NXP USA Inc. S9S12G64ACLFR

Mfr. Part

S9S12G64ACLFR

Manufacturer

NXP Semiconductors (formerly Freescale). Y-IC is a quality distributor for NXP and we will provide you with the best products and services

Detailed Description

16-bit HCS12 microcontroller with S12V1 core. 64KB Flash program memory, 4KB RAM, 2KB EEPROM. 25 MHz max clock. 40 I/O pins. 12-channel 10-bit ADC. Built-in peripherals: PWM, watchdog (WDT), power-on reset (POR), low-voltage detect (LVD). Serial connectivity: CANbus, LINbus, SPI, SCI (UART), IrDA. Internal oscillator. Supply voltage 3.13–5.5 V. Operating temperature -40°C to +85°C (TA). Package 48-LQFP (7 x 7 mm), surface-mount, RoHS3 compliant. Main Category: Integrated Circuits (ICs). Small Classification: Embedded - Microcontrollers. Current stock available: 2573 units

Key Features

S12V1 16-bit CPU core up to 25 MHz

64KB Flash, 4KB RAM, 2KB EEPROM

12 x 10-bit analog-to-digital converter channels

Communication interfaces: CAN, LIN, SPI, SCI (UART), IrDA

Peripherals: PWM, WDT, POR, LVD

40 configurable I/O pins

Operating voltage 3.13–5.5 V

Operating temperature -40°C to +85°C (TA)

Internal oscillator

48-LQFP (7 x 7 mm) package

RoHS3 compliant

Series: HCS12, Base product number: S9S12

Key Advantages

Proven, mature HCS12 platform with long industry use

Wide supply range supports both 3.3 V and 5 V designs

On-chip EEPROM for reliable data logging and calibration storage

Built-in CAN and LIN for automotive and industrial networks

Internal oscillator reduces external components and cost

Robust peripheral set for control, monitoring, and safety

Stable operation across -40°C to +85°C ambient

Easy migration within the S12G family for memory/peripheral scaling

Packaging

Type: 48-LQFP low-profile quad flat package; surface-mount

Material: Molded plastic (epoxy) body with copper lead frame; lead-free matte-tin plated leads

Size: 7 mm x 7 mm body; low package height suitable for compact PCBs

Pin configuration: 48 leads (12 per side). 40 GPIO available; dedicated pins for CAN/LIN, SPI, SCI, PWM, ADC, power and ground

Thermal characteristics: Rated -40°C to +85°C ambient; thermal performance depends on PCB copper area and airflow. Use ground planes and thermal vias to improve heat spreading

Electrical properties: 3.13–5.5 V supply, 25 MHz max clock, 12 x 10-bit ADC, integrated LVD and POR, ESD protection per series standards

Shipping format: Tape & Reel (TR) for automated assembly

Lifecycle

Status: Active within NXP’s HCS12 portfolio based on current information; not near discontinuation

Family compatibility: Code and peripheral compatibility within S12G simplifies upgrades or downgrades

Equivalent or alternative models (verify pinout, memory size, and peripherals before use)

- S9S12G32ACLFR (32KB Flash; same package; lower memory)

- S9S12G64BCLFR (64KB Flash; B-revision silicon; same package)

- S9S12G96ACLFR (96KB Flash; same series; confirm pin mapping)

- S9S12G128ACLFR (128KB Flash; same series; resources may vary)

- Suffix variants such as S9S12G64ACLF in tray or alternate packing (confirm exact suffix for packing and finish)

If you need a pin-for-pin drop-in or a fully equivalent part, contact our sales team via the Y-IC website for detailed cross-reference and availability

Key Application Areas

Automotive body electronics: door, window, seat, sunroof, lighting control

In-vehicle networks: LIN/CAN nodes, sensor/actuator modules, gateway controllers

Industrial control: distributed I/O, small motor/pump controllers, process control

Appliances and HVAC: fan and compressor control, thermostats, zone controllers

Instrumentation and data logging: metering interfaces, battery management auxiliaries

Connectivity bridges: UART/SCI-to-CAN/LIN, SPI protocol adapters

General embedded systems needing mixed-signal ADC and 5 V capability

Datasheet

Our Y-IC product page hosts the most authoritative datasheet for S9S12G64ACLFR. We recommend downloading it here to get complete pinouts, timing, electrical specs, and design guidelines

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