Texas Instruments MSP430F5237IZQER

Mfr. Part

MSP430F5237IZQER

Manufacturer

Luminary Micro Texas Instruments

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Detailed Description

Ultra low power 16-bit MSP430 microcontroller with 64 KB embedded Flash and 8 KB SRAM in an 80-ball MicroStar Junior BGA 5 mm x 5 mm package. Runs up to 25 MHz on the MSP430 CPUxV2 core. Operates from 1.8 V to 3.6 V. Includes brown-out detect and reset, DMA, power-on reset, PWM, watchdog timer. Connectivity options include IrDA, SPI, UART USART and I2C. RoHS3 compliant. Surface-mount device. Tape and reel packaging. Base product number MSP430F5237

Key Features

16-bit MSP430 CPUxV2 core up to 25 MHz

64 KB Flash program memory

8 KB SRAM

53 general purpose I O lines

Peripherals include brown-out detect reset, DMA, POR, PWM, WDT

Connectivity includes IrDA, SPI, UART USART, I2C

Internal oscillator with option for external crystal for precision timing

Wide supply range 1.8 V to 3.6 V

Operating temperature range minus 40 C to plus 85 C ambient

Series MSP430F5xx

RoHS3 compliant

Compact 80-ball MicroStar Junior BGA 5 mm x 5 mm

Surface-mount assembly friendly

Supplier device package 80-BGA MicroStar Junior 5x5

Available quantity 2508 units as listed

Key Advantages

Very low power consumption ideal for battery powered products

Small 5 mm x 5 mm BGA saves PCB space while offering high I O count

Mature MSP430 ecosystem with robust tools, libraries, and community support

Integrated watchdog and brown-out reset improve system reliability

Flexible serial interfaces for easy sensor and peripheral integration

Wide voltage and temperature ranges for industrial use

TI quality and long field history reduce development risk

Packaging

Type Tape and Reel TR for automated SMT lines

Package case 80-ball MicroStar Junior BGA also noted as 80-VFBGA

Material Lead free mold compound and solder balls compliant with RoHS3

Size Body 5 mm x 5 mm ultra compact footprint

Mounting Surface mount BGA suitable for reflow soldering

Pin configuration 80 balls total with up to 53 configurable GPIO plus power and ground balls and dedicated interface balls per datasheet ball map

Thermal characteristics Designed for reliable operation from minus 40 C to plus 85 C ambient. BGA package provides good thermal paths through solder balls. Follow TI layout and reflow guidelines for thermal performance. Refer to datasheet for exact thermal parameters

Electrical properties Supply voltage 1.8 V to 3.6 V. Internal oscillator. Core up to 25 MHz. Flash 64 KB. SRAM 8 KB. Multiple serial interfaces. Brown-out detect, watchdog, and PWM

Lifecycle

Current status Generally active within the MSP430F5xx family. For the latest lifecycle and last-time-buy notices, check our website or contact Y-IC sales

Equivalent or alternative models within MSP430 family Depending on required memory, peripherals, and package

- MSP430F5235 similar family variant with different memory and features

- MSP430F5239 higher Flash option in the same family

- MSP430F5227 and MSP430F5217 lower memory options in the F52xx line

- MSP430FR5969 modern FRAM-based MSP430 alternative for lower power and frequent writes not pin compatible

Verify pin compatibility, package, and peripheral match in the datasheet before substitution

If no listed alternative meets your needs contact our sales team via the Y-IC website for tailored cross recommendations

Key Application Areas

Battery powered handheld instruments and data loggers

Industrial sensors and control nodes

HVAC and building automation controllers

Smart metering and utility submodules

Portable medical and wellness devices

Consumer electronics control boards and remote controls

Low power wireless or IrDA enabled devices with serial interfaces

Motor control and PWM driven actuators in compact systems

Datasheet

Y-IC hosts the most authoritative datasheet and technical documentation for this model. Download the MSP430F5237IZQER datasheet directly from this page to get complete specifications, pin maps, timing, and design guidelines

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