Xilinx XC6SLX100T 3FGG676I

Mfr. Part

XC6SLX100T-3FGG676I

Manufacturer

AMD Xilinx. Y-IC is a quality distributor for AMD Xilinx. We stand behind the brand and will deliver the best products and service

Detailed Description

Spartan-6 LXT FPGA with about 100K logic resources, rich block RAM and DSP slices, integrated high-speed GTP transceivers, and flexible I/O banks. Speed grade -3 for top performance. FGG676 package suffix indicates a fine-pitch 676-ball BGA in industrial temperature grade I. Main Category is Integrated Circuits. Small Classification is Specialized ICs. Current available quantity is 33000 units. Use this device for cost-effective, low-power programmable logic with built-in SERDES and hard IP blocks like PCIe and memory controllers

Key Features

Spartan-6 LXT family device with integrated multi-gigabit transceivers for serial links

Approximately 100K logic resources for medium to large designs

Abundant block RAM for buffering and data storage

DSP slices for signal processing, filtering, and math operations

Hard IP blocks including PCI Express endpoint and memory interfaces

Flexible I/O banks supporting common single-ended and differential standards

Clock management with PLLs and DCMs for clean timing and frequency synthesis

Speed grade -3 for higher timing margins and faster interfaces

Industrial temperature grade for demanding environments

Broad tool and ecosystem support in AMD Vivado ISE legacy flows

Key Advantages

Strong price to performance ratio for mature, proven FPGA technology

Low power compared to older generations at similar capacity

Integrated transceivers reduce external component count for serial links

Mature ecosystem, IP cores, and reference designs shorten development time

Stable supply for existing platforms and long-lived products

Wide package and speed options for design flexibility

Industrial grade option improves reliability over wider temperature ranges

Packaging

Type is Fine-Pitch Ball Grid Array in the FGG family. The device suffix -FGG676I indicates 676-ball BGA and industrial grade

Material is RoHS compliant, lead-free molding compound and substrate typical for AMD Xilinx FPGAs

Size is a square BGA body typical of FGG676 class. Refer to the datasheet for exact body dimensions and ball pitch

Pin configuration is a 676-ball grid with multiple I/O banks, dedicated configuration pins, differential clock pairs, and transceiver pins. Exact user I/O count depends on package and bank usage. Check the pinout table in the datasheet

Thermal characteristics are suitable for industrial environments. Use proper airflow, heatsinking, and PCB copper for heat spreading. Consult datasheet for thermal resistance values and derating

Electrical properties include 1.2 V core supply, auxiliary rails, and I/O bank voltages supporting common standards from around 1.2 to 3.3 V. Transceiver rails are dedicated and must follow datasheet requirements. Speed grade -3 supports higher operating frequencies. Always verify exact rail names and limits in the datasheet

Lifecycle

Lifecycle status is mature and widely deployed. Not newly introduced, but still broadly supported for existing designs

If you need a close equivalent within Spartan-6 LXT, consider XC6SLX75T-3FGG676I, XC6SLX100T-2FGG676I, XC6SLX100T-3FGG484I, XC6SLX150T-3FGG676I. Note that resources, speed, package, and pinout vary. Check pin and timing compatibility carefully

If you need a modern alternative in AMD’s portfolio, consider Artix-7 XC7A100T devices in comparable BGA packages for lower power and newer tool flows. Not pin compatible, but similar capacity and performance

For exact lifecycle, last-time-buy notices, and the best-fit alternative, contact Y-IC via our website. Our sales team will provide current status and cross recommendations tailored to your design

Key Application Areas

Industrial control, drives, motion, and factory automation

Communications and networking interfaces with serial links such as PCIe, Gigabit Ethernet, and Aurora

Video and imaging pipelines with DSP acceleration

Test and measurement, data acquisition, and high-speed bridging

Automotive and transportation systems requiring industrial temperature operation

Embedded compute offload, protocol conversion, and custom accelerators

Datasheet

Our website hosts the most authoritative datasheet for XC6SLX100T-3FGG676I. Download it on this page to get exact resource counts, pinouts, electrical limits, timing, and packaging drawings

Request for Quotation Now

Get a Quote on Y-IC now. Learn More about availability and pricing. Limited Time Offer for bulk orders and scheduled deliveries. Act now to secure 33000 units from a trusted AMD Xilinx distributor