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| Part Number: | TLV272CDGKR |
|---|---|
| Manufacturer/Brand: | Texas Instruments |
| Part of Description: | IC OPAMP GP 2 CIRCUIT 8VSSOP |
| Datasheets: |
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| RoHs Status: | ROHS3 Compliant |
| Payment: | PayPal / Credit Card / T/T |
| Shipment Way: | DHL / Fedex / TNT / UPS / EMS |
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Ship From: Hong Kong
| Quantity | Unit Price |
|---|---|
| 1+ | $0.3006 |
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| Product Attribute | Attribute Value |
|---|---|
| Voltage - Supply Span (Min) | 2.7 V |
| Voltage - Supply Span (Max) | 16 V |
| Voltage - Input Offset | 500 µV |
| Supplier Device Package | 8-VSSOP |
| Slew Rate | 2.6V/µs |
| Series | - |
| Package / Case | 8-TSSOP, 8-MSOP (0.118", 3.00mm Width) |
| Package | Tape & Reel (TR) |
| Output Type | Rail-to-Rail |
| Product Attribute | Attribute Value |
|---|---|
| Operating Temperature | 0°C ~ 70°C (TA) |
| Number of Circuits | 2 |
| Mounting Type | Surface Mount |
| Gain Bandwidth Product | 3 MHz |
| Current - Supply | 550µA (x2 Channels) |
| Current - Output / Channel | 8 mA |
| Current - Input Bias | 1 pA |
| Base Product Number | TLV272 |
| Amplifier Type | General Purpose |




The TLV272CDGKR by Texas Instruments is a dual-channel, general-purpose CMOS operational amplifier designed to address the increasing demand for low-power, rail-to-rail output amplifiers. Fabricated with a focus on balancing performance and energy efficiency, this device is particularly suited for engineers who are developing portable or battery-operated electronic systems that require broad supply voltage compatibility and reliable analog signal processing. The TLV272CDGKR comes housed in a space-saving 8-VSSOP package, facilitating compact PCB layouts ideal for modern consumer and industrial electronic products.
The TLV272CDGKR stands out in the operational amplifier landscape due to its impressive blend of low power consumption (typical supply current of 550 μA per channel) and dynamic signal performance. The op amp achieves a gain bandwidth product of 3 MHz along with a high slew rate of 2.4 V/μs, giving it ample headroom for fast, accurate signal processing in a variety of use cases. One of its notable features is the rail-to-rail output operation, supporting full-scale output swings even in low-voltage environments. Its operating voltage ranges from 2.7 V up to 16 V, supporting both single- and split-supply systems—key for designs leveraging everything from small Li-Ion battery packs to industrial ±8 V rails.
Further, the TLV272CDGKR features ultra-low input bias current (1 pA typical), making it excellent for high-impedance sensor front ends and other circuits where signal integrity at low currents is paramount. The amplifier is also characterized by an input offset voltage as low as 0.5 mV (typical), which helps in minimizing errors in precision analog circuits.
The TLV272CDGKR’s robust electrical characteristics ensure stable operation across a variety of environmental and loading conditions. The device meets commercial temperature grades (0°C to 70°C), with wider industrial temperature grade options available in related marking. Key DC parameters include a high common-mode rejection ratio (up to 80 dB) and large-signal voltage gain (up to 106 dB), enabling high signal fidelity.
In terms of thermal management, the device’s small outline VSSOP package provides a junction-to-ambient thermal resistance of 186.6°C/W, suitable for designs where board space and cooling resources are at a premium. The low supply current and high resistance values further contribute to efficient on-board power budgeting, particularly in dense or compact consumer electronics assemblies.
Engineers can confidently specify the TLV272CDGKR for a broad range of modern applications that demand energy efficiency without a tradeoff in analog performance. Typical use cases include sensor signal amplification in smoke detectors and building automation systems, power management in portable equipment such as e-bikes and power banks, and signal conditioning in battery-powered instruments and solar inverters.
The rail-to-rail output and wide supply range support seamless integration with microcontroller-powered systems, especially those operating at lower supply voltages. For designs focused on IoT or data acquisition, the TLV272CDGKR’s low input bias current is ideal for integrating high-impedance sensors, helping to maintain accuracy and battery longevity.
Housed in the 8-pin VSSOP package (DGK), the TLV272CDGKR offers a compact footprint of 3.00 mm × 3.00 mm, making it compatible with high-density surface-mount assembly processes. The straightforward dual-op-amp pinout includes two independent amplifier channels with dedicated inverting and non-inverting inputs, outputs, and shared power supply rails (GND and VDD). This configuration ensures design flexibility whether used in signal buffering, amplification, or active filtering circuits.
Component selection engineers considering the TLV272CDGKR should also be aware of several potential alternatives, whether for supply-chain flexibility or performance tuning in legacy designs. The Texas Instruments TLV27x family includes single (TLV271), dual (TLV272), and quad (TLV274) variants sharing core performance attributes, enabling scalable channel integration.
Engineers may also evaluate the TLC27x for older or slightly lower power applications, but should consider the TLV272CDGKR as a rail-to-rail output upgrade path. For higher bandwidth or lower supply operation, models such as TLV246x and TLV237x offer different balances of bias current and frequency characteristics, enabling tailored optimizations based on specific design requirements.
: Selecting the TLV272CDGKR for Engineering Designs
The TLV272CDGKR from Texas Instruments presents a well-balanced solution for contemporary analog design challenges, merging low power and high bandwidth operation with industry-standard packaging and robust electrical performance. Its suitability for portable, sensor-based, and energy-efficient systems make it a compelling choice for product selection engineers and procurement professionals seeking reliable, scalable operational amplifiers for demanding, future-ready applications.
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