Classification: Specialized ICs

In‑stock quantity: 2654 units

Package code: 0916

Key Features

512 Mbit (64 MB) non‑volatile NOR Flash

Parallel interface, x8 and x16 bus options

3 V operation for both core and I/O

Fast read access (suffix “10” indicates about 100 ns class)

Uniform sector architecture for easier erase management

Program/erase suspend and resume for real‑time responsiveness

Hardware and software sector protection features

Low‑power standby and deep power‑down modes

Lead‑free, RoHS‑compliant build (suffix “R2” indicates RoHS variant)

BGA package for high pin count and stable interconnects

Key Advantages

Execution‑in‑Place (XiP) capability for direct code execution from Flash

High reliability for firmware storage and frequent reads

Mature ecosystem and broad design‑in history

Stable long‑term supply channels for parallel NOR

Compact BGA footprint saves board space

Strong data retention and endurance, ideal for embedded systems

Simple, intuitive sector erase/program workflows

Packaging

Type: BGA (Ball Grid Array)

Materials: Epoxy molding compound body; lead‑free solder balls (typically Sn/Ag/Cu); copper pads and internal leadframe

Size: Compact, low‑profile BGA form factor (exact dimensions vary by revision; contact us for the mechanical drawing)

Pin configuration: High‑pin‑count ball array suited for x8/x16 parallel NOR; common implementations use 64‑ball arrays (ball pitch often around 1.0 mm; confirm exact pinout in the datasheet)

Thermal characteristics: Good thermal path through ball array; typical θJA depends on PCB stack‑up and airflow; observe derating at elevated ambient temperatures

Electrical properties: 3.0 V nominal supply; fast read access; low standby currents; higher currents during program/erase operations; I/O levels compatible with typical 3 V logic

Package code noted: 0916 (use this code for logistics and handling references)

Lifecycle

Current market status: Generally active across many distributors, though specific suffixes may vary by OEM lifecycle policies

Not nearing discontinuation for many deployments, but check exact suffix availability for long‑term commitments

Possible equivalents or alternatives (verify pinout, voltage, timing, and sector architecture):

- Infineon/Cypress S29GL512P family variants with different speed or package codes

- Infineon/Cypress S29GL512N or S29GL512S (newer GL families; parallel NOR)

- Micron MT28EW512 series (parallel NOR Flash)

- ISSI IS29GL512 series (parallel NOR Flash)

- Macronix MX29GL512 family (parallel NOR Flash)

If you need a drop‑in replacement or a vetted cross reference, contact our sales team on the Y-IC website and we will provide a detailed compatibility check.

Key Application Areas

Embedded firmware storage and direct code execution (XiP)

Industrial controllers and HMIs

Networking and telecom equipment (routers, base stations, optical modules)

Automotive infotainment and control modules (verify temperature grade)

Consumer electronics (set‑top boxes, printers, smart appliances)

Medical and instrumentation systems

IoT gateways and edge devices needing reliable boot Flash

Datasheet

Y-IC hosts the most authoritative datasheet for S29GL512P10FFCR2 on our product page. Download it now from this page for exact pinout, timings, electrical limits, mechanical drawings, and lifecycle notes.

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