Xilinx Inc. XC5VLX30T-3FF323C

Mfr. Part

XC5VLX30T-3FF323C

Manufacturer

AMD Xilinx

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Detailed Description

Virtex-5 LXT series FPGA, speed grade -3, 172 user I/O, 323-ball flip-chip BGA (FCBGA) package, surface-mount. Core supply 0.95–1.05 V. Junction temperature 0–85°C. Active status. Lead time about 6 weeks. MSL 4 (72 hours). RoHS non-compliant (contains lead).

Key Features

Series: Virtex-5 LXT

Speed grade: -3 (high performance grade in the family)

User I/O: 172

Package: 323-FCBGA, approx. 19 x 19 mm body

Mounting: Surface Mount (SMT)

Logic elements/cells: 2400

Total RAM bits: 30,720

Core voltage: 0.95–1.05 V

Operating temperature (TJ): 0°C to 85°C

Part status: Active

Moisture Sensitivity Level: MSL 4 (72 hours)

Manufacturer standard lead time: 6 weeks

RoHS: Contains lead (RoHS non-compliant)

Standard package quantity: 1 piece per unit

Key Advantages

Balanced I/O count and logic for mid-density designs

Flip‑chip BGA package for strong electrical and thermal performance

High-performance speed grade (-3) for tighter timing margins

Proven AMD Xilinx FPGA platform with mature tool flows and ecosystem

Flexible, reprogrammable hardware to accelerate time-to-market

Reliable supply with active lifecycle and defined lead times

Packaging

Type: FCBGA (Flip‑Chip Ball Grid Array), 323 balls

Material: Molded package with organic substrate, flip‑chip silicon die

Size: Approx. 19 x 19 mm body (323-ball FCBGA)

Pin configuration: 323-ball array; 172 user I/O; dedicated balls for power, configuration, and JTAG (see datasheet ball map for exact assignments)

Thermal characteristics: Junction temperature 0–85°C; flip‑chip construction aids heat spreading; use proper PCB thermal design and cooling if required

Electrical properties: Core supply 0.95–1.05 V; I/O bank supplies depend on chosen standards; follow datasheet for absolute maximum ratings, decoupling, and power sequencing

Handling: MSL 4 (72 hours out of dry pack); follow JEDEC moisture and reflow guidelines

Compliance: Contains lead; RoHS non-compliant

Lifecycle

Current status: Active and orderable

Nearing discontinuation: Not indicated at this time based on current status

Equivalent or alternative models:

- Same device, different speed grade or temperature range: XC5VLX30T-1FF323C, XC5VLX30T-2FF323C, XC5VLX30T-3FF323I (industrial temp)

- Same family, different density in similar package: XC5VLX20T-3FF323C (lower density), XC5VLX50T-3FF323C (higher density)

- Depending on design goals, newer families may be considered (migration path): Kintex‑7 or Artix‑7 series devices

- Important: Always verify pinout, timing, power, and features before substituting. Contact Y-IC for a detailed cross‑reference and compatibility check.

If you need other options not listed here, please contact our sales team via our website for more information and tailored recommendations.

Key Application Areas

Communications and networking equipment (SERDES links, protocol bridging)

Industrial control and automation (real-time logic, custom I/O)

Test and measurement (pattern generation, data capture)

Data acquisition and signal interfacing (LVDS, custom buses)

Embedded acceleration and hardware prototyping

Interface controllers (PCIe endpoints, high-speed serial connectivity)

Video and image processing pipelines

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for XC5VLX30T-3FF323C. We recommend downloading the datasheet directly from this page on our website for the latest specifications, pin maps, electrical limits, and design guidelines.

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