NXP USA Inc. S9S12G64AMLHR

Mfr. Part

S9S12G64AMLHR

Manufacturer

Freescale / NXP Semiconductors

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Detailed Description

16-bit HCS12-family microcontroller with 64KB Flash, 4KB RAM, and 2KB EEPROM in a 64-LQFP (10 x 10 mm) package. Operates from 3.13V to 5.5V, up to 25 MHz, with rich automotive/industrial peripherals including 12-channel 10-bit ADC, CAN, LIN, SPI, SCI, PWM, watchdog (WDT), power-on reset (POR), and low-voltage detect (LVD). Qualified for -40°C to +125°C ambient. RoHS3 compliant. Mounting: surface-mount.

Key Features

Core and performance

- 16-bit HCS12 12V1 core, up to 25 MHz

- HCS12 series (S12G family), base product number S9S12

Memory

- 64KB Flash (64K x 8)

- 4KB RAM (4K x 8)

- 2KB EEPROM (2K x 8)

Peripherals

- 12-channel 10-bit ADC (A/D 12x10b)

- PWM, WDT, POR, LVD

Connectivity

- CAN bus, LIN bus

- SCI (UART), SPI

- IrDA support

I/O and package

- 54 general-purpose I/O pins

- 64-LQFP (10 x 10 mm), surface-mount

Power and clock

- Supply 3.13V to 5.5V (5V-capable MCU)

- Internal oscillator

Environmental and compliance

- Operating temperature -40°C to +125°C (TA)

- RoHS3 compliant

Logistics

- Tape & Reel (TR) packaging option available

Key Advantages

Automotive-grade temperature range and robust 5V supply support

Integrated EEPROM simplifies non-volatile parameter storage—no external EEPROM needed

Rich, proven HCS12 ecosystem with extensive toolchain and software examples

CAN and LIN on-chip for cost-effective in-vehicle networking and industrial fieldbus

Low system BOM: on-chip oscillator, ADC, PWM, and supervisory functions reduce external components

Mature, widely used platform—stable firmware reuse across S12 family variants

Packaging

Type: 64-LQFP, surface-mount

Body size: 10 mm x 10 mm nominal

Pin count: 64 pins (approximately 54 available as GPIO; remaining pins for power, ground, clock, etc.)

Lead pitch: typical for LQFP-64; confirm exact pitch in the datasheet

Material: molded epoxy encapsulation; lead-free finish; RoHS3 compliant

Tape & Reel (TR) for automated assembly

Thermal characteristics: ambient operating temperature -40°C to +125°C; junction-to-ambient thermal resistance depends on PCB layout and airflow—see datasheet for guidance

Electrical properties (high level): VDD 3.13V to 5.5V; internal oscillator available; exact current consumption and I/O characteristics depend on mode and load—refer to datasheet

Moisture sensitivity: per JEDEC MSL; check unit label and datasheet (LQFP devices are commonly MSL 3—verify for this specific code)

Lifecycle

Status: Generally active within NXP’s established S12G/HCS12 portfolio. For the latest lifecycle status, verify on NXP’s site or contact Y-IC.

Nearing discontinuation: Not indicated at this time based on typical S12 longevity policies; confirm current status to be sure.

Equivalent or alternative models (same family, similar pinout/package; always confirm pin compatibility and features in the datasheet):

- S9S12G48AMLHR (48KB Flash, 64-LQFP)

- S9S12G96AMLHR (96KB Flash, 64-LQFP)

- S9S12G128AMLHR (128KB Flash, 64-LQFP)

- Other S12G variants in 64-LQFP with different memory sizes may be available

If you need a drop-in or functionally close alternative not listed here, please contact our sales team via the Y-IC website for tailored recommendations and real-time availability

Key Application Areas

Automotive body electronics: window/lift control, door modules, seat control, HVAC, lighting control

Instrument clusters and display modules (basic gauge/control)

Industrial control and automation: small motor/actuator control, pumps, valves, relay control

Building and home appliances: HVAC controllers, white goods, smart sensors

Networked nodes using CAN, LIN, SPI, or UART/SCI

General-purpose embedded control requiring 5V operation and integrated EEPROM

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for S9S12G64AMLHR. We strongly recommend downloading it directly from this product page on our website to obtain exact specifications, pin assignments, timing, electrical limits, and thermal data.

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