Microchip Technology AFS1500-1FGG256I

Mfr. Part

AFS1500-1FGG256I

Manufacturer

Micrel / Microchip Technology

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Detailed Description

Flash-based Fusion FPGA for mixed-signal designs. 1.5M system gates, 119 user I/O, 256-ball fine-pitch BGA package (17 mm x 17 mm), RoHS3 compliant. Core supply 1.425 V to 1.575 V. Embedded SRAM 276,480 bits. Industrial junction temperature -40°C to 100°C. Surface-mount. Base product number AFS1500. Package shipped in trays.

Key Features

Non-volatile flash FPGA fabric that is instant-on and does not require external configuration memory

Fusion mixed-signal integration combining digital logic with on-chip analog resources and robust clocking

1.5M system gates for mid-density logic and control applications

119 programmable I/O for flexible board connectivity

276,480 bits of embedded SRAM for FIFOs, buffers, and small on-chip memories

Rich clocking with PLLs and internal oscillators for stable timing

Low power operation and deterministic startup behavior

JTAG boundary scan and in-system programming support

RoHS3 compliant and industrial temperature capability

Supported by Microchip Libero SoC design tools

Key Advantages

Instant-on startup improves system reliability and reduces boot time

Flash configuration storage offers strong immunity to soft errors compared to SRAM FPGAs

Low power consumption reduces heat and power budget

Single-chip programmable logic solution cuts BOM and saves board space

Mature ecosystem and long-term availability from Microchip

Simple power architecture with 1.5 V core and banked I/O supplies

Easy migration within the Fusion family for different densities and packages

Packaging

Type 256-ball fine-pitch BGA

Size 17 mm x 17 mm square body

Ball array typically 16 x 16 with depopulated corners for mechanical and routing optimization

Material plastic molded encapsulation over organic laminate substrate

Mounting surface-mount, compatible with standard Pb-free reflow profiles

Pin configuration 119 user I/O, dedicated JTAG and control pins, multiple power and ground balls

Thermal characteristics junction temperature -40°C to 100°C, actual thermal performance depends on PCB design, airflow, and heatsinking

Electrical properties core supply 1.425 V to 1.575 V, I/O banks support common single-ended and differential standards (e.g., LVCMOS, LVDS on supported pairs)

Lifecycle

Current status mature and widely deployed; no public end-of-life notice known at the time of writing

For up-to-date status confirmation, contact Y-IC sales for the latest manufacturer guidance

Equivalent and alternative models

- Fusion family density options AFS600 (lower density) and AFS2500 (higher density)

- Related non-volatile FPGA families IGLOO, IGLOO2, ProASIC3 for pure digital implementations

- SmartFusion and SmartFusion2 for FPGA with integrated microcontroller and enhanced security

- Other package variants of AFS1500 may be available (e.g., higher ball-count options) for more I/O

If you need a pin-compatible or drop-in equivalent, please reach out via our website so our team can provide exact part recommendations

Key Application Areas

Industrial control, automation, and mixed-signal power management

Motor control and drives with fast startup requirements

Medical instrumentation and monitoring devices

Aerospace and defense subsystems needing instant-on and high reliability

Communications and networking equipment

Consumer and embedded systems targeting low power programmable logic

Secure and safety-critical systems benefiting from non-volatile configuration

Datasheet

Our website hosts the most authoritative and up-to-date datasheet for AFS1500-1FGG256I. Download it from this page for complete specifications, pinouts, timing, and design guidelines.

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