Xilinx XC6SLX100-N3FGG484C

Mfr. Part

XC6SLX100-N3FGG484C

Manufacturer

AMD Xilinx

Y-IC is a trusted quality distributor for AMD Xilinx. We deliver genuine parts, competitive prices, fast shipping, and responsive support to ensure you get the best products and services.

Detailed Description

Spartan-6 LX family FPGA for embedded and general-purpose digital logic

101,261 logic cells and 7,911 CLBs for medium to large designs

4,939,776 total RAM bits with 18 Kb block RAMs

326 user I O in a compact 484-ball FBGA package

Core supply 1.14 V to 1.26 V typical 1.2 V

Commercial temperature grade 0 C to 85 C junction

Mounting type Surface Mount

Main category Integrated Circuits ICs

Small classification Embedded FPGAs Field Programmable Gate Array

RoHS lead free and fully compliant

Active production status with typical manufacturer lead time about 10 weeks

Key Features

Proven 45 nm low power FPGA fabric for cost-effective designs

Rich I O bank support for common standards including LVCMOS LVTTL LVDS HSTL SSTL

Integrated clock management DCM and PLL for flexible clocking

DSP48A1 arithmetic slices for signal processing and filtering

High efficiency block RAM architecture with true dual port memory

Flexible configuration options JTAG SPI BPI parallel and multi boot

Bitstream protection with optional encryption support

Wide IP and toolchain support including MicroBlaze soft processor

Fast timing closure with mature tools and large ecosystem

Key Advantages

Excellent price performance for mid range logic designs

Low power consumption on mature process technology

Stable long-lived platform with broad community support

Large I O count in a moderate footprint simplifies board routing

Easy migration within Spartan-6 family for scaling up or down

Strong availability and supply continuity from Y-IC

Packaging

Type FBGA flip chip fine pitch ball grid array FGG

Material organic substrate with solder ball array

Size 23 mm x 23 mm body 484-ball footprint

Pin configuration 484 balls total 326 user I O remaining balls for power ground configuration clock and dedicated pins

Thermal characteristics junction temperature 0 C to 85 C commercial MSL 3 168 hours in sealed bag typical thermal performance depends on board design airflow and heatsinking

Electrical properties core supply VCCINT 1.14 V to 1.26 V typical 1.2 V auxiliary supply VCCAUX typically 2.5 V bank supplies VCCO per I O bank selectable for supported standards

Supplier device package 484-FBGA 23x23

Factory package case 484-FBGA 23x23 also referenced as 484-BBGA

Standard pack quantity 60 per reel or tray shipping configuration varies by lot

Moisture handling follow MSL 3 best practices bake and reflow guidelines per datasheet

Lifecycle

Status Active

Not nearing discontinuation based on current market status

Direct equivalents within same family and package for speed and temperature variants

- XC6SLX100-2FGG484C commercial

- XC6SLX100-3FGG484C commercial faster

- XC6SLX100-2FGG484I industrial

- XC6SLX100-3FGG484I industrial faster

Pin count or footprint alternatives in the same family

- XC6SLX100-2FTG256C smaller package fewer I O

- XC6SLX100-3FTG256C smaller package faster grade

- XC6SLX100-2FGG676C larger package more I O

- XC6SLX100-3FGG676C larger package faster grade

Functional alternatives with transceivers if high speed serial is needed

- XC6SLX100T family variants with GTP transceivers

New generation migration paths for long term roadmaps subject to redesign

- Spartan-7 XC7S100 families

- Artix-7 XC7A100T families

If you need a drop in replacement or a different speed grade or temperature range contact Y-IC via our website for detailed guidance

Key Application Areas

Industrial control motion control robotics PLC and HMI

Communications baseband low speed SERDES bridging and protocol adaptation

Embedded compute with MicroBlaze signal processing and control

Motor drives power conversion and digital power

Consumer and prosumer electronics imaging audio and video processing

Test and measurement data acquisition instrumentation and lab equipment

Smart gateways IoT aggregation and edge processing

Datasheet

Y-IC hosts the most authoritative and up to date datasheet for this model on our product page

For complete electrical limits pin maps configuration schemes thermal guidance and design rules we recommend downloading the datasheet on this page

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