Texas Instruments SN74ALVC3631-15PCB

Mfr. Part

SN74ALVC3631-15PCB

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

High-speed synchronous FIFO memory, 18K depth (512 x 36), bi-directional bus, 3.0 V to 3.6 V supply, 66.7 MHz operation, access time 9.5 ns, programmable flags, retransmit support, depth/width expansion. Packaged in 120-lead HLQFP (approx. 14 x 14 mm) for surface mount. Commercial temperature 0°C to 70°C. RoHS non-compliant. Base product number: 74ALVC3631. Series: 74ALVC. Available packaging: Tray. Listed quantity: 40 pcs.

Key Features

FIFO organization: 512 x 36 (18K)

Synchronous operation for simplified timing to system clocks

Data rate: up to 66.7 MHz

Access time: 9.5 ns

Supply voltage: 3.0 V to 3.6 V (3.3 V nominal)

Bus direction: bi-directional

Expansion support: depth and width expansion

Programmable flags: yes (customizable status thresholds)

Retransmit capability: yes

FWFT (First-Word-Fall-Through): no

Package: 120-HLQFP (14 x 14 mm nominal body)

Mounting: surface-mount (SMT)

Operating temperature: 0°C to 70°C (commercial)

RoHS: non-compliant

Key Advantages

High throughput and low latency for 3.3 V systems (fast 9.5 ns access)

Flexible 36-bit data path suits wide buses or data + ECC

Programmable flags streamline flow control between asynchronous subsystems

Retransmit simplifies error recovery and data re-reads

Scalable architecture with depth/width expansion to match system growth

Compact 120-pin HLQFP saves board area versus larger memory modules

ALVC CMOS family offers low-voltage, high-speed performance

Packaging

Type: HLQFP (High-profile Low Quad Flat Pack), 120 leads

Material: Molded epoxy plastic body with copper leadframe; matte tin–finished gull‑wing leads

Size: Approx. 14 mm x 14 mm body outline; fine‑pitch leads (standard QFP geometry)

Pin configuration: 120 gull‑wing pins around all four sides; FIFO control, data (36-bit wide), clocks, and flag pins distributed per datasheet pinout

Mounting: Surface mount; compatible with automated pick‑and‑place and reflow soldering

Packaging for shipment: Tray (factory tray for mechanical protection and easy handling)

Thermal characteristics: Heat dissipates through leads and PCB copper; actual θJA depends on board stackup, copper area, and airflow; follow datasheet layout and thermal guidance for best results

Electrical properties (primary): VCC 3.0–3.6 V; 66.7 MHz synchronous operation; 9.5 ns access; 0–70°C operating range; Icc max listing shows 350A in source data, which is not realistic for this device class—verify the correct current spec in the official datasheet on our product page

Lifecycle

Status insight: This part is specialized, RoHS non-compliant, and may have limited manufacturing status or be subject to last‑time‑buy policies in some regions. Availability can vary.

Direct drop‑in equivalents: None confirmed from public data. FIFO devices are highly pinout‑ and timing‑specific.

Alternatives: Functional alternatives may exist in other synchronous FIFO families from leading vendors, but pin‑compatibility and timing must be checked case by case.

Recommendation: Contact Y-IC via our website to confirm current lifecycle status, lead time, and to have our engineers propose vetted, compatible alternatives where needed.

Key Application Areas

Network and telecom line cards, switches, and routers (rate matching between PHY/MAC and system logic)

Baseband and RF systems needing clock‑domain crossing and burst absorption

Storage and RAID controllers (buffering wide data paths with ECC)

Video and imaging pipelines (frame and line buffering for FPGAs/ASICs)

High‑speed instrumentation and data acquisition (stream smoothing and latency control)

Embedded computing and DSP coprocessors (CPU–FPGA or DSP–FPGA interfacing)

Datasheet

Y-IC hosts the most authoritative and up‑to‑date datasheet for SN74ALVC3631-15PCB on our product page. We recommend downloading it from our website now for full pinout, timing diagrams, electrical limits, and layout guidance.

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