Texas Instruments MSP430F6459IZQWR

Mfr. Part

MSP430F6459IZQWR

Manufacturer

Texas Instruments (Luminary Micro is part of TI). Y-IC is a quality distributor of Texas Instruments products and we will provide you with the best products and services.

Detailed Description

Low-power 16-bit MSP430 microcontroller with MSP430 CPUXV2 core, 20 MHz max. 512 KB Flash program memory, 66 KB RAM, rich analog and digital peripherals, and integrated LCD support. 113-ball MicroStar Junior VFBGA package for compact, high-density designs. RoHS3 compliant, -40°C to +85°C operating temperature, 1.8 V to 3.6 V supply.

Key Features

MSP430 CPUXV2 16-bit core, up to 20 MHz

512 KB Flash, 66 KB RAM

74 programmable I/O pins

16-channel 12-bit ADC

Dual 12-bit DAC

LCD controller support

DMA, PWM, watchdog timer, power-on reset, brown-out reset

Communication: I2C, SPI, UART/USART, IrDA

Internal oscillator; supports external crystals/clocks for precision

Supply voltage: 1.8 V to 3.6 V

Operating temperature: -40°C to +85°C (TA)

Series: MSP430F6xx; Base product number: MSP430F6459

RoHS3 compliant

Surface-mount VFBGA package (MicroStar Junior), compact 7 mm x 7 mm body

Key Advantages

Ultra-low-power architecture ideal for battery-powered and always-on systems

Large on-chip Flash and RAM for complex applications and robust firmware updates

Integrated LCD controller and rich analog (ADC/DAC) cut BOM and board space

Flexible connectivity (I2C, SPI, UART, IrDA) simplifies system integration

Small, fine-pitch BGA delivers high I/O count in minimal footprint

Wide supply range and industrial temperature rating for reliable field operation

Mature MSP430 ecosystem, tools, and libraries reduce time to market

Packaging

Type: Tape & Reel (TR) for automated SMT assembly

Package/Case: 113-ball VFBGA, TI MicroStar Junior (7 x 7 mm)

Supplier Device Package: 113-BGA MicroStar Junior (7 x 7)

Material: Lead-free, RoHS3 compliant SAC solder balls; epoxy mold; BT resin substrate

Size: Approx. 7 mm x 7 mm body; low-profile BGA height

Pin configuration: 113 balls; fine-pitch array with 74 usable GPIO. Refer to ball map in datasheet for full pinout.

Mounting: Surface Mount; JEDEC moisture sensitivity typical of BGA packages (follow storage and reflow guidelines)

Thermal characteristics: BGA provides good thermal spreading; design with solid ground planes and thermal vias for optimal heat dissipation

Electrical properties: ESD-protected I/O (per TI specs); stable operation from 1.8 V to 3.6 V; internal clock sources; supports external crystal for low-jitter timing

Lifecycle

Status: Active and widely supported in TI’s MSP430F6xx family; not nearing discontinuation based on current market data

Alternatives and close equivalents (check package/pin compatibility in datasheet before substituting):

- MSP430F6458 (similar family, different memory size)

- MSP430F6457 (similar family, smaller Flash)

- MSP430F6439 (similar core with reduced memory)

- MSP430F6639 (same CPUXV2, richer USB features; different peripheral mix)

- MSP430F5529 (same core class; different peripherals and package options)

- MSP430F5419A (CPUXV2 core; different analog/peripheral mix)

If you need exact drop-in replacements or lifecycle confirmation, please contact our sales team via the Y-IC website for the latest guidance

Key Application Areas

Battery-powered industrial controllers and data loggers

Handheld measurement instruments and portable test equipment

Smart sensors and edge nodes with rich analog acquisition

Building automation and HVAC controllers with LCD interfaces

Medical and wellness devices requiring low power and compact form factor

Consumer appliances and white goods with local display and control

Utility submetering and general metering (12-bit ADC/DAC for signal conditioning)

Wearables and fitness devices needing efficient MCU and LCD

Datasheet

Y-IC provides the most authoritative datasheet for MSP430F6459IZQWR on our product page. We recommend downloading the datasheet now for pin maps, electrical characteristics, timing, and full feature details.

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