Microchip Technology M1AFS1500-1FGG256

Mfr. Part

M1AFS1500-1FGG256

Manufacturer

Micrel / Microchip Technology

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Detailed Description

Flash based FPGA from the Fusion series with 1.5M system gates and 119 user I O in a 256 ball fine pitch BGA

Nonvolatile architecture for instant on behavior and secure configuration

Total embedded RAM 276480 bits

Core supply range 1.425 V to 1.575 V

Commercial temperature grade 0 to 85 C junction

Mounts on PCB by surface mount

RoHS3 compliant

Available stock quantity 2667 units

Base product number M1AFS1500

Key Features

Fusion family flash based FPGA fabric for instant on and secure configuration

1.5M system gates for mid to high complexity logic designs

119 user I O with banked I O architecture

276480 bits of embedded RAM for FIFOs buffers and scratchpad

Low core voltage operation for reduced power

256 ball FPBGA package size 17 mm by 17 mm for compact layouts

Tray packing for manufacturing efficiency

Typical Microchip FPGA toolchain support for synthesis place and route and programming

JEDEC compatible lead free reflow profile

Designed for long life and reliable operation in embedded systems

Key Advantages

Instant on no external configuration memory required

Nonvolatile flash configuration improves security versus SRAM FPGAs

Lower static power than many SRAM based FPGAs

Robust RoHS3 compliance with lead free balls suitable for global manufacturing

Mature ecosystem and long term supply commitment from Microchip

Compact package with good thermal and signal integrity characteristics

Packaging

Package type 256 FPBGA fine pitch ball grid array also referenced as 256 LBGA in some documentation confirm before layout

Body size 17 mm by 17 mm low profile plastic molded package with organic laminate substrate

Ball count 256 arranged in a matrix pattern typical BGA ball map provided in the datasheet

Ball alloy lead free SAC type per RoHS3 requirements reflow per J STD 020

Mounting method standard surface mount with solder reflow

Pin configuration 119 user I O balls plus power ground configuration pins clock pins and configuration pins ball map in datasheet

Thermal characteristics operating junction temperature 0 to 85 C follow JEDEC reflow and board level thermal design best practices use solid ground planes via arrays and adequate copper for heat spreading

Electrical properties core supply 1.425 V to 1.575 V I O bank voltages and supported standards are defined in the datasheet decouple each power rail with low ESL capacitors placed close to balls

Lifecycle

Product family is mature and widely deployed availability may vary by package and speed grade and some variants may be approaching limited availability

Not all speed grades and packages are recommended for new designs check current status

Contact Y IC if you need confirmation of lifecycle or specific date codes

Equivalent same family options M1AFS600 lower gate count Fusion series devices in various BGA packages

Alternative Microchip families depending on needs SmartFusion2 M2S devices for FPGA plus ARM Cortex M3 SoC integration IGLOO2 M2GL devices for low power nonvolatile FPGA ProASIC3 A3P devices for cost optimized flash FPGA

Note on alternatives pinouts features and I O counts differ review datasheets for compatibility and migration effort

If a direct drop in equivalent is required and not listed visit our website and contact our sales team for detailed cross reference and availability

Key Application Areas

Industrial control programmable logic for PLC extensions sensor fusion and power sequencing

Embedded control glue logic state machines bus bridging and protocol adaptation

Power management sequencing and monitoring when paired with external analog front ends

Communications interface hubs for SPI I2C UART CAN and custom serial links

Instrumentation timing control data conditioning and trigger logic

Medical and laboratory devices reliable instant on control logic

Security systems tamper resistant configuration and deterministic startup

Datasheet

Our website hosts the most authoritative datasheet for this product model

Download the datasheet on this page to get the full ball map electrical limits timing and design guidelines

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