Microchip Technology M1AFS1500-1FGG256K

Mfr. Part

M1AFS1500-1FGG256K

Manufacturer

Microchip Technology

Y-IC is a quality distributor for Microchip Technology products and legacy Micrel and Microsemi lines. We focus on delivering authentic parts, fast logistics, and responsive technical support to ensure you get the best products and services.

Detailed Description

Fusion family flash-based mixed-signal FPGA with approximately 1.5 million system gates, 119 user I O, and 276,480 total embedded RAM bits. Nonvolatile instant-on architecture with integrated analog monitoring features typical of Fusion devices. Packaged in a 256-ball fine-pitch BGA 17 x 17 mm for surface-mount designs. Core supply 1.425 V to 1.575 V. Industrial extended junction temperature rating from minus 55 C to 100 C TJ. RoHS3 compliant. Base product number M1AFS1500. Ideal for designs that need reliable startup, low power, and tight control of system power rails and sensors.

Key Features

Flash-based nonvolatile FPGA fabric for instant-on and secure configuration

Fusion mixed-signal architecture with on-chip analog monitoring and control blocks

Approx 1.5M system gates for substantial logic capacity

276,480 RAM bits for FIFOs, buffers, and data processing

119 user I O in 256-ball BGA footprint

Wide operating junction temperature range minus 55 C to 100 C suitable for harsh environments

Core supply 1.425 V to 1.575 V low-power operation

Surface-mount 256 FPBGA 17 x 17 mm form factor for compact layouts

RoHS3 compliant lead-free manufacturing

Part of the Microchip Fusion series with strong reliability and security characteristics

Key Advantages

Instant-on operation removes external configuration memory and speeds system bring-up

Nonvolatile flash configuration improves security and immunity to single-event upsets compared to SRAM-based FPGAs

Integrated analog monitoring enables board-level power sequencing, voltage and temperature sensing, and system health management within the FPGA

Low power consumption supports battery-powered and thermally constrained designs

Deterministic startup and robust operation over extended temperature range

Mature ecosystem and long-term support from Microchip Technology

Packaging

Type Tray

Package family 256-ball fine-pitch BGA also referenced by the manufacturer as FPBGA or LBGA

Body size 17 mm x 17 mm

Ball count 256 with 119 user I O available the remaining balls are power ground clock programming and dedicated functions

Mounting Surface mount compatible with standard BGA assembly and reflow processes

Material Molded organic BGA substrate with lead-free solder balls compliant with RoHS3

Thermal characteristics Junction temperature minus 55 C to 100 C typical thermal performance benefits from BGA ball grid heat spreading and proper PCB copper plane design

Electrical properties Core supply 1.425 V to 1.575 V typical Fusion support for common I O standards such as LVCMOS LVTTL and LVDS through multiple I O banks consult the datasheet for exact bank voltages and standards

Supplier device package 256 FPBGA 17 x 17 noted by code FGG256K in ordering

Lifecycle

Status The Fusion family is a mature product line supported by Microchip Technology for long-life and industrial programs

Nearing discontinuation Current market information suggests continued availability however lifecycle details can change and should be confirmed for your schedule

Equivalent or alternative models

- Same family and similar logic density M1AFS1500-1FGG484K higher ball-count package verify footprint and pinout

- Lower densities in same family M1AFS600-1FGG256K M1AFS900-1FGG256K for cost or power optimization pinouts differ

- Newer mixed-signal platforms SmartFusion and SmartFusion2 families for enhanced processing and security not pin-compatible but functional alternatives

- ProASIC3 and IGLOO families for ultra-low-power nonvolatile FPGA needs without analog integration functional alternatives

If you need drop-in equivalents or confirmed lifecycle timelines contact Y-IC via our website sales team for the latest official status and cross recommendations

Key Application Areas

Power rail sequencing and system power management with integrated sensing and control

Industrial control and automation needing deterministic startup and robust operation

Instrumentation and test systems with embedded monitoring and flexible digital logic

Medical and laboratory equipment with low power and high reliability needs

Communications and networking boards requiring instant-on FPGAs for supervisory and glue logic

Aerospace and defense industrial-grade projects benefiting from nonvolatile flash-based architecture and extended temperature range

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for M1AFS1500-1FGG256K. For complete specifications pinouts electrical limits I O standards and design guidelines download the datasheet directly from this page on our website. We strongly recommend reviewing the datasheet before final design decisions.

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