Renesas Electronics America Inc R7F701422EAFB#KA0

Mfr. Part

R7F701422EAFB#KA0

Manufacturer

Renesas Electronics Corporation

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Detailed Description

Automotive-grade 32-bit microcontroller from the RH850/D1L series. Single-core RH850G3M CPU at 120 MHz with 4 MB flash, 512 KB RAM, and 64 KB EEPROM. Rich connectivity including CAN, LIN, Ethernet, USB, SPI, SSI, UART/USART, SCI, IC, and EBI/EMI. On-chip peripherals include DMA, IS, LCD, LVD, POR, PWM, and WDT. 16-channel 12-bit ADC. Operates from 2.7 to 5.5 V and from -40 to 150 C. Packaged in 144-LFQFP 20 mm x 20 mm for surface-mount designs. Base product number R7F701422. RoHS3 compliant.

Key Features

CPU core RH850G3M single core, 32-bit

CPU speed 120 MHz

Program memory 4 MB flash

RAM 512 KB

EEPROM 64 KB

I/O pins 103 GPIO

Connectivity CAN, LIN, Ethernet, USB, SPI, SSI, UART/USART, SCI, IC, EBI/EMI

Peripherals DMA, IS, LCD controller support, LVD, POR, PWM, WDT

Data converters 16-channel 12-bit ADC

Oscillator internal

Supply voltage 2.7 to 5.5 V

Operating temperature -40 to 150 C

Package 144-LFQFP 20 x 20 mm

Series RH850/D1L

RoHS ROHS3 compliant

Base product number R7F701422

Key Advantages

Wide voltage and high temperature range for harsh automotive environments

Large flash and EEPROM for complex firmware and persistent data storage

High I/O count for instrument clusters, HMI, and control-intensive designs

Integrated CAN, LIN, Ethernet, USB reduces external components and BOM

Built-in safety features LVD, POR, WDT support reliable operation

Proven RH850 platform and toolchain ecosystem for faster development

Surface-mount LQFP simplifies manufacturing and rework

Packaging

Type 144-LFQFP low-profile quad flat package, standard case 144-LQFP

Material epoxy molding compound with copper leadframe and lead-free matte tin plating, ROHS3 compliant

Size body 20 mm x 20 mm, low-profile height typical around 1.4 mm

Pin configuration 144 leads, typical pitch 0.5 mm for LQFP-144, 103 GPIO available

Mounting surface mount, shipped in tray

Thermal characteristics ambient operation from -40 to 150 C, thermal performance depends on PCB design and airflow. Consult the datasheet for ThetaJA and power dissipation guidance

Electrical properties supply 2.7 to 5.5 V, 120 MHz core clock, internal oscillator, 4 MB flash, 512 KB RAM, 64 KB EEPROM, 16 x 12-bit ADC

Lifecycle

Status active in the RH850/D1L family based on publicly available information. No formal discontinuation notice observed

Alternatives within Renesas RH850 D1 family verify details before selection

- R7F701421 series variants with similar core and interfaces, differing memory or package options

- R7F701423 series variants with comparable performance and peripheral mix

- R7F701424 series variants targeting display and cluster needs

- R7F701425 series variants offering different memory sizes or pin counts

Cross-family functional alternatives evaluate architecture and software ecosystem

- Renesas RH850 D1M and other RH850 D1x variants for instrument cluster applications

- NXP S32K3 automotive MCUs with CAN, LIN, and Ethernet

- Infineon AURIX TC2xx or TC3xx series for automotive networking and control

Important note pinout, memory sizes, timing, and toolchains differ. For a direct drop-in or a vetted cross-reference, contact our sales team via the Y-IC website for detailed guidance and availability

Key Application Areas

Automotive instrument cluster and display control

Vehicle body electronics and gateway modules

CAN, LIN, Ethernet communication nodes

HMI and LCD control for dashboards and infotainment

PWM-based motor and actuator control

Industrial embedded systems requiring wide voltage and high-temperature operation

Data logging, diagnostics, and firmware management using onboard EEPROM and flash

Datasheet

Y-IC hosts the most authoritative and up-to-date datasheet for this model. Download it directly from this page for full specifications, pinouts, timing charts, thermal data, and design guidelines.

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