Microchip Technology M2GL010T-VFG256

Mfr. Part

M2GL010T-VFG256

Manufacturer

Micrel / Microchip Technology

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Detailed Description

IGLOO2 flash-based FPGA with 10K-class logic resources. 256-ball fine-pitch BGA, 14 x 14 footprint. 138 user I/O. RoHS3 compliant. Surface-mount. Commercial temperature (TJ 0°C to 85°C). Wide supply range 1.14V to 2.625V. Base product: M2GL010. Supplied in tray. Series: IGLOO2. Quantity available: 2628.

Key Features

Flash-based, non-volatile FPGA (instant-on, no external configuration memory needed)

12084 logic elements/cells for mid-size designs

933,888 total RAM bits for on-chip storage and buffering

138 user I/O for flexible interfacing

Supply voltage range: 1.14V to 2.625V for power flexibility

Package: 256-FPBGA (14x14), supplier device package 256-FPBGA (14x14)

Mounting: Surface mount (SMD)

Operating junction temperature: 0°C to 85°C (commercial)

RoHS3 compliant and lead-free

IGLOO2 series ecosystem and toolchain support

Key Advantages

Non-volatile, instant-on operation simplifies system startup and improves reliability

Low power architecture typical of flash FPGAs reduces thermal load and power costs

Stable configuration and strong immunity to SEUs compared to SRAM-based FPGAs

Balanced resources: logic, RAM, and I/O suited for control, bridging, and signal management

Compact 256-ball BGA helps reduce board space and enables high I/O density

Broad supply range and commercial temp rating fit many industrial and embedded uses

Available stock (2628 units) for quick deployment and production continuity

Supported by Microchip’s mature tools and long-term product family roadmap

Packaging

Type: 256-FPBGA (fine-pitch ball grid array), also referenced as 256-LFBGA

Form factor: 14 x 14 footprint (as specified for supplier device package)

Delivery: Tray packaging for secure handling during assembly

Material/Compliance: Lead-free, RoHS3 compliant

Pin configuration: 256 balls total; 138 user I/O balls; remaining balls for power, ground, configuration, and dedicated functions

Mounting: Surface mount; compatible with standard BGA reflow profiles

Thermal characteristics: TJ 0°C to 85°C (commercial grade)

Electrical properties: Supply voltage 1.14V to 2.625V; designed for low-power operation; on-chip RAM 933,888 bits; logic cells 12,084

Lifecycle

Current status: Active in Microchip’s IGLOO2 family (not indicated as nearing discontinuation based on typical family support). For the latest status, confirm with our sales team.

Equivalent/alternative models within IGLOO2 family (different densities or packages; verify pinout and features for your design):

- M2GL005 (lower density)

- M2GL025 (higher density)

- M2GL050 (higher density)

- M2GL090 (higher density)

Potential alternatives in other Microchip families for higher performance or transceivers (design-dependent; not drop-in):

- PolarFire series (e.g., MPF family) for enhanced performance and SERDES

Cross-vendor options (feature sets vary; not pin-compatible; evaluate carefully):

- Lattice: ECP5 or CrossLink-NX (low power, mid-range)

- AMD Xilinx: Artix-7 (general-purpose mid-range)

- Intel: Cyclone IV/V (general-purpose mid-range)

If you need exact drop-in or closest-match alternatives, please contact our sales team via the Y-IC website for tailored guidance.

Key Application Areas

Industrial control, motor control, and factory automation

Interface bridging, protocol conversion, and glue logic

Embedded systems and IoT gateways that benefit from instant-on

Communications equipment and networking peripherals

Measurement, instrumentation, and medical electronics (non-critical)

Consumer and prosumer devices requiring low-power programmable logic

Power management controllers and safety/interlock logic

Datasheet

Y-IC provides the most authoritative and up-to-date datasheet for M2GL010T-VFG256 on our website. We recommend downloading it directly from this page to ensure you have the latest specifications and guidelines.

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