Xilinx XC6SLX100-N3FG676I

Mfr. Part

XC6SLX100-N3FG676I

Manufacturer

AMD Xilinx

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Detailed Description

Spartan-6 LX family FPGA, density class XC6SLX100, speed grade -3, industrial temperature grade I

676-ball flip‑chip BGA package, 27 mm x 27 mm body, surface-mount

480 user I/Os, 101,261 logic cells, 7,911 LABs or CLBs, 4,939,776 total RAM bits

Core supply 1.14 V to 1.26 V

Operating junction temperature -40 °C to 100 °C

RoHS status contains lead, non‑compliant

Part status active, manufacturer standard lead time about 10 weeks

Available quantity 2537 units at Y-IC

Key Features

Series Spartan-6 LX XC6SLX100 base part

Logic resources 101,261 logic elements or cells

Configurable logic blocks 7,911 LABs or CLBs for flexible digital design

On‑chip memory 4.94 Mb total RAM bits for FIFOs, buffers, and data storage

I/O resources up to 480 user I/Os for broad interface coverage

Package 676-FCBGA, 27 x 27 mm, surface mount

Supply core voltage range 1.14 V to 1.26 V for low‑power operation

Temperature range industrial grade, TJ -40 °C to 100 °C

Moisture Sensitivity Level MSL 4, floor life 72 hours at ≤30 °C/60% RH

Tooling supported by AMD Xilinx ISE design flows and mature IP ecosystem

Key Advantages

Strong balance of logic, memory, and I/O for mid‑to‑high complexity designs

Industrial temperature capability increases reliability in harsh environments

Mature, widely deployed platform with stable toolchain and broad community support

Low core voltage helps reduce power

Flip‑chip BGA enhances electrical and thermal performance compared to wire‑bond

Active lifecycle and predictable lead time simplify planning

Ideal for sustaining and extending legacy Spartan-6 designs without a full redesign

Packaging

Type flip‑chip ball grid array suitable for high‑density, high‑performance FPGA mounting

Material organic substrate with leaded solder balls, contains lead

Size 27 mm x 27 mm body for compact board footprint

Ball count 676 balls, high‑pin‑count for rich interfaces

Pin configuration supports up to 480 user I/Os; refer to datasheet for bank layout and ball map

Mounting surface‑mount technology; use standard BGA assembly processes

Thermal characteristics TJ -40 °C to 100 °C; ensure airflow or heatsinking as needed for workload

Moisture Sensitivity Level MSL 4, floor life 72 hours; dry pack trays; bake if floor life is exceeded

Electrical properties core supply 1.14 V to 1.26 V; consult datasheet for Vcco per I/O standard and decoupling guidelines

Standard pack 40 units per tray typical; shipped in ESD‑safe dry packing

Lifecycle

Status active and not nearing discontinuation based on current data

Manufacturer standard lead time about 10 weeks; plan procurement accordingly

RoHS note contains lead; if you require Pb‑free, consider the following closely related models

Pin‑compatible and family‑compatible options in the same FG676 footprint, verify pinout and I/O bank requirements

XC6SLX100-3FG676I Pb‑free RoHS compliant, speed grade -3, industrial temperature

XC6SLX100-2FG676I Pb‑free RoHS compliant, speed grade -2, industrial temperature

XC6SLX100-1FG676I Pb‑free RoHS compliant, speed grade -1, industrial temperature

Other Spartan‑6 LX densities in FG676 (for cost or power tradeoffs, verify pin compatibility in datasheet)

XC6SLX75-FG676I

XC6SLX45-FG676I

Migration alternatives requiring redesign (not drop‑in)

Artix‑7 XC7A100T family for newer process, lower power, and enhanced features

If you need more alternatives, package changes, or lifecycle confirmations, contact our sales team via the Y-IC website for detailed guidance

Key Application Areas

Industrial automation and control, PLCs, motion and motor control

Networking and communications, Ethernet switching, baseband and protocol bridging

Video and image processing, camera interfaces, display scaling, surveillance

Test and measurement, data acquisition, instrumentation, pattern generation

Medical electronics, portable diagnostics, signal conditioning

Aerospace and defense instrumentation, rugged embedded systems

IoT gateways and edge processing, flexible hardware acceleration

Consumer and prosumer electronics requiring configurable high‑I/O logic

Datasheet

Our website hosts the most authoritative datasheet and technical resources for XC6SLX100-N3FG676I

Download the datasheet on this page to get full pin maps, electrical tables, timing, and design guidelines

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