Texas Instruments OMAP3530ECBC

Mfr. Part

OMAP3530ECBC

Manufacturer

Luminary Micro/Texas Instruments

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Detailed Description

High-integration ARM Cortex-A8 microprocessor from the OMAP-35xx family running at 600 MHz, designed for multimedia and general embedded processing. Single-core 32-bit CPU with NEON SIMD, a C64x+ DSP for signal and multimedia processing, integrated graphics acceleration, LCD controller, and rich connectivity. Offered in a compact 515-ball Package-on-Package flip‑chip BGA (14 x 14 mm) for stacking LPDDR memory. Surface-mount, tray packaging, RoHS non-compliant. Ideal for space-constrained designs that need CPU + DSP + graphics in one device.

Key Features

Core processor: ARM Cortex-A8, 1 core, 32-bit, 600 MHz

Co-processors: NEON SIMD; C64x+ DSP for signal and multimedia workloads

Graphics: Integrated hardware acceleration; LCD display controller

Memory: LPDDR controller; POP-ready package to stack memory on top

USB: Three USB 1.x ports and one USB 2.0 port

Interfaces: HDQ/1-Wire, I2C (listed as IC in source), McBSP, McSPI, MMC/SD/SDIO, UART

Voltage (I/O): 1.8 V and 3.0 V

Operating temperature (TJ): 0°C to 90°C

Mounting: Surface mount

Series: OMAP-35xx; Base product number: OMAP3

RoHS: Non-compliant

Supplier device package: 515-POP-FCBGA (14 x 14)

Package: Tray

Key Advantages

CPU + DSP + NEON in one chip: handles general embedded control plus heavy multimedia and signal-processing tasks

POP BGA saves board space: stack LPDDR memory on top to shrink your PCB footprint

Rich peripheral set: reduces external components and speeds system integration

Proven ecosystem: OMAP3 family has broad OS and community support (Linux/Android/BSPs), easing development

Flexible display and graphics: built-in LCD controller and acceleration for UI and HMI

Stable, mature platform: widely used in handhelds and industrial products

Backed by Y-IC: quality sourcing, fast response, and dependable logistics

Packaging

Type: Package-on-Package Flip‑Chip Ball Grid Array (FCBGA); some references also note VFBGA variants within the family

Size: 14 mm x 14 mm body

Ball count: 515 balls (grid array)

POP capability: top pads support stacking compatible LPDDR memory devices

Material: FCBGA on organic substrate (per TI OMAP3 construction; see datasheet for exact stack-up)

Pin configuration: high-density 515-ball grid for CPU, DSP, memory, display, and I/O signals

Thermal characteristics: Junction temperature 0°C to 90°C; consider thermal spreading under BGA and adequate airflow

Electrical properties: I/O rails at 1.8 V and 3.0 V; USB and other interfaces per OMAP3 specs

Mounting: Surface mount reflow

Shipping: Tray packaging for automated assembly

Lifecycle

Status: OMAP3530 is a mature/legacy OMAP3 device. Many OMAP35xx variants have moved to NRND or discontinuation. Treat as not recommended for new designs unless your product specifically requires it. Availability can be limited.

Family equivalents and close variants (check feature differences carefully):

- OMAP3503 (Cortex-A8, typically without 3D GPU or with reduced multimedia features)

- OMAP3515 (adds graphics vs. 3503; feature set varies by suffix)

- OMAP3525 (mid-tier multimedia feature set)

- OMAP3530 (this device; full multimedia with C64x+ DSP and graphics)

- DM3730 / DM3725 (OMAP3-based; higher performance, smaller geometry; DM3730 includes C64x+ DSP and SGX530 GPU)

TI Sitara alternatives for new designs (architecture and peripherals differ; validate software and pinout):

- AM3703 (Cortex-A8; similar generation without 3D GPU)

- AM3715 (Cortex-A8 with SGX530 GPU)

- AM335x family (AM3352/AM3354/AM3358; Cortex-A8, modern peripherals; no C64x+ DSP)

- AM437x family (Cortex-A9 class; richer peripherals; no C64x+ DSP)

Need exact drop-in or long-term supply guidance? Contact Y-IC via our website. Our sales and engineering teams will help you select the best equivalent or migration path.

Key Application Areas

Portable multimedia players and handheld smart devices

Industrial HMI and control panels with rich UI

Medical handhelds and diagnostic tools

Robotics controllers and embedded vision with DSP assist

Portable data terminals, POS, and barcode systems

Education and prototyping platforms (e.g., BeagleBoard-class designs)

Datasheet

Y-IC hosts the most authoritative datasheet for OMAP3530ECBC on our product page. For accurate pinout, timing, POP memory options, and thermal/electrical specs, download the datasheet here. We recommend you get the latest revision directly from our site to avoid outdated information.

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