STMicroelectronics EMIF03-SIM04F3

Mfr. Part

EMIF03-SIM04F3

Manufacturer

STMicroelectronics. Y-IC is a quality distributor for STMicroelectronics and we will provide you with genuine parts, competitive pricing, and reliable service

Detailed Description

Three-channel RC Pi low-pass EMI filter array with integrated ESD protection for SIM and other mobile data lines. Ultra-small 11-ball WFBGA flip‑chip package for dense layouts. RC values per channel are 47 Ω or 100 Ω series resistors with 10 pF shunts to ground. Second-order Pi topology improves high-frequency noise attenuation while maintaining signal integrity for low to mid-speed digital lines. RoHS3 compliant, -40 to +85°C, surface-mount, IPAD series. Optimized for SIM clock, reset, and I O lines in smartphones, tablets, wearables, and M2M modules

Key Features

Main category Filters, small classification EMI RFI Filters LC RC Networks

Technology RC Pi low-pass, filter order 2nd

Number of channels 3 with integrated ESD protection

Values R 47 Ω and 100 Ω per channel, C 10 pF to ground

Approximate RC single-pole cutoff points 100 Ω and 10 pF about 160 MHz, 47 Ω and 10 pF about 340 MHz. Pi topology increases stopband attenuation

Very compact package 11-WFBGA FCBGA 1.54 mm x 1.14 mm x 0.65 mm

Operating temperature -40°C to +85°C

Mounting type surface mount, tape and reel for automated assembly

RoHS3 compliant

Series IPAD, base product number EMIF03

Key Advantages

Combines two resistors and two capacitors per line plus ESD in one chip to save PCB area and BOM

Better high-frequency suppression than a single RC thanks to 2nd-order Pi network

Channel matching improves repeatability versus discrete builds

Low insertion loss in the passband to keep SIM and control signals clean

Flip‑chip layout minimizes parasitics for better high-frequency performance

Protects downstream ICs against ESD strikes while filtering RF noise

Simplifies design and assembly, reduces placement count and potential solder defects

Packaging

Shipment format Tape and Reel TR for high-volume pick-and-place

Package case 11-WFBGA FCBGA flip‑chip

Body size 1.54 mm length x 1.14 mm width, height 0.65 mm

Pin bump configuration 11 solder balls providing three filtered channels plus grounds reference. See datasheet for exact ball map and orientation

Materials lead-free SAC solder balls, halogen-free construction, RoHS3 compliant

Electrical properties RC Pi low-pass per channel. R values 47 Ω and 100 Ω with C 10 pF to ground. Second-order slope about 40 dB per decade beyond cutoff. Integrated ESD diodes to ground

Thermal characteristics very low power dissipation in signal-filter use, negligible self-heating under normal operation. Compatible with standard lead-free reflow profiles. Observe PCB thermal and reflow guidelines in the datasheet

Lifecycle

Current production status should be checked on our website for real-time updates. This device is part of ST’s IPAD EMIF03 family commonly used in mobile designs

If you need an equivalent or alternative model we can help match by channel count, RC values, ESD level, and package. Close options often exist within the ST IPAD family EMIF02 two-line and EMIF04 EMIF06 multi-line variants or other EMIF03 variants with different R C values

Because exact form fit function depends on your required cutoff, impedance, and layout, please contact our sales team via the Y-IC website for a curated cross list and second-source options

Key Application Areas

SIM card interfaces in smartphones, tablets, POS terminals, and M2M modules SIM CLK, RST, I O

Low to mid-speed digital control lines GPIO, I2C, UART, SPI chip-select and control

Baseband and RF transceiver control lines where RF immunity and ESD robustness are needed

Wearables and compact IoT devices requiring tiny footprint EMI filtering

Any mobile data line that needs EMI reduction and ESD protection without using discrete RC plus TVS

Datasheet

Y-IC hosts the most authoritative datasheet for EMIF03-SIM04F3 on our product page. We recommend downloading the datasheet here to get the full ball map, electrical characteristics, ESD ratings, reflow guidance, and layout recommendations

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