Texas Instruments OMAP3530ECBBA

Mfr. Part

OMAP3530ECBBA

Manufacturer

Luminary Micro Texas Instruments

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Detailed Description

High performance MPU from the OMAP 35xx family with a 600 MHz ARM Cortex A8 CPU and integrated C64x plus DSP for signal and multimedia processing. Includes NEON SIMD engine and on-chip graphics acceleration for smooth 2D and 3D. Designed for compact systems using POP memory in a 515 ball FCBGA 12 x 12 mm package. Industrial temperature capable and RoHS3 compliant

Key Features

CPU ARM Cortex A8 up to 600 MHz

DSP TI C64x plus for signal and multimedia tasks

NEON SIMD for fast math and media

Integrated graphics acceleration 2D and 3D

Memory controller LPDDR compatible supports POP stacking

Interfaces LCD controller for display output

USB interfaces USB 2.0 and multiple USB 1.x

Additional interfaces I2C McSPI McBSP UART HDQ 1 Wire MMC SD SDIO

Data width 32 bit single core

Supply for I O 1.8 V and 3.0 V domains

Package 515 POP FCBGA 12 x 12 mm surface mount

Operating junction temperature range minus 40 C to 105 C

Series OMAP 35xx

RoHS status ROHS3 compliant

Key Advantages

Heterogeneous processing ARM plus DSP delivers strong performance per watt for mixed control and media workloads

NEON and DSP offload free the ARM core and cut latency for audio video and vision tasks

POP package reduces PCB footprint and simplifies high speed memory routing

Rich peripheral set lowers need for external companion chips and reduces BOM cost

Industrial temperature range supports harsh environments

Long field history and broad ecosystem speed development and debugging

Packaging

Type Component shipment in trays

Semiconductor package 515 ball POP capable FCBGA also referenced as VFBGA FCBGA

Body size 12 mm x 12 mm nominal

Mounting Surface mount BGA

Pin ball configuration 515 balls ball map defined in the TI datasheet

Materials Lead free solder balls RoHS3 compliant organic substrate epoxy mold compound

Thermal characteristics Operating junction temperature minus 40 C to 105 C good PCB copper area and airflow recommended for heat spreading

Electrical properties I O domains at 1.8 V and 3.0 V multiple internal power rails low power states supported consult datasheet for rail sequencing and current draw

Lifecycle

Status Mature product from TI commonly used in legacy and long life designs

Recommendation For new designs consider newer TI Sitara devices

Direct family variants OMAP3503 no DSP no 3D OMAP3515 3D graphics no DSP OMAP3525 DSP no 3D OMAP3530 DSP plus 3D

Suggested TI alternatives AM335x family AM3352 AM3354 AM3358 for Cortex A8 with modern peripherals AM437x family for higher performance and PRU options

Cross brand options may exist depending on your requirements contact us for a tailored cross reference

If you need pin to pin or functionally equivalent replacements or lifecycle confirmation please contact our sales team via the Y IC website for the latest guidance

Key Application Areas

Portable media players handheld terminals and smartphones of the OMAP era

Industrial HMI control panels and operator interfaces

Barcode scanners printers and imaging systems

Portable medical instruments and patient monitors

Data loggers point of sale terminals and kiosks

Education and developer platforms requiring ARM plus DSP

Datasheet

Y IC hosts the most authoritative and up to date datasheet for this product model on our website Download it directly on this page for complete electrical specs pin maps power rails and design guidelines

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