STMicroelectronics EMIF02-MIC02F3

Product Summary EMIF02-MIC02F3 STMicroelectronics

The EMIF02-MIC02F3 by STMicroelectronics is a compact, highly integrated second order low-pass EMI filter, ideal for use in modern high-density electronic assemblies. Designed with two input/output channels, it provides efficient suppression of electromagnetic interference and robust ESD protection, serving critical functions in mobile communication devices, computers, printers, and MCU boards. Combining filtering and protection in a wafer-level chip-scale package, the EMIF02-MIC02F3 minimizes board footprint and is tailored to meet the stringent requirements of space-constrained and noise-sensitive environments.

Main Attributes EMIF02-MIC02F3 STMicroelectronics

STMicroelectronics introduces the EMIF02-MIC02F3 with several advanced features:

Symmetrical (I/O) low-pass RC (Pi) configuration for high-efficiency EMI filtering

Integrated ESD protection circuitry offering up to 15 kV air discharge immunity

Monolithic integration for improved reliability and significant reduction of parasitic elements

Exceptionally compact footprint (0.9 mm²) and thin profile (0.60 mm height)

RoHS-compliant, lead-free wafer level BGA (6-WFBGA, FCBGA) packaging

These features make the EMIF02-MIC02F3 suitable for manufacturers aiming to balance high performance with miniaturization and regulatory compliance.

Specification Details EMIF02-MIC02F3 STMicroelectronics

At its core, the EMIF02-MIC02F3 RC (Pi) EMI filter incorporates the following electrical parameters:

Two filter channels

Resistance value: 470 Ω per channel

Capacitance value: 16 pF per channel

Package: 6-WFBGA (wafer level ball grid array)

Operating temperature range centered at 25°C for reference characteristics

Absolute ratings and typical performance metrics are detailed to ensure compatibility with system-level requirements and facilitate informed design-in processes.

Operational Parameters EMIF02-MIC02F3 STMicroelectronics

Engineers assessing the EMIF02-MIC02F3 benefit from a suite of detailed performance data, including:

S21 attenuation measurements for both filter lines, illustrating frequency response

Crosstalk metrics in both analog and digital signaling environments

ESD response graphs under IEC 61000-4-2 conditions (including ±15 kV surges on input and output pins)

Capacitance dependency on applied voltage

These evaluations underpin the filter’s role in ensuring signal integrity and resilience in sensitive circuit paths, particularly when used in RF and data communication lines.

Regulatory Compliance and Certifications EMIF02-MIC02F3 STMicroelectronics

The EMIF02-MIC02F3 meets major international EMC and ESD standards:

IEC61000-4-2 level 4: External pins rated for 15 kV (air discharge), 8 kV (contact)

IEC61000-4-2 level 1: Internal pins rated for 2 kV

Additionally, the package is manufactured according to ECOPACK® environmental directives, with full lead-free construction and documentation in compliance with JESD97, supporting sustainable design initiatives.

Application Recommendations EMIF02-MIC02F3 STMicroelectronics

Optimally deployed in designs where both EMI mitigation and ESD protection are paramount, the EMIF02-MIC02F3 finds application in:

Mobile phones and wireless communication systems

Personal computers, printers, and microcontroller boards

Practical models and parameters (APLAC simulation data included in the product documentation) streamline system-level integration. Reference application notes (such as AN2348 and AN1751) provide best practices for package handling and filter performance qualification.

Packaging and Assembly Information EMIF02-MIC02F3 STMicroelectronics

The 6-bump WFBGA package is engineered for minimum PCB real estate and maximum integration efficiency. Key notes for product selection engineers:

Very low height profile (0.6 mm) accommodates ultra-thin assemblies

Flip-chip tape-and-reel options facilitate automated high-volume manufacturing

Standardized footprint and marking ensure assembly consistency

For further reliability, ECOPACK® status and interconnect category are visibly labeled per JEDEC guidelines, with package drawings and recommended land patterns provided for accurate layout design.

Alternative/Ersatz Models EMIF02-MIC02F3 STMicroelectronics

When considering alternatives or potential replacements for the EMIF02-MIC02F3, engineers should assess:

Other STMicroelectronics EMI/ESD filter products in the EMIF series (e.g., EMIF04, EMIF06) for differing channel counts or voltage ratings

Comparable wafer-level, low-pass RC filters with integrated ESD protection from competing suppliers, matching on impedance and capacitance values

In each case, compatibility in filtering performance, package type, and ESD resilience should be confirmed to maintain system reliability.

Conclusion

: EMIF02-MIC02F3 STMicroelectronics

The EMIF02-MIC02F3 stands out as a space-saving, highly effective solution for electromagnetic interference suppression and ESD protection in modern electronics. Its robust technical profile, broad standards compliance, and ease of integration make it an asset to design engineers tasked with safeguarding signal integrity in minimal form-factor applications. For new builds or upgrades, systematic evaluation of the EMIF02-MIC02F3 against application demands ensures optimal EMC and reliability.