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| Part Number: | EP2AGX65CU17C4G |
|---|---|
| Manufacturer/Brand: | Intel |
| Part of Description: | IC FPGA 156 I/O 358UBGA |
| Datasheets: |
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| RoHs Status: | RoHS Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
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Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $397.0557 |
| 30+ | $377.1027 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 0.87V ~ 0.93V |
| Total RAM Bits | 5371904 |
| Supplier Device Package | 358-UBGA, FCBGA (17x17) |
| Series | Arria II GX |
| Package / Case | 358-LFBGA, FCBGA |
| Package | Tray |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Number of Logic Elements/Cells | 60214 |
| Number of LABs/CLBs | 2530 |
| Number of I/O | 156 |
| Mounting Type | Surface Mount |
| Base Product Number | EP2AGX65 |




The EP2AGX65CU17C4G device belongs to Intel’s Arria II GX family of Field Programmable Gate Arrays (FPGAs), built on a 40-nm process node. Featuring a cost-optimized programmable logic platform, the device supports up to 156 user I/O signals within a 358-ball FineLine Ball Grid Array (FBGA) and Ultra FineLine BGA (UBGA) packages. Its architectural focus is ease-of-use, low power, and streamlined support for high-speed transceiver and I/O applications, making it ideal for systems demanding rich connectivity and high logic efficiency.
Designed for use in markets ranging from wireless infrastructure and wireline networking to broadcast, storage, and computing, the EP2AGX65CU17C4G leverages mature toolchains including Intel’s Quartus II software and extensive IP libraries. Its high-speed connectivity, low power requirements, and support for popular serial protocols position it squarely for modern, feature-rich electronic systems.
The EP2AGX65CU17C4G Arria II GX FPGA provides a suite of capabilities engineered for demanding applications:
Advanced Adaptive Logic Modules (ALM): These form the core logic elements, delivering high efficiency with eight-input, fracturable look-up tables which enable denser logic implementation and faster operation.
Embedded Memory Logic Array Blocks (MLABs): Suitably optimized for small FIFO and SRAM functions, these offer flexible logic-to-memory conversion.
DSP Blocks: High-performance blocks operate up to 550 MHz, configurable for different multiplier precision (9x9, 12x12, 18x18, or 36x36 bit), and incorporate hardcoded arithmetic functions.
Low Power Operation: Through architectural techniques, including PMA optimizations (100 mW typical at 3.125 Gbps), the device supports significant reductions in operational power, a crucial selection factor for high-density and mobile environments.
Extensive I/O: Supporting up to 20 modular I/O banks and up to 726 user I/O pins (model-dependent), with wide-ranging single-ended and differential standards.
Integrated Design Flow: Full compatibility with MATLAB, DSP Builder, and Quartus II software for streamlined IP integration and easy prototyping.
At the system level, the EP2AGX65CU17C4G distinguishes itself through robust bandwidth and multi-protocol support:
Transceivers: Hosts up to 24 full-duplex clock-data-recovery transceivers, scalable between 600 Mbps and 6.375 Gbps.
Serial Protocols: Dedicated on-chip circuitry enables rapid deployment of standards including PCI Express Gen1/Gen2, Ethernet, Serial RapidIO, CPRI, Fibre Channel, SATA/SAS, GPON, SDI (SD/HD/3G/ASI), OBSAI, XAUI/RXAUI, Interlaken, and JESD204.
Hard IP Blocks: Full PIPE protocol solution, embedding PHY/MAC, Data Link, and Transaction layer logic for PCIe, reducing design cycle time and risk.
Such extensive protocol support allows EP2AGX65CU17C4G to serve in interface-heavy designs such as networking switch fabrics, next-generation wireless base stations, broadcast routers, and storage controllers.
The Arria II GX architecture underlying EP2AGX65CU17C4G is built for scalable integration:
Hierarchical Clock Networks: Up to 192 distinct clock domains, supporting global, regional, and periphery networks, with up to eight PLLs (10 outputs each) for precise clock synthesis.
Modular LABs: Each comprises 10 ALMs, enabling granular logic duplication, shared arithmetic, and register chaining, with paired MLABs for flexible memory deployment.
Embedded Block RAM: M9K/M144K memory structures provide fast, deep on-chip memory for buffering, packet processing, and line storage.
Migration Capability: Supported vertical package migration ensures pin-compatible upgrades within the device family for evolving application requirements.
