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| Part Number: | XC5VLX30T-2FFG323C |
|---|---|
| Manufacturer/Brand: | AMD Xilinx |
| Part of Description: | IC FPGA 172 I/O 323FCBGA |
| Datasheets: |
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| RoHs Status: | Lead free / RoHS Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
| Share: |
Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 2+ | $460.0079 |
Online RFQ submissions: Fast responses, Better prices!
| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply | 0.95 V ~ 1.05 V |
| Total RAM Bits | 1327104 |
| Supplier Device Package | 323-FCBGA (19x19) |
| Standard Package | 1 |
| Series | Virtex®-5 LXT |
| Part Status | Active |
| Package / Case | 323-BBGA, FCBGA |
| Operating Temperature | 0°C ~ 85°C (TJ) |
| Product Attribute | Attribute Value |
|---|---|
| Number of Logic Elements/Cells | 30720 |
| Number of LABs/CLBs | 2400 |
| Number of I/O | 172 |
| Mounting Type | Surface Mount |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Manufacturer Standard Lead Time | 10 Weeks |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Base Part Number | XC5VLX30 |




XC5VLX30T-2FFG323C
AMD Xilinx
Y-IC is a quality distributor of AMD Xilinx products. We promise the best products and services for every customer.
FPGA module with 172 I/O pins, packaged in a 323-ball Fine-Pitch Ball Grid Array (FCBGA). Designed for high-speed logic and custom computation. Operates within 0°C to 85°C junction temperature. Supports lead-free and RoHS-compliant production.
323-pin FCBGA package
172 Input/Output ports
2400 Logic Array Blocks / Configurable Logic Blocks
Over 1.3 million RAM bits
0.95V to 1.05V power supply range
High-performance Virtex-5 LXT series FPGA
Surface mount configuration
Wide operating temperature range
Large logic capacity with 30,720 logic cells
Advanced connectivity for data-intensive tasks
High RAM density for embedded applications
Lead-free and environmentally compliant
Reliable for industrial and commercial applications
Optimized for performance and integration
Type: 323-BBGA, FCBGA (Fine-Pitch Ball Grid Array)
Material: High-quality thermally engineered substrate
Size: 19mm x 19mm
Pin configuration: 323 balls, organized for efficient board layout
Thermal characteristics: Designed for adequate heat dissipation at max 85°C junction temp
Electrical properties: Moisture Sensitivity Level (MSL) 4, supply voltage 0.95V ~ 1.05V, ensures stable logic operations
Quantity per sheet: 195 units
The XC5VLX30T-2FFG323C is actively supported; not nearing discontinuation
For equivalent or alternative models: XC5VLX30, XC5VLX30T-2FFG323I, XC5VLX30T-1FFG323C, XC5VLX30T-3FFG323C
If none of these meet your specification, please contact our sales team on the Y-IC website for more alternatives and dedicated support
Embedded computing and custom logic designs
Industrial automation
Networking hardware
Data acquisition and processing
Digital signal processing
Telecommunication systems
Research and prototyping in electronics labs
Our website offers the most authoritative datasheet for XC5VLX30T-2FFG323C. Customers are encouraged to download the datasheet directly from the product page for complete technical details and design guidance.
Get a Quote now on our website! Act fast and take advantage of our Limited Time Offer for your project needs. Click 'Learn More' to see price and availability, or contact us for personalized service. Time-sensitive projects benefit from quick responses and professional support.
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