Microchip Technology AFS1500-1FGG256K

Mfr. Part

AFS1500-1FGG256K

Manufacturer

Micrel / Microchip Technology

Y-IC is a quality distributor for Micrel / Microchip Technology. We deliver original parts, fast service, and reliable support to help you choose and use this device with confidence.

Detailed Description

Fusion series flash-based mixed-signal FPGA with 1.5M system gates, 276,480 RAM bits, and 119 user I/O. Packaged in a 256-FPBGA (17 mm x 17 mm) fine-pitch BGA for surface-mount assembly. Core supply 1.425 V to 1.575 V. Wide junction temperature range -55°C to 100°C. RoHS3 compliant. Supplied in tray. Base product number AFS1500.

Key Features

Family: Fusion (flash-based, non-volatile FPGA)

System gates: 1,500,000

Total RAM: 276,480 bits

User I/O: 119

Package: 256-FPBGA, 17 x 17 mm body

Alternate case reference: 256-LBGA

Supplier device package: 256-FPBGA (17x17)

Mounting: Surface mount

Operating junction temperature: -55°C to 100°C

Core supply voltage: 1.425 V to 1.575 V

RoHS: ROHS3 compliant

Shipment packaging: Tray

Base product number: AFS1500

Quantity available: 2563 units (subject to change; contact sales for latest stock)

Key Advantages

Non-volatile, instant-on operation; no external configuration memory required

Low power consumption typical of flash-based FPGAs

High reliability and robust operation over wide temperature range

Secure design storage in on-chip flash

Fine-pitch BGA footprint saves board space while enabling high I/O density

Simplified power architecture with single low core voltage range

Proven Fusion family platform for mixed-signal and control applications

Packaging

Type: Fine-Pitch Ball Grid Array (FPBGA), 256 balls; also referenced as LBGA in some sources

Body size: 17 mm x 17 mm square

Ball layout: 16 x 16 grid (256 total); 119 balls assigned to user I/O and the rest to power, ground, and dedicated pins

Material: Lead-free, RoHS3 compliant plastic BGA package with organic substrate

Mounting: Surface mount; reflow compatible per JEDEC standards

Thermal characteristics: Junction temperature range -55°C to 100°C; follow datasheet for thermal design and profiles

Electrical properties (core): 1.425 V to 1.575 V supply; refer to datasheet for I/O bank voltages, timing, and power profiles

Shipment format: Tray for safe handling and automated pick-and-place

Lifecycle

General status: Mature, long-lived family supported by Microchip. No public end-of-life notice indicated for this specific code at our latest update. For confirmation and current status, contact Y-IC sales.

Equivalent or alternative models (verify pin-compatibility and specifications in the datasheet):

- Same family, different densities: AFS250-1FGG256K, AFS600-1FGG256K, AFS1000-1FGG256K

- Same density, alternate speed grade: AFS1500-2FGG256K

- Newer-generation alternatives from Microchip (feature sets differ; check requirements): SmartFusion2 M2S050, M2S090, M2S150; IGLOO AGL1000; ProASIC3 A3P1000

If you need a drop-in equivalent or a vetted alternative beyond these, please contact our sales team via the Y-IC website for tailored guidance.

Key Application Areas

Industrial control, PLCs, and factory automation

Motor control and power management

Instrumentation, test and measurement

Communications and networking equipment

Medical electronics and portable devices

Aerospace and defense electronics requiring instant-on and high reliability

Embedded systems needing mixed-signal integration with deterministic startup

Datasheet

Y-IC hosts the most authoritative datasheet for AFS1500-1FGG256K on our product page. We recommend downloading it now for complete electrical, timing, thermal, and pinout details.

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