High-speed connectivity in EP2AGX65CU17C4G is enabled by a comprehensive transceiver suite:
On-chip calibration for transmitter and receiver terminations (OCT), ensuring reliable high-frequency operation and signal integrity.
Flexible datapath configuration enables proprietary protocol implementation, coupled with programmable pre-emphasis and equalization for high-ISI and lossy channel environments.
Diagnostic Features: Integrated serial and parallel loopback modes, on-die pattern generators, and error status reporting, facilitating in-situ protocol debugging and compliance verification.
These capabilities directly benefit engineers designing multi-lane serial interfaces, storage appliances, and backplane communications links, where data integrity and robust operation are paramount.
Memory architecture in EP2AGX65CU17C4G is hybrid and high-performance:
Embedded MLAB, M9K, and M144K RAM blocks deliver up to 20,836 Kbits of configurable on-chip memory, supporting clock rates up to 540 MHz.
Application-tailored as RAM, FIFO buffers, or ROM, these resources enable packet buffering, HD video processing, and efficient data stalling for embedded processors.
Quartus II integration allows both megafunction-based and inferable memory instantiation from HDL, streamlining integration and RTL productivity.
The DSP resources in EP2AGX65CU17C4G are optimized for real-time intensive operations:
Programmable input registers for efficient FIR, IIR, and other advanced filtering applications.
Versatile multiplier configurations serve communications, video, and audio processing, aligned with LTE, 3G baseband, and high-definition broadcast deployments.
On-the-fly DSP mode configuration through megafunctions and direct HDL inference, accelerating application-specific adaptation.
I/O flexibility is central to the EP2AGX65CU17C4G model:
Up to 20 modular banks enable system-level partitioning, with support for a broad spectrum of standards (single-ended/differential, voltage-referenced, BLVDS, LVDS, mini-LVDS, RSDS).
Dedicated OCT hardware for single-ended and differential impedance matching, with bank-level calibration for robust external memory and interface designs.
LVDS integration supports speeds up to 1.25 Gbps, with dynamic phase alignment (DPA) for channel skew compensation, enabling high-reliability source-synchronous and serial interfaces.
Sophisticated clock control is provided by:
Dedicated PLLs with programmable outputs for custom clock domains and counter cascading, supporting both spread-spectrum clock inputs and granular jitter filtering.
Unused transceiver PLLs may be repurposed by the FPGA core, maximizing utilization flexibility across application needs.
Clock management infrastructure assures robust timing and reference alignment across complex, multi-clock systems.
For engineers focused on deployment reliability and IP protection, the EP2AGX65CU17C4G delivers comprehensive solutions:
Multiple configuration schemes, including active/passive serial, fast passive parallel, and JTAG.
On-chip 256-bit AES bitstream encryption for volatile and non-volatile key based security, mitigating reverse engineering and tampering risks.
Remote system upgrade capability, allowing secure, error-free updates from remote locations, with rollback and error recovery features.
SEU mitigation supported via CRC verification and real-time error status monitoring, accessible through JTAG/core interface.
IEEE Std. 1149.1/1149.6 compliant boundary scan testing for high-speed serial channels and pin-level diagnostics, facilitating manufacturing and field test scenarios.
For engineering teams considering alternatives, several models within the Arria II GX device family can be considered, depending on system requirements:
Other Arria II GX FPGAs with differing logic densities, I/O counts, speed grades (-3, -4, -5, -6), or package footprints offer vertical migration for scalability or cost optimization.
Arria II GZ devices, for projects requiring extended transceiver count or PCIe Gen2 protocol support.
For interfaces requiring enhanced memory or arithmetic throughput, models with greater embedded memory or DSP block counts may be preferable.
Selection should be driven by project-specific criteria: density, I/O bank requirements, packaged footprint compatibility, transceiver count, and targeted protocol support.
: Engineering Value and Practical Considerations for EP2AGX65CU17C4G Arria II GX FPGA
The EP2AGX65CU17C4G from Intel’s Arria II GX family represents a robust, cost-optimized FPGA solution for bandwidth-intensive, high-reliability applications. Its mix of logic efficiency, embedded memory, and versatile protocol support—paired with low power consumption and advanced design security—enables engineering teams to deliver high-performance, scalable systems with accelerated development cycles.
For product selection engineers and procurement specialists, factoring in package options, transceiver support, migration paths within the Arria II GX family, and integration compatibility with existing tools and IP libraries is vital. The device’s design-for-ease architecture ensures it can handle evolving interface and computing requirements while maintaining manageable risk and total cost of ownership for new and existing projects.
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