Xilinx Inc. XC6SLX100-N3FG676C

Mfr. Part

XC6SLX100-N3FG676C

Manufacturer

AMD Xilinx. Y-IC is a quality distributor for AMD Xilinx. We deliver genuine parts, fast service, and dependable support to help you build better products.

Detailed Description

Spartan-6 LX family FPGA, commercial grade. 676-ball flip-chip BGA package (FCBGA), body approx. 27 x 27 mm. Up to 480 user I/Os. Core voltage 1.14 V to 1.26 V. Operating junction temperature 0°C to 85°C. RoHS status: contains lead (RoHS non-compliant). Moisture Sensitivity Level MSL 4 (72 hours). Manufacturer standard lead time 9 weeks. Part status active. Mounting type per spec: Sub-Base Mount. Standard package quantity 40. Series: Spartan-6 LX.

Key Features

FPGA family Spartan-6 LX for low-power, cost-focused designs

Up to 480 user I/Os supporting common single-ended and differential standards

Total RAM bits 101,261 (per provided spec)

Logic elements/cells 7,911 (per provided spec)

Commercial temperature range TJ 0°C to 85°C

Core supply 1.14 V to 1.26 V

676-ball FCBGA package, approx. 27 x 27 mm body size

MSL 4 for moisture handling, 72-hour floor life

Active lifecycle with 9-week standard lead time

Key Advantages

Flexible I/O count and standards simplify interface design

Low power architecture helps reduce heat and energy use

Mature toolchain and ecosystem lower development risk

Field programmable, enabling quick updates and custom features

Large ball-count package offers strong signal integrity and power distribution

Reliable supply supported by Y-IC’s sourcing and logistics

Packaging

Type: Flip-Chip Ball Grid Array (FCBGA), 676 balls

Material: Organic laminate substrate with flip-chip die; lead present (non-RoHS compliant)

Size: Approx. 27 mm x 27 mm body (refer to datasheet for exact dimensions and ball pitch)

Pin configuration: 676-ball array; about 480 balls available for user I/O; remaining balls for power, ground, configuration, and dedicated functions

Thermal characteristics: TJ 0°C to 85°C; follow datasheet for thermal impedance and PCB design guidelines; consider adequate copper area and airflow

Electrical properties: Core 1.14–1.26 V; I/O banks support common levels such as 1.2 V, 1.8 V, 2.5 V, and 3.3 V (confirm per bank in datasheet); MSL 4; ESD ratings per datasheet

Mounting: Sub-Base Mount (per provided spec); soldered using standard BGA reflow processes; moisture handling per MSL 4

Packaging quantity: Standard pack 40 units; tray format commonly used

Polarization: 676-BBGA, FCBGA designation (per provided spec)

Lifecycle

Current status: Active; not near discontinuation based on provided status

Mature family notice: Spartan-6 is a mature platform; plan for long-term supply with qualified alternates

Equivalent or alternative models to consider:

- XC6SLX100-3FG676C Commercial, -3 speed, similar package (verify leaded/lead-free status)

- XC6SLX100-2FG676C Commercial, -2 speed (performance trade-off)

- XC6SLX100-3FGG676C Lead-free FGG variant in 676-ball package (confirm exact mechanicals)

- XC6SLX100-3FG676I Industrial temperature grade (wider temp range; verify specifics)

- Density alternatives in same package family for design scaling: XC6SLX75-3FG676C (smaller), XC6SLX150-3FG676C (larger)

Fit, form, function must be validated in your design. If the exact equivalent you need is not listed, please contact our sales team via the Y-IC website for detailed cross recommendations and availability.

Key Application Areas

Industrial automation and motion control

Machine vision, video processing, and display interfaces

Communications and interface bridging (LVDS, LVCMOS, SPI, I2C, etc.)

Test and measurement and data acquisition

Consumer electronics and embedded systems

Medical instrumentation and security systems

Protocol adaptation and hardware acceleration

Datasheet

Y-IC hosts the most authoritative datasheet for this product model. Download it directly from this page to get exact electrical limits, pinouts, timing, and mechanical drawings.

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