Intel EP2AGX65CU17C5NES

Mfr. Part

EP2AGX65CU17C5NES

Manufacturer

Intel. Y-IC is a quality distributor of Intel products and we will provide you with the best products and services.

Detailed Description

Intel Arria II GX FPGA, base product EP2AGX65. 60,214 logic elements, 2,530 LABs/CLBs, 5,371,904 total RAM bits. 156 user I/O. 358-ball FCBGA/UBGA, 17 mm x 17 mm body size. Core supply 0.87 V to 0.93 V. Commercial junction temperature 0°C to 85°C. Surface-mount, tray packaging. Quantity available: 2,697.

Key Features

Arria II GX series FPGA with high logic density (60k LE class)

2,530 LABs/CLBs for parallel logic

5.37 Mbits of embedded RAM for buffers, FIFOs, and on-chip memory

156 I/O for flexible interfacing

Multi-gigabit serial transceivers (GX family) for high-speed links

Rich I/O standards support (LVDS, LVCMOS, and typical SSTL/HSTL families)

Integrated PLLs and clock management typical of Arria II GX devices

PCI Express support (GX family) and common high-speed protocols

Commercial temperature range (Tj 0°C to 85°C)

Low core voltage range (0.87–0.93 V) for reduced power

Key Advantages

Strong balance of performance, logic capacity, and memory for mid-range designs

Proven, stable Arria II GX platform for long-running systems and upgrades

High-speed serial capability for PCIe and Gigabit-class connectivity

Flexible I/O and clocking to simplify board design

Lower core voltage helps reduce power and heat

Mature tool support and ecosystem

Packaging

Type: Fine-pitch BGA (FCBGA/UBGA), 358 balls, surface-mount

Material: Lead‑free, RoHS-compliant solder balls (SnAgCu) on organic laminate substrate; molded plastic encapsulation

Size: 17 mm x 17 mm body; low-profile BGA

Pin configuration: 358-ball grid. 156 balls are user I/O; remaining balls are power, ground, transceiver lanes, configuration pins, clocks, and JTAG. Banked I/O arrangement for multiple standards

Thermal characteristics: Junction temperature 0°C to 85°C (commercial). BGA conducts heat through balls and PCB copper; ensure good airflow and copper area; consider heatsinking if power is high

Electrical properties: Core supply 0.87–0.93 V. I/O banks support common standards (e.g., LVDS, LVCMOS, SSTL/HSTL). Dedicated transceiver supplies and reference clocks typical for GX devices

Supplier device package: 358‑UBGA, FCBGA (17x17)

Tray packaging for handling and assembly

Lifecycle

Status: Arria II GX is a mature Intel FPGA family. Many devices in this family are limited for new designs (NRND) or in the process of EOL. The “ES” suffix typically denotes Engineering Sample; please verify production suitability

Availability: Stock is limited and can change quickly. Contact Y-IC sales for current supply and lead time

Equivalent or alternative models:

- Same family, same base device: Other EP2AGX65 variants in different speed grades and packages (commercial vs. industrial, different BGA ball counts). Pin compatibility depends on package and I/O banking

- Newer Intel families offering similar or upgraded capability:

- Arria V GX (5AGX series): Newer generation mid-range transceiver FPGA

- Arria 10 (10AX series): Higher performance and efficiency, broader transceiver options

- Cyclone V GX/GT (5CGX series): Lower power, cost-optimized with transceivers for moderate speeds

- Stratix IV GX (EP4SGX series): Higher-end option within a similar era, more transceiver channels

- Important: Pin-for-pin compatibility is not guaranteed across families; migration requires redesign

If you need a drop-in equivalent or a precise alternative list by package and speed grade, please contact our sales team via the Y-IC website for a detailed cross and migration guidance

Key Application Areas

PCI Express endpoints and bridging

Gigabit Ethernet, 10G interface bridging (via transceivers and MAC IP)

Industrial networking and control

Test and measurement equipment

Broadcast and video processing pipelines

Medical imaging and instrumentation

Aerospace and defense subsystems (non-radiation applications)

Storage, RAID, and high-speed interconnects

Embedded acceleration and custom coprocessing

Datasheet

Y-IC hosts the most authoritative datasheet for this product model. We recommend downloading the EP2AGX65CU17C5NES datasheet from this page on our website for the latest specifications, pinout, thermal guidance, and design notes.

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