Intel EPF10K130EBC600-2X

Mfr. Part

EPF10K130EBC600-2X

Manufacturer

Intel (Programmable Solutions Group, formerly Altera). Y-IC is a quality distributor for Intel/Altera products and we will provide you with the best products and services.

Detailed Description

FLEX 10KE family FPGA for embedded and general logic use. Approx. 342k system gates, 6656 logic elements, 832 LABs/CLBs, 64 Kb on-chip RAM, and 424 user I/Os. 2.375 V to 2.625 V core supply, commercial temperature 0°C to 70°C. 600-ball BGA package, surface-mount, supplied in trays. Main Category: Integrated Circuits (ICs). Small Classification: Embedded - FPGAs (Field Programmable Gate Array). Base Product Number: EPF10K130. Current available quantity reference: 2693 units (subject to prior sale and confirmation).

Key Features

Series: FLEX-10KE

System gates (approx): 342,000

Logic elements/cells: 6,656

Logic array blocks (LABs/CLBs): 832

Total embedded RAM: 65,536 bits (64 Kb)

User I/O count: 424

Core supply voltage: 2.375 V to 2.625 V (typical 2.5 V)

Operating temperature: 0°C to 70°C (TA, commercial)

Package: 600-ball BGA (45 x 45), surface-mount

Configuration and debug: supports in-system programming and JTAG boundary-scan

Design flow: supported by classic Altera/Intel tools for 10KE (refer to datasheet and tool support notes)

Key Advantages

High I/O density (424 I/Os) for wide parallel interfaces and legacy bus connectivity

Stable, mature platform for sustaining and servicing existing designs

Predictable timing with simple, well-understood architecture and tools

Low core voltage operation around 2.5 V for reduced core power versus 3.3 V-era devices

In-system programmability simplifies updates and field service

Long track record in industrial and telecom equipment

Packaging

Type: Ball Grid Array (BGA), 600 balls

Body size: 45 x 45 (per supplier device package designation)

Material: standard molded plastic over organic substrate typical of FPGA BGAs

Mounting: surface-mount

Pin configuration: 600-ball array; detailed ball map, keep-out, and escape routing guidance in the package drawing

Thermal characteristics: commercial grade 0°C to 70°C; thermal dissipation depends on board copper, vias under package, airflow, and any heat spreader; consult datasheet for theta values and apply proper decoupling and thermal design

Electrical properties: core VCC 2.375–2.625 V; I/O standards and bank voltages per datasheet; JTAG and configuration pins required; follow datasheet decoupling, power sequencing (if any), and signal integrity recommendations

Shipping: Tray

Lifecycle

Status: The FLEX 10KE family is legacy and widely considered at or beyond end-of-life/NRND by Intel PSG. Availability is limited and date-code dependent.

Direct drop-in replacements: None for the 600-BGA footprint; any migration requires redesign and revalidation.

Alternative models (functional/modern replacements, not pin-compatible):

- Intel Cyclone 10 LP: 10CL016, 10CL025, 10CL040 (low power, cost-optimized)

- Intel Cyclone IV E: EP4CE22, EP4CE30 (mainstream low-cost FPGA family)

- Intel Cyclone II: EP2C20, EP2C35 (legacy but often used for migration from FLEX)

- Xilinx Spartan-6: XC6SLX25, XC6SLX45 (cost-sensitive legacy alternative)

- Lattice ECP5: LFE5U-25, LFE5U-45 (low-power, SERDES options in some variants)

- Microchip (Microsemi) IGLOO2/PolarFire for low power or higher reliability needs

If you need a one-to-one functional alternative list tailored to your design (logic count, RAM, I/O standards, speed, power), please contact our sales team via the Y-IC website for expert guidance and cross-references.

Key Application Areas

Industrial control and factory automation

Communications infrastructure and networking (legacy interfaces)

Test and measurement equipment

Medical electronics (non-life-supporting legacy platforms)

Consumer and set-top products from the FLEX era

Embedded controllers, bus bridging, and glue logic

Parallel display or memory interfaces and custom state machines

Datasheet

Y-IC hosts the most authoritative datasheet and technical resources for this product model on our product page. We recommend you download the datasheet on the current page for complete pinout, electrical, timing, configuration, and migration guidance.

